Patent application number | Description | Published |
20100096658 | Structure of Light Emitting Diode - An improved structure of light emitting diode comprises that a copper clad laminate is made with a rectangular type slot thereon and a ring type slot on the outside boundary to enclose the rectangular type slot, while side wall of the slot form a natural guide angle with the surface of the copper clad laminate to further form an island type platform; a conductor being made between rectangular type slot and ring type slot is penetrated through the copper clad laminate and externally enclosed by the insulator thereby allowing conductor to be insulated; a light emitting diode chip is installed thereon; a fluorescent glue is optionally installed on the light emitting diode with a covering range smaller than the natural guiding angle of the rectangular type slot, wherein the copper clad laminate is installed on the printed circuit board. | 04-22-2010 |
20100097803 | Multiple Light Source Surface Packaging Structure - The preferred embodiment the invention proposes pertains to a light source system structure, claimticularly referring to a multiple light-source source packaging structure, which is comprised of a surface wrapped with a multiple number of packagers, and inside the packagers is a placement space, and the surface of the packager is of a smooth surface; a micro-Fresnel lens unit, which is mounted in the placement space, and the micro-Fresnel lens unit is comprised of a multiple number of encircling micro-Fresnel lenses, with a concave slot located at the center of the encircling micro-Fresnel lens unit and a light source mounted beneath the concave slot, where the light created from the light source can be deflected and projected through the micro-Fresnel lens unit, through which to further control the angle of each light beam, together with a circuit control switch linked to the light source to further control the distance of light projection from the multiple number of packagers, enabling the distance of projection to be controlled by the varied micro-Fresnel lens unit within the packager. | 04-22-2010 |
20100259937 | Candle Lighting Type Reflective Lampshade - A candle lighting type reflective lampshade comprises a lampshade main body being made with a reverse cone body on the upper half thereof and a cover layer on the inner cone surface thereof, wherein the cone surface forming a pair of symmetrical parabolic curves includes a ring type aperture on the top thereof thereby allowing the underside light source to achieve secondary full reflection; the base of lampshade main body comprises a plurality of inclined surfaces being ringly peripherally installed thereon and being installed with a plurality of lamp source bases below the inclined surfaces, while the light source is effectively controlled by the lamp source base to beam the light on the cone top portion of the reverse cone body so as to fully reflect each light beam and to achieve uniform dispersion of the light source. | 10-14-2010 |
20100290232 | Non-axisymmetric Optical Device - The present invention is an optical device that is not axially symmetric; comprising of a lampshade at least; wherein, an optical unit mounted to the transverse of lampshade, an illuminant mounted inside the lampshade where corresponding to the center of inner lateral to the optical unit; meanwhile, the optical unit is geometrically structured in a non-axisummetric configuration while the optical unit is fitted a reflector with plurality of cascades along the ring at the external lateral; thus, a refraction or reflection against the light emitted from the illuminant can be performed when permeating through the optical unit that beams a strip light pattern achievable. | 11-18-2010 |
20100290235 | Light Condensing Structure for Illuminating Device - A light condensing structure for illuminating device includes a lamp shade; an optical unit located at an open end of the lamp shade and provided on one of two opposite sides with a plurality of concentric annular light condensing sections, each of which has an upward tapered cross-sectional shape; and a light-emitting element mounted in the lamp shade to face toward the other side of the optical unit. Divergent lights from the light-emitting element can be totally reflected (refracted) by the light condensing sections of the optical unit, so that an increased illuminating brightness can be achieved for the illuminating device. | 11-18-2010 |
Patent application number | Description | Published |
20100252852 | COOLING BLOCK ASSEMBLY AND LED INCLUDING THE COOLING BLOCK - An LED includes a cooling block, an LED chip, two insulating layers, two electrically conductive layers and two gold wires. According to the invention, two open trenches are arranged by opening on the cooling block; the LED chip is fixed on a surface of the cooling block; the insulating layers are plated on inner walls of the trenches; the electrically conductive layers are plated on the insulating layers and are insulated from the cooling block; the gold wires are electrically conducted to the electrically conductive layers and the LED chip; since the insulating layers are only plated on parts, where the cooling block contacts the electrically conductive layers, the other parts of the cooling block are exposed, such that the cooling area is increased and the cooling performance is promoted; in addition, the invention is further to provide a cooling block assembly constituted by these cooling blocks. | 10-07-2010 |
20110216555 | LED DEVICE FOR BACKLIGHT MODULE - A light emitting diode (LED) device applied to a backlight module includes a substrate, a plurality of sub-substrates, a plurality of light emitting chips, and a plurality of package lenses. The sub-substrates are installed on the substrate, and the light emitting chips are installed on the sub-substrates respectively. The package lenses are installed on the light emitting chips respectively, and each package lens is in a solid semi-elliptical shape and includes a long axis and a short axis perpendicular to the long axis. | 09-08-2011 |
20120032194 | LIGHTING MODULE WITH HIGH COLOR RENDING PROPERTY - A lighting module with high rending property includes a substrate, a plurality of first light emitting diode (LED) chips, a plurality of second LED chips and a wavelength conversion layer. The first LED chips are deposed on the substrate and electrically connected to the substrate. The second LED chips are deposed on the substrate and electrically connected to the substrate. The wavelength conversion layer seals the first LED chips and the second LED chips. The light emitted from the LED chips and the light emitted from the wavelength conversion layer caused by an excitation by the LED chips are mixing to form warm white light with high color rending property. The number ratio of the first LED chips to the second LED chips deposed on the substrate is 2:1. | 02-09-2012 |
Patent application number | Description | Published |
20080295888 | CONCENTRATION PHOTOVOLTAIC MODULE - A concentration photovoltaic module includes a substrate, a first electrode, a second electrode, a solar cell, at least one electrical connecting element and a frame. The first electrode and the second electrode are disposed in different predetermined positions of the substrate to form a first electrode and a second electrode, respectively. The solar cell is disposed on the first electrode. The electrical connecting element electrically interconnects the second electrode and the solar cell. The frame straddles on the substrate, wherein the solar cell is located in the frame. | 12-04-2008 |
20090053487 | CERAMIC CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A ceramic circuit board and a manufacturing method thereof are disclosed. The method includes the steps of providing a first pre-mold plate and a first ceramic thin plate, stacking the first ceramic thin plate and the first pre-mold plate, and co-firing the first ceramic thin plate and the first pre-mold plate to commonly form the ceramic circuit board. | 02-26-2009 |
20090053531 | MULTI-LAYER CERAMIC SUBSTRATE WITH EMBEDDED CAVITY AND MANUFACTURING METHOD THEREOF - A multi-layer ceramic substrate with an embedded cavity and a manufacturing method thereof are disclosed. The method includes the steps of: providing at least one ceramic thin plate and at least one ceramic pre-mold plate having a surface formed with a conductive layer; stacking the ceramic thin plate and the ceramic pre-mold plate to form a stacked structure with at least one embedded cavity; and sintering the stacked structure. | 02-26-2009 |
20090091020 | CO-FIRED CERAMIC MODULE - A co-fired ceramic module includes a ceramic substrate and at least one heat-emitting device. The ceramic substrate has at least one high thermal conductivity material. The heat-emitting device is disposed on the ceramic substrate. The substrate further includes a cavity and the heat-emitting device is disposed in the cavity. | 04-09-2009 |