| Patent application number | Description | Published |
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| 20090201639 | CHASSIS OF PORTABLE ELECTRONIC APPARATUS - A chassis of a portable electronic apparatus includes a heat sink assembly disposed therein and carries a keyboard on the top. The chassis has an air inlet and an air outlet on a first surface on the side opposite to the keyboard, which are respectively corresponding to an intake end and an exhaust end of the heat sink assembly. The air outlet extends from the first surface to a second surface connected to the first surface, and the second surface has an opening for disposing communication connectors, so as to adequately the heat sink assembly and the communication connectors. | 08-13-2009 |
| 20090201646 | RETAINING DEVICE - A retaining device is used to press a heat conducting plate to in contact with a heat-generating element disposed on a circuit board. The retaining device includes a bracket, a plurality of elastic members, and a plurality of fasteners. The bracket is disposed on a side surface of the circuit board while the bracket and the heat conducting plate are spaced by the circuit board. One end of the elastic members is disposed on the bracket. The fasteners pass through the heat conducting plate, the circuit board, and the bracket in sequence, so as to be fixed to the elastic members, such that the heat conducting plate is pressed by the elastic members to be continuously contact with the heat-generating element. | 08-13-2009 |
| 20090211737 | HEATSINK MODULE HAVING FIN ASSEMBLY STRUCTURE CORRESPONDING TO HEAT PIPE - A heatsink module includes a fan, a fin assembly and a heat pipe. The fan generates an airflow. The heat pipe has a heat absorbing section, a curved section, and a heat dissipating section. The curved section and the heat dissipating section are disposed at a side of the fan to accept the airflow. The fin assembly includes a plurality of heat sink fins, and the heat sink fins are stacked to form a plurality of air ducts to accept the airflow. The heat sink fins each have a penetrating opening corresponding to the curved section and the heat dissipating section. The penetrating openings are combined into a penetrating channel to contact with the curved section and the heat dissipating section. | 08-27-2009 |
| 20110122915 | METHOD FOR TESTING HEAT PIPES - A method for testing heat pipes includes the following steps. A plurality of bar-shaped heat pipes having the same size is provided, and the heat pipes are deformed. The deformed heat pipes are placed in a temperature regulator, such that a temperature of the heat pipes is periodically changed between a first temperature and a second temperature. The heat pipes are then taken out of the temperature regulator. One end of each heat pipe is maintained at a third temperature by a thermostatic device, and a heat pipe temperature difference of two opposite ends of the heat pipe is measured. The heat pipes having the heat pipe temperature difference greater than a standard temperature difference in the heat pipes are marked. | 05-26-2011 |
| Patent application number | Description | Published |
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| 20080198550 | HEAT SINK MODULE FOR DUAL HEAT SOURCES - A heatsink module for dual heat sources for dissipating heat generated by a first and a second heat-generating element disposed on a circuit board is provided. The heatsink module includes a first heat-conducting plate, a second heat-conducting plate, a fixing member, a heat pipe, and a pressing flat spring. The first and second heat-conducting plates contact the first and second heat-generating elements respectively. The fixing member when fixed to the circuit board presses the second heat-conducting plate against the second heat-generating element. One end of the pressing flat spring is under the traction of the fixing member fixed to the circuit board, and presses the first heat-conducting plate against the first heat-generating element. The fixing member and the first heat-conducting plate then clamp the heat pipe, so as to conduct the heat generated by the first and second heat-generating elements to the heat pipe via the connecting elements. | 08-21-2008 |
| 20090016020 | HEAT-DISSIPATING MODULE AND ELECTRONIC APPARATUS - A heat-dissipating module suitable for dissipating heat generated by a heat-generating element is provided. The heat-dissipating module includes a first heat-conducting plate, a first heat-dissipating tube, and a fan. The first heat-conducting plate is thermally coupled to the heat-generating element. The first heat-dissipating tube has a first opening and a second opening opposite to the first opening. The first heat-conducting plate is connected to the first heat-dissipating tube and located at an outside of the first heat-dissipating tube. The fan is disposed adjacent to the first opening and corresponding to first opening. The fan is adapted for generating an air current flowing in the first heat-dissipating tube. The heat-dissipating module can transfer the heat generated by the heat-generating element during operation to an external environment. | 01-15-2009 |
| 20090034193 | HEAT-DISSIPATING MODULE - A heat-dissipating module adapted for cooling a heat-generating element is provided. The heat-dissipating module includes a plurality of fins, a fan and a heat pipe. The fan is adapted for generating an air current. Each fin has an edge facing the fan. The edges are located on a folded surface. The air current first passes through the folded surface and then passes by the fins. The heat pipe includes a first end thermally coupled to the heat-generating element, and a second end thermally coupled to the fins. | 02-05-2009 |
| 20090034195 | HEAT-DISSIPATING MODULE - A heat-dissipating module dissipating heat generated by a heat-generating element includes a plurality of fins, a fan generating an air current and a heat pipe. Each fin has a first edge facing the fan and a second edge facing the fan. The first edges are located on a first surface. The second edges are located on a second surface not coinciding with the first surface. The air current passing through the first and second surfaces passes by the fins. A first end of the heat pipe is thermally coupled to the heat-generating element. A second end of the heat pipe is thermally coupled to the fins. | 02-05-2009 |
| 20090034196 | HEAT-DISSIPATING MODULE - A heat-dissipating module adapted for cooling a heat-generating element is provided. The heat-dissipating module includes a fin module, a fan and a heat pipe. The fan is adapted for generating an air current. The fin module includes a plurality of first fins and a plurality of second fins. Each first fin includes a first edge facing the fan. The first edges are located on a first surface. Each second fin includes a second edge facing the fan. The second edges are located on a second surface not coinciding with the first surface. The air current passes through the first surface and the second surface and then passes by the first fins and the second fins. The heat pipe includes a first end thermally coupled to the heat-generating element, and a second end thermally coupled to the first fins and the second fins. | 02-05-2009 |
| 20090056925 | HEAT DISSIPATION MODULE - A heat dissipation module for being assembled to a circuit board with a first heat-generating element and a second heat-generating element is provided. A heat generation rate of the first heat-generating element is higher than that of the second heat-generating element. The heat dissipation module includes a heat-transferring connection element, a cooling device, a first heat-transferring plate and a second heat-transferring plate. The heat-transferring connection element has a first part and a second part. The cooling device connects to the first part. The first heat-transferring plate is connected between the first heat-generating element and the second part. The second heat-transferring plate has a third part and a fourth part. The second part is connected between the first heat-transferring plate and the third part. The fourth part is connected to the second heat-generating element. The thermal conductivity of the first heat-transferring plate is higher than that of the second heat-transferring plate. | 03-05-2009 |
