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Chih-Peng

Chih-Peng Chang, Pan-Chiao City TW

Patent application numberDescriptionPublished
20090147716Wireless Communication Receiver, System, and Method for Loading Firmware - A wireless communication system comprises a plurality of antennas, a plurality of tuners, a plurality of receiver ends, a bus, and a processor. Each of the tuners is connected to one of the antennas and one of the receiver ends. Each of the receiver ends has a corresponding address. A common address code is assigned to the corresponding addresses of part of receiver ends during firmware loading. The processor transmits the firmware to the part of the receiver ends via the bus based on the common address code. The corresponding addresses of the part of the receiver ends are converted back into unique address codes after the firmware is loaded.06-11-2009

Chih-Peng Chang, Taichung City TW

Patent application numberDescriptionPublished
20090317696Compound battery device having lithium battery and lead-acid battery - A compound battery device having a lithium battery and a lead-acid battery includes at least one lithium battery unit, at least one lead-acid battery unit and a control circuit. The lithium and lead-acid battery units are electrically connected in parallel and can have various combinations to meet actual demands of an output voltage. The control circuit is electrically connected to the lithium and lead-acid battery units separately and further comprises a voltage-boosting unit, a voltage-detecting unit, a lithium battery unit management unit and a logic control unit. Thereby, two complementary battery units are connected in parallel, with a control circuit to adjust a voltage thereof, allowing the two battery units to work together to make use of their respective advantages while providing mutual power support. Thus, the compound battery device is capable of more efficient power supply and higher loading, and effectively prevents over-discharge that shortens the battery service life.12-24-2009
20110037318Integrated battery device - An integrated battery device comprises two or more power battery sets, at least one DC-DC converter and a control unit. Each of the power battery sets has a battery level monitoring unit. The battery level monitoring unit is electrically connected with the control unit. Each of the power battery sets is electrically connected with a battery management system (BMS) and the DC-DC converter, and all of the power battery sets are electrically connected with the control unit in parallel. By the above configuration, the integrated battery device can completely exhaust the power battery sets without waste instead of affecting the service life of the power battery sets, so as to effectively improve durability of devices powered by the integrated battery device.02-17-2011
20110276290Device for counting and storing automatically number of times of usage of cell - A device for counting and storing automatically the number of times of usage of a cell is provided. The device essentially includes at least a battery, a current sensor, a microprocessor, a memory unit, and a communication interface. Electrical connection is provided between the microprocessor and other components. The microprocessor, coupled with the current sensor, determines a time to start or stop counting, adds up the calculated charging and discharging duration, and sends the total duration to the memory unit. An external device can be connected to the microprocessor via the communication interface for reading from the memory unit the accumulative total of the charging and discharging duration, and obtain the number of times of the full charging and the full discharging of the battery by formula-based conversion. The device enables users and maintenance technicians to understand the past usage of the cell, and provides reference for warranty maintenance.11-10-2011

Chih-Peng Chen, Hsin Chuan City TW

Patent application numberDescriptionPublished
20120111537FLEXIBLE HEAT DISSIPATION MODULE - A flexible heat dissipation module comprises at least one first heat pipe, one second heat pipe, and one flexible component. The first heat pipe includes a first heat absorbing end and a first heat dissipating end; the second heat pipe includes a second heat absorbing end and a second heat dissipating end. The flexible component includes a first joining part, a second joining part, and a flexible area formed in between the first and the second joining part, wherein the first and the second joining parts are attached respectively to the first heat dissipating end of the first heat pipe and the second heat absorbing end of the second heat pipe. With the disposition of flexible components, the flexible heat module according to the present invention has wider installation applicability and more flexible programmability to adapt to existing narrow device space.05-10-2012

Chih-Peng Hsu, Danshui Township TW

Patent application numberDescriptionPublished
20110019640MOBILE NODE, TAKE-OVER POINT OF ATTACHMENT AND HANDOVER METHOD THEREOF FOR USE IN A HETEROGENEOUS WIRELESS NETWORK SYSTEM - A mobile node (MN), a take-over point of attachment (PoA) and handover methods thereof for use in a heterogeneous wireless network system are provided. The heterogeneous wireless network system comprises a gateway, a first wireless network and a second wireless network which is heterogeneous to the first wireless network. The first wireless network and the second wireless network comprise the take-over PoA and an original PoA respectively. The take-over PoA and the original PoA have an overlapping service area. The MN receives a network service from the gateway via the original PoA so far. As soon as the MN enters the overlap service area, the MN builds a link with the take-over PoA in the data-link layer immediately so that the original PoA may handover to the take-over PoA without interrupting the network service.01-27-2011

