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Chih-Hung Hsu
Chih-Hung Hsu, Taipei County TW
| Patent application number | Description | Published |
|---|---|---|
| 20110062567 | LEADFRAME AND CHIP PACKAGE - A leadframe including a die pad, leads, an outer frame, connecting bars and grounding bars is provided. Each of the grounding bars is suspended between two connecting bars by being connected with branches of the two connecting bars, such that the grounding bars are spaced by the die pad. The leadframe and the chip package of the present invention can permit a great design variation. | 03-17-2011 |
| 20110079806 | LIGHT-EMITTING DIODE STRUCTURE - A light-emitting diode structure is provided. The light-emitting diode structure includes a light-emitting diode chip, a lead frame for electrically connecting and supporting the light-emitting diode chip, and a lens covering the light-emitting diode chip and to partially cover the lead frame. A recess disposed on the upper portion of the lens has a ladder-like inner wall formed of an upper inclined wall portion, a lower inclined wall portion, and a connecting wall portion connected to the upper and lower inclined wall portions. The slope of the upper inclined wall portion is greater than that of the lower inclined wall portion, and the slope of the connecting wall portion is greater than the upper and lower inclined wall portions. | 04-07-2011 |
| 20110081736 | METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE DEVICES - A method for manufacturing light-emitting diode devices. Multiple metal frames are provided. The metal frames are adjacent to each other and are arranged on a same plane. Each metal frame includes a first connection pin and a second connection pin. A light-emitting diode chip is disposed on and electrically connected to each metal frame. The metal frames are respectively bent, enabling the adjacent metal frames to separate from each other. A moldboard formed with a plurality of mold cavities is provided. The bent metal frames are respectively disposed in the mold cavities, locating each light-emitting diode chip in each mold cavity. The mold cavities are respectively filled with package gel. The package gel filled in each mold cavity covers each light-emitting diode chip. The package gel is solidified. The mold cavities are separated from the package gel. The metal frames are separated from each other, forming the light-emitting diode devices. | 04-07-2011 |
Chih-Hung Hsu, Taoyuan TW
| Patent application number | Description | Published |
|---|---|---|
| 20100220575 | OPTICAL PICKUP HEAD - An optical pickup head includes a first light source, a second light source, a base, a light adjusting unit, and a light guiding unit. The first light source emits a first wavelength light beam to read a first data density optical storage medium. The second light source emits a second wavelength light beam to read a second data density optical storage medium. The base includes at least a slant surface for reflecting the first wavelength light beam and the second wavelength light beam, so that the first wavelength light beam and the second wavelength light beam are parallel with each other. The light adjusting unit adjusts the first wavelength light beam and the second wavelength light beam to the same optical axis. The light guiding unit guides the first wavelength light beam and the second wavelength light beam to the first data density optical storage medium or the second data density optical storage medium. | 09-02-2010 |
| 20110049554 | PACKAGE BASE STRUCTURE AND MANUFACTURING METHOD THEREOF - A package base structure for packaging a light-emitting element and a related manufacturing process are provided. The package base structure includes a semiconductor substrate having a top surface, a receiving space in the top surface and defined by slant surfaces, and a micro diffractive optical element on one of the slant surfaces. To produce the package base structure, a first etching mask with a first etching window is formed on the top surface. The etching window has a sidewall oriented at a bias angle with respect to a specific equivalent crystallographic orientation of the semiconductor substrate. Then, a selective anisotropic etching procedure is performed through the first etching window to form the slant surfaces on the semiconductor substrate. Afterwards, the micro diffractive optical element is formed on the slant surface for collimating or focusing a light beam emitted from the light-emitting element. | 03-03-2011 |
Chih-Hung Hsu, Taipei Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20100187562 | LIGHT-EMITTING DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A light-emitting device package structure includes a leadframe, a light-emitting device disposed on the leadframe, a plurality of wires electrically connecting the leadframe and the light-emitting device, and an encapsulant covering the light-emitting device, the wires and a part of the leadframe. The encapsulant has a gas space therein, and the gas space is disposed on the light-emitting device, wherein the gas space includes at least one gas. | 07-29-2010 |
Chih-Hung Hsu, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20100148211 | LIGHT EMITTING DIODE PACKAGE STRUCTURE - A light emitting diode (LED) package structure including a leadframe, a housing, a LED chip and a light-transmissive encapsulant is provided. The leadframe has a first electrode and a second electrode separated from each other. The housing wraps the first electrode and the second electrode and includes a recess having a bottom and a sidewall. The bottom of the recess has a cover layer covering the leadframe and having an opening exposing an end of the first electrode, an end of the second electrode and a spacer disposed therebetween and connected thereto wherein the spacer, the end of the first electrode and the end of the second electrode are substantially coplanar. The LED chip is disposed in the recess and electrically connected to leadframe. The light-transmissive encapsulant is filled in the recess. | 06-17-2010 |
Chih-Hung Hsu, Tu Chen City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090134423 | LIGHT EMITTING DIODE DEVICE - A light emitting diode (LED) device comprises a first lead frame, a second lead frame, a LED die and at least one bump. The LED die is fixed on and electrically connected to the first lead frame. The second lead frame separated from the first lead frame with a distance is connected to the LED die. The bump disposed on at least one of the first lead frame and the second lead frame to identify a gripping space for allowing an electronic element inserted or gripped therein. | 05-28-2009 |
| 20090218664 | STRUCTURE OF A LEAD-FRAME MATRIX OF PHOTOELECTRON DEVICES - A structure of a lead-frame matrix of photoelectron devices is provided. The lead-frame matrix is used to fabricate a first lead-frame array and a second lead-frame array. In the structure of the lead-frame matrix of the photoelectron devices, pins of the first lead-frame array and pins of the second lead-frame array are alternatively inserted. | 09-03-2009 |
| 20100130087 | LED LAMP MANUFACTURING METHOD - An improved LED lamp manufacturing method is described. An LED lamp bulb and a pair of electrical cables are provided. The LED lamp bulb is electrically coupled with the pair of electrical cables. A main body is provided to enclose the LED lamp bulb, wherein the main body consists of a first plastic member and a second plastic member. The first plastic member is coupled with the second plastic member. | 05-27-2010 |
Chih-Hung Hsu, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20080230882 | CHIP PACKAGE STRUCTURE - A chip package structure includes a die pad of which at least a notch is formed on at least one side and opposite to a mold gate. The die pad contributes to accelerating the injection of an encapsulating material, so as to exhaust the air in the mold in time, before the encapsulating material solidifies during the molding step, thereby overcoming or at least improving the problem of defects such as air bubbles in the encapsulation. | 09-25-2008 |
| 20080230887 | SEMICONDUCTOR PACKAGE AND THE METHOD OF MAKING THE SAME - The present invention relates to semiconductor package and the method of making the same. The method of the invention comprises the following steps: (a) providing a first substrate; (b) mounting a first chip onto a surface of the first substrate; (c) forming a plurality of conductive elements on the surface of the first substrate; (d) covering the conductive elements with a mold, the mold having a plurality of cavities accommodating top ends of each of the conductive elements; and (e) forming a first molding compound for encapsulating the surface of the first substrate, the first chip and parts of the conductive elements, wherein the height of the first molding compound is smaller than the height of each of the conductive elements. Thus, the first molding compound encapsulates the entire surface of the first substrate, so that the mold flush of the first molding compound will not occur, and the rigidity of the first substrate is increased. | 09-25-2008 |