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Chih-Ming Huang
Chih-Ming Huang, Tu-Cheng TW
| Patent application number | Description | Published |
|---|---|---|
| 20110031012 | PROTECTING APPARATUS FOR SOLID STATE DRIVE - A protecting apparatus includes a receiving box for receiving a solid state drive, and a cover pivotably connected to the receiving box. The receiving box includes a base. Two feet protrude down from a bottom of the base for fixing the receiving box to a motherboard. A through hole is defined in the base for allowing a connector of the motherboard to extend into the receiving box to electrically connect to the solid state drive. The protecting apparatus can protect the solid state drive from knock and loose. | 02-10-2011 |
| 20110053485 | SERVER RACK WITH BAFFLE DEVICE - A server rack for receiving a plurality of modules includes two parallel side plates, a clapboard, and a baffle device. The clapboard is disposed between the two side plates substantially perpendicular to the two side plates to form a receiving space. The receiving space defines an air inlet and a module entry opposite to the air inlet. The baffle device is received in the receiving space. The baffle device includes two resisting assemblies installed on the two side plates oppositely. Each resisting assembly includes a baffle. The baffle includes a securing portion and a latching portion opposite to the securing portion. The securing portion of each baffle is rotatably secured on the corresponding side plate. A total length of the two baffles is larger than the width of the receiving space. The two baffles are inclined toward the air inlet. The two latching portions of the two baffles are latched facing the air inlet, to cover the module entry when no module is received in the receiving space. | 03-03-2011 |
Chih-Ming Huang, Chu Bei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100283617 | DIAPER ALARM SYSTEM - A diaper alarm system, comprising: at least a diaper, and an alarm system. Wherein, in each diaper is provided with a sensor and a transmitter. Said sensor and said transmitter are located inside said diaper, said sensor is printed on a urine-gathering region and an excrement-gathering region inside said diaper, such that the sensor is connected to the transmitter wirelessly, thus said sensor is able to utilize said transmitter to send out detection signals. Said alarm system includes a receiver, which is connected to said transmitter through transmission of telecommunication signals. On receiving a detection signal by said receiver, said alarm system will determine whether to send out an alarm based on said detection signal. | 11-11-2010 |
Chih-Ming Huang, Hsin-Chu TW
| Patent application number | Description | Published |
|---|---|---|
| 20090282673 | Device for locking lens - A lens-fastening apparatus for assembling a voice coil motor of a camera module is provided. The voice coil motor has a lens holder. The lens-fastening apparatus includes a guiding plate; a rotation stopping jig having a central and a lateral portions, disposed on the guiding plate, and fit with the lens holder for stopping a rotation of the lens holder; a focusing ring for rotating the lens; a first pressing device pressing the central portion of the rotation stopping jig to fasten the rotation stopping jig on the guiding plate; and a second pressing device pressing the lateral portion of the rotation stopping jig. | 11-19-2009 |
Chih-Ming Huang, Hsinchu City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090284850 | DEVICE AND METHOD FOR LOCKING LENS - A device and a method for locking lens in a lens holder are provided, wherein the lens is configured in a voice-coil motor (VCM) of a camera module of a cell phone and the VCM has a lens holder for a lens being fixed inside. The device includes a circumgyration stop instrument having a bottom surface for urging against the top surface of the lens holder for preventing a lateral stress and a lateral movement from occurring on the lens holder while the circumgyration stopping unit is coupled with the lens holder. | 11-19-2009 |
| 20090284851 | DEVICE AND METHOD FOR LOCKING LENS - A device for locking lens and a method for the same are provided. The device is used in a voice-coil motor of a photographing module of a cell phone. The voice-coil motor has a lens-stand for a lens being turned to a locking depth inside. The device includes a circumgyration-stop instrument having a first sustaining surface, and a focusing ring having a turning end. A turn-locking length of the turning end is equal to the locking depth inside. The device includes a circumgyration-stop preventing a pressure being persisted to apply on the lens as the focusing ring finishes the turn of the lens. The first turn-stop surface props the first sustaining surface as the focusing ring is turned to an extremity of the turn-locking length. The focusing ring accordingly escapes the circumgyration-stop instrument for finishing the focusing of the lens in the lens-stand. | 11-19-2009 |