Chih-Peng Hsu, Hsinchu TW

Patent application numberDescriptionPublished
20090321778FLIP-CHIP LIGHT EMITTING DIODE AND METHOD FOR FABRICATING THE SAME - A flip-chip light emitting diode includes a substrate, an LED chip and a plurality of conductive bumps. The substrate has at least one recess defined in the surface of the substrate, and at least a part of the conductive bumps is embedded the at least one recess. The LED chip is mounted on a surface of the substrate by a flip-chip mounting process. The conductive bumps are sandwiched between the substrate and the LED chip to bond and electrically connect the LED chip to the substrate.12-31-2009

Chih-Peng Liao, Chung-Ho City TW

Patent application numberDescriptionPublished
20080218140Control apparatus for cooler - The present invention discloses a control apparatus, which integrates the methods of PWM signal controlling and manual voltage regulating for controlling the cooler. The control apparatus includes a voltage stabilizer, a voltage regulator, and a switching unit. The voltage stabilizer connects to a CPU of a motherboard for receiving a PWM signal and outputting a stable PWM signal. The voltage regulator connects to the voltage stabilizer for regulating the voltage level of the stable PWM signal. The switching unit connects to the voltage stabilizer, the voltage regulator and the cooler for performing a switching operation between a first control mode and a second control mode. Moreover, the control apparatus controls the cooler via the stable PWM signal in the first control mode, and controls the cooler by regulating the voltage level of the stable PWM signal in the second control mode.09-11-2008
20080314559HEAT EXCHANGE STRUCTURE AND HEAT DISSIPATING APPARATUS HAVING THE SAME - A heat exchange structure is connected to a dual water cooling system and a heat dissipating apparatus has the heat exchange structure. The heat exchange structure includes a box as a main body, and the box includes a first cavity and a second cavity. The first cavity and the second cavity are interconnected with separate water cooling systems, wherein the first cavity includes a first chamber, and the first cavity has a water inlet pipeline and a water outlet pipeline, both interconnected to the first chamber. The second cavity includes a second chamber, and the second cavity has a water inlet pipeline and a water outlet pipeline, both interconnected to a second chamber. A heat conducting plate is disposed at a position that connects the first cavity and the second cavity for providing a heat conducting path of the first cavity and the second cavity.12-25-2008
20090194260Cooling apparatus for graphic cards - A cooling apparatus for graphic cards is used for two graphic cards that are disposed in parallel. There is a receiving space between the two graphic cards. The cooling apparatus for graphic cards includes a first base, a first cooler, a plurality of first heat pipes, a second base, a second cooler, and a plurality of second heat pipes. The first base is located on the first heat-emitting element of the first graphic card. One end of the first cooling pipe extends through the first base, and the second end of the first cooling pipe extends through the first cooler. The second base is located on the second heat-emitting element of the second graphic card. Thereby, the cooling apparatus for graphic cards can be applied to a plurality of graphic cards. The heat is simultaneously exhausted for both cards and the space is reduced.08-06-2009

Patent applications by Chih-Peng Liao, Chung-Ho City TW

Chih-Peng Lin, Taichung City TW

Patent application numberDescriptionPublished
20110219734Dust Collector - A lid-opening apparatus for a dust collector includes a base installed on a lid, a controller connected on the base, a cord defining a first end associated with a conduit and a second end associated with the frame, and a limiting member associated with the cord and between the first end and the second end of the cord. The controller can be rotated to a first position and a second position. While the controller is in the first position, the cord is in a loose condition, a flexible portion of the conduit is stretched, and the lid seals the container. While the controller is in the second position, the cord is in a tight condition, the flexible portion of the conduit shortens, and the lid leaves the container.09-15-2011

