| Patent application number | Description | Published |
|---|
| 20100009515 | LASER LIFT-OFF METHOD - The present invention discloses a laser lift-off method, which applies to lift off a transient substrate from an epitaxial layer grown on the transient substrate after a support substrate having an adhesion metal layer is bonded to the epitaxial layer. Firstly, the epitaxial layer is etched to define separation channels around each chip section, and the epitaxial layer between two separation channels is not etched but preserved to form a separation zone. Each laser illumination area only covers one illuminated chip section, the separation channels surrounding the illuminated chip section, and the separation zones surrounding the illuminated chip section. Thus, the adhesion metal layer on the separation channels is only heated once. Further, the outward stress generated by the illuminated chip section is counterbalanced by the outward stress generated by the illuminated separation zones, and the stress-induced structural damage on the chip section is reduced. | 01-14-2010 |
| 20100019222 | LOW-TEMPERATURE LED CHIP METAL BONDING LAYER - The present invention discloses a low-temperature light-emitting-diode chip metal bonding layer, which comprises: a first metal layer formed on the joint surface of an LED epitaxial layer and containing an ITO layer, a silver layer, a titanium layer, a platinum layer and a gold layer sequentially arranged from the LED epitaxial layer; and a second metal layer formed on the joint surface of the substrate and containing a titanium layer, a gold layer and an indium layer sequentially arranged from the substrate. Because of the low melting point of the indium layer, the bonding process of the substrate and the LED chip epitaxial layer can be undertaken at a relatively low temperature. Therefore, the present invention can prevent the film structures from being damaged by high temperature and can raise the yield of metal bonding LED chips. | 01-28-2010 |
| 20100065121 | PHOTOELECTRIC CONVERSION ELEMENT - A photoelectric conversion element comprises a solar-energy epitaxial layer, a bond layer and a LED epitaxial layer, which are stacked sequentially. The bond layer has a plurality of holes allowing light to pass. The solar-energy epitaxial layer receives light via the holes and generates electric energy, and an external secondary battery stores the electric energy. When environmental illumination disappears, the LED epitaxial layer is powered by the external secondary battery to emit light. When the photoelectric conversion element of the present invention applies to outdoor traffic signs, advertisement signboards and indicators, they can operate without external power supply. | 03-18-2010 |
| 20100127237 | HIGH BRIGHTNESS LIGHT EMITTING DIODE STRUCTURE AND A METHOD FOR FABRICATING THE SAME - The preset invention discloses a high-brightness LED structure and a method for fabricating the same. The LED structure of the present invention comprises a silicon substrate, a metal adhesion layer, a metal reflection layer, an N-type semiconductor layer, an active layer, and a P-type semiconductor layer, which are sequentially stacked. In the method of the present invention, the P-type semiconductor layer, active layer, N-type semiconductor layer and metal reflection layer are sequentially deposited on an N-type substrate; next, the metal reflection layer is bonded to the metal adhesion layer having been formed on the silicon substrate; then, the N-type substrate is removed. The present invention uses the silicon substrate to replace the light-absorptive GaAs substrate. Therefore, the present invention can promote light efficiency and enhance brightness. | 05-27-2010 |
| 20100279443 | LIGHT EMITTING DIODE AND FABRICATING METHOD THEREOF - A light emitting diode and its fabricating method are disclosed. A light emitting diode epitaxy structure is formed on a substrate, and then the light emitting diode epitaxy structure is etched to form a recess. The recess is then filled with a transparent dielectric material. An adhesive layer is utilized to adhere a conductive substrate and the light emitting diode epitaxy structure. Next, the substrate is removed. | 11-04-2010 |