Chih-Ming Huang, Taipei Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20090103913 | MULTIFUNCTIONAL SUPPORTING FRAME FOR A WEB CAMERA - A multifunctional supporting frame for a web camera, comprises a movable supporting clamping seat having a hollow rectangular receiving chamber; the rectangular receiving chamber being formed by an upper L shape sheet, a middle U shape sheet, and a lower enclosed rectangular sheet; one lateral side of the L shape sheet being extended with a sheet plate; at least one guide post being extended from one surface of the sheet plate; the guide posts being combined with springs so as to be formed as a telescopic structure which is adjustable to have a desire width for clamping an object; and a bendable shaft seat formed by an upper U shape plate and a lower U shape plate which are pivotally engaged. A lens set is installed above the movable supporting clamping seat by using a lens set pin seat. | 04-23-2009 |
Chih-Ming Huang, Hsinchu Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20080230913 | Stackable semiconductor device and fabrication method thereof - The invention provides a stackable semiconductor device and a fabrication method thereof, including providing a wafer having a plurality of dies mounted thereon, both the die and the wafer having an active surface and a non-active surface opposing one another respectively, wherein each die has a plurality of solder pads formed on the active surface thereof and a groove formed between adjacent solder pads to form a first metal layer therein that is electrically connected to the solder pads; subsequently thinning the non-active surface of the wafer to where the grooves are located to expose the first metal layer therefrom, and forming a second metal layer on the non-active surface of the wafer for electrically connecting with the first metal layer; and separating the dies to form a plurality of stackable semiconductor devices. Thereby, the first and second metal layers formed on the active surface and the non-active surface of the semiconductor device can be stacked and connected to constitute a multi-die stack structure, thereby increasing integration without increasing the area of the stacked dies. Further, the problems known in the prior art of poor electrical connection, complicated manufacturing process and increased cost as a result of using wire bonding and TSV can be avoided. | 09-25-2008 |
| 20080251937 | Stackable semiconductor device and manufacturing method thereof - A stackable semiconductor device and a manufacturing method thereof are disclosed. The method includes providing a wafer comprised of a plurality of chips, wherein a plurality of solder pads are formed on the active surface of each chip, and a plurality of grooves are formed between the solder pads of any two adjacent ones of the chips; forming a dielectric layer on regions between the solder pads of any two adjacent ones of the chips ; forming a metal layer on the dielectric layer electrically connected to the solder pads and forming a connective layer on the metal layer, wherein the width of the connective layer is smaller than that of the metal layer; cutting along the grooves to break off the electrical connection between adjacent chips; thinning the non-active surface of the wafer to the extent that the metal layer is exposed from the wafer; and separating the chips to form a plurality of stackable semiconductor devices. Accordingly, a multi-chip stack structure can be obtained by stacking and electrically connecting a plurality of semiconductor devices through the electrical connection between the connective layer of a semiconductor device and the metal layer of another semiconductor device, thereby effectively integrating more chips without having to increase the stacking area, and further the problems of poor electrical connection, complicated manufacturing processes and high costs known in the prior art can be avoided. | 10-16-2008 |
| 20090014860 | Multi-chip stack structure and fabricating method thereof - A multi-chip stack structure and a manufacturing method thereof are provided. The fabrication method includes the steps of: providing a chip carrier having a first surface and a second surface opposing thereto and at least a first chip and a second chip mounted on the first surface; electrically connecting the chips to the chip carrier by a plurality of bonding wires; and stacking at least a third chip on the first and second chips by a film deposed therebetween, wherein the third chip is stepwise stacked on the first chip and at least a part of the bonding wire connected to the second chip is covered by the film, and electrically connecting the third chip and the chip carrier by a bonding wire, thereby enabling a plurality of chips to be stacked on the chip carrier to enhance the electrical performance of electronic products. | 01-15-2009 |