Chih-Peng Wang, Taipei TW

Patent application numberDescriptionPublished
20100245958TWO-ELEMENT F(THETA) LENS WITH SHORT FOCAL DISTANCE FOR LASER SCANNING UNIT - A two-element fθ lens with short focal distance for a laser scanning unit comprises a first lens and a second lens. The first lens has first and second optical surfaces, the second lens has third and fourth optical surfaces, and all the optical surfaces in a main scanning direction on the optical axis are aspherical surfaces. The fourth optical surface has an inflection point in SAG counted from the optical axis to peripheral portion and its paraxial portion is convex that is disposed on the polygon mirror side. The two-element fθ lens satisfies an optical condition of: 0.5429≦tan(β)≦1.2799, wherein β is a maximum effective window angle. The first and second lenses of the two-element fθ lens with short focal distance of the invention effectively reduces the distance from the polygon mirror to an imaging surface to achieve the purpose for reducing the volume of the laser scanning unit.09-30-2010
20100328788LENS HOLDER FOR STACKED LENS MODULE AND MANUFACTURING METHOD THEREOF - A lens holder of a stacked lens module and a manufacturing method thereof are revealed. A stacked lens submodule is used as a molded molding insert to be set into a mold cavity. The molding insert is aligned in the alignment fixture and the clamp of the mold by injection molding or press molding. After molding process, a lens module included the stacked lens submodule as well as the lens holder is formed. Thereby the manufacturing method of conventional lens assemblies or lens modules is improved. Moreover, the processes are simplified and the yield rate is increased. Furthermore, the molded lens module is packed into the lens more easily so that it is suitable to be applied to camera lenses, small lenses and mobile phone lenses.12-30-2010
20110026144LENS HOLDER FOR ALIGNMENT OF STACKED LENS MODULE AND MANUFACTURING METHOD THEREOF - A lens holder for alignment of a stacked lens module and a manufacturing method thereof are revealed. A stacked lens submodule disposed with at least one first alignment fixture is used as a molding insert to be set into a mold arranged with a second alignment fixture where the first alignment fixture connects with the second alignment fixture correspondingly. Then by injection or press molding of the embedded molding insert, a lens module with the lens holder for alignment is formed. Thereby the conventional manufacturing method of the lens molder is improved, the processes are simplified and the yield rate is increased. Moreover, the molded lens module is packed into the lens more easily so that it is suitable to be applied to camera lenses, small lenses and mobile phone lenses.02-03-2011
20110063722STACKED DISK-SHAPED OPTICAL LENS ARRAY, STACKED LENS MODULE AND METHOD OF MANUFACTURING THE SAME - A stacked disk-shaped optical lens array, a stacked lens module and a method of manufacturing the same are revealed. The stacked disk-shaped optical lens array is produced by at least tow disk-shaped optical lens arrays whose optical axes are aligned. After the optical axes of the stacked disk-shaped optical lens array being aligned by alignment fixtures, the stacked disk-shaped optical lens array is cut to produce a single stacked optical lens element. The optical lens element and optical elements required are mounted into a lens holder to form the stacked lens module. The stacked lens module produced by the method has optical lens elements whose axes are aligned precisely. The processes for manufacturing lens modules are simplified and the cost is reduced.03-17-2011
20110063723STACKED DISK-SHAPED OPTICAL LENS ARRAY, STACKED DISK-SHAPED LENS MODULE ARRAY AND METHOD OF MANUFACTURING THE SAME - A stacked disk-shaped optical lens array, a stacked disk-shaped lens module array and a method of manufacturing the same are revealed. The stacked disk-shaped optical lens array is produced by stacked disk-shaped optical lens modules whose optical axis is aligned. The stacked disk-shaped lens module array is produced by a stacked disk-shaped optical lens array whose optical axis is aligned by an alignment fixture, stacked and assembled with required optical element arrays. In the stacked disk-shaped lens module array produced by this method, the lens optical axis is aligned precisely. Moreover, the manufacturing process is simplified and the cost is reduced.03-17-2011
20110063730DISK-SHAPED OPTICAL LENS ARRAY AND MANUFACTURING METHOD THEREOF - A disk-shaped optical lens array produced by resin injection-compression molding and a manufacturing method thereof are revealed. The disk-shaped optical lens array has at least one alignment fixture a first surface and a second optical surface. The optical surfaces respectively including a plurality of optical zones corresponding to each other so as to form a plurality of optical lens elements arranged in an array and a plurality of single optical elements is produced after cutting. At least one disk-shaped optical lens array and other optical lens element/or two disk-shaped optical lens arrays are aligned with an optical axis of an optical lens element by the alignment fixture to form a stacked disk-shaped optical lens array. Therefore the manufacturing processes of the optical lens arrays are simplified with improved precision and reduced cost.03-17-2011
20110075264High SAG Optical Lens and Method for Fast Molding the Same - A high SAG optical lens and method for fast molding the same is disclosed, in which an optical lens is a single optical lens or an optical lens array formed by placing optical material between an upper mold and a lower mold for molding by heating and pressing processes; a formed rim is molded at the joint of the optical surface and the lens flange simultaneously. Therefore, it is convenient to fabricate the optical lens with high SAG and can eliminate the ghost phenomena effect occurring at the edge of the optical surface and the lens flange. Furthermore, since the feature of squeezing the melted optical material by the formed rim during the molding process, fast molding process can be successfully achieved.03-31-2011
20110194019OPTICAL IMAGING LENS AND ARRAY THEREOF - A single-piece optical imaging lens and an array thereof are revealed. The optical imaging lens includes a lens and an image sensor arranged at an image-side surface of the lens. The lens includes an object-side surface, an image-side surface, an optical area, and a non-optical area. The optical imaging lens satisfies the following conditions: BFL/TTL=0.55˜0.81, OH/OD=1.0˜3.6. TTL is total length from the object-side surface of the lens on the optical axis to the image sensor. BFL is back focal length of the imaging lens. OD is the distance between an object on the optical axis and the object-side surface of the lens. OH is the largest height of an object vertical to the optical axis of OD. The single-piece optical imaging lens array is used to produce a plurality of single-piece optical imaging lenses by cutting.08-11-2011