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Chih-Hung Wu

Chih-Hung Wu, Longtan Shiang TW

Patent application numberDescriptionPublished
20080286946Wafer dicing method - A wafer stacked on a mounting layer is safely diced. The mounting layer has holes partially corresponding to chips on the wafer. Thus, chips obtained after dicing the wafer can be safely removed from the mounting tape. An amount of the mounting tape used can be reduced. And a production cost can be lowered as well.11-20-2008
20100212724Hollow light-collecting device - A light-collecting device has a hollow at center. Three layers are sequentially pasted on and around the hollow. The device collects light efficiently with different materials of the layers. And the device has a long life of use, is environmentally friendly and is easily mass-produced.08-26-2010
20100238573Light-collection apparatus - A light-collection apparatus includes a core, a first layer and a second layer. The core is made in the form of a frustum and used as a solid light-passing zone. The first layer is provided on the core. The second layer is provided on the first layer. Therefore, the light-collection apparatus is excellent in collecting light, easily mass-produced at a low cost, durable and environmentally friendly.09-23-2010
20100282311Solar Cell Device Having Low Electrical and Thermal Impedance - A solar cell is fabricated. Its light-absorbing part is close to a heat-diffusing device. Thus, the solar cell has low electrical and thermal Impedance. The solar cell has a strong structure, high efficiency and is fit for mass production.11-11-2010
20100283153Ohmic Contact Having Silver Material - An ohmic contact is fabricated. The ohmic contact has low electric resistivity and high thermal conductivity. The materials for fabricating the ohmic contact include silver. Thus, equipments for fabricating the ohmic contact are compatible to modern generally used equipments.11-11-2010
20110023953Solar Cell Device - A solar cell is provided Its light absorption area is close to a heat-dissipation apparatus. Thus, an excellent dissipation efficiency is obtained. The solar cell has a strong structure, an easy fabrication method and a low cost. Thus, the present invention is fit for mass-production.02-03-2011

Patent applications by Chih-Hung Wu, Longtan Shiang TW

Chih-Hung Wu, Taoyuan County TW

Patent application numberDescriptionPublished
20080284082Wafer clamp having changeable supporting part - A wafer clamp according to the present invention always firmly clamps a wafer. A supporting arm of the wafer clamp will be replaced with a different one according to the wafer size. Moreover, with a larger area of the supporting arm, a wear resistance and a smoothness of the wafer is improved. Besides, the wafer clamp stops the wafer from slipping. Hence, the present invention has a simple structure, a good practicality and a wide application11-20-2008
20100319168Clip for water - A clip includes a beam for contact with a face of a wafer, a first oblique section and a second oblique section for contact with an opposite face of the wafer. The beam includes a supporting section formed thereon. The first oblique section extends from the beam so that there is an acute angle between the first oblique section and the beam. The second oblique section extends from the first oblique section so that there is an acute angle between the first and second oblique sections and that there is an acute angle between a plane in which the supporting section lies.12-23-2010

Chih-Hung Wu, Taoyuan TW

Patent application numberDescriptionPublished
20100283179Method of Fabricating Metal Nitrogen Oxide Thin Film Structure - A TiON, TaON or ZrON thin film is fabricated through an easy process. The film is corrosion resistant, electric conductive and decorative. The process uses no chloride (Cl) and so is environmental protected. The present disclosure is fit for mass production.11-11-2010

Patent applications by Chih-Hung Wu, Taoyuan TW

Chih-Hung Wu, Longtan Shaing TW

Patent application numberDescriptionPublished
20100215866Method for coating an electrode on a wafer - There is disclosed a method for coating an electrode on a wafer. Firstly, there is provided a wafer. Secondly, a metal area is defined in an upper surface of the wafer. Thirdly, the metal area is roughened via etching. Finally, an electrode is coated on the metal area via deposition.08-26-2010

Chih-Hung Wu, Taichung City TW

Patent application numberDescriptionPublished
20120118113RATCHET WRENCH - A ratchet wrench includes a handle and a wrench head unit having head body rotatably mounted on a head portion of the handle, a plurality of tubular coupling member angularly displaced from each other, and a plurality of driving heads, each coupled with the respective tubular coupling member by means of a ratchet unit. By virtue of the ratchet unit, the driving head can be selectively turned in a clockwise direction, a counterclockwise direction, or both thereof. By virtue of the driving heads, the ratchet wrench can be used to turn a variety of fasteners.05-17-2012