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| 20100259932 | LIGHT EMITTER WITH HEAT-DISSIPATING MODULE - A light emitter with heat-dissipating module includes a light unit, a first heat-dissipating member, a second heat-dissipating member and a fastening member. The light unit includes a light-emitting element and a supporting plate having a pair of opposite surfaces. The first heat-dissipating member includes a first combining surface and a heat-dissipating portion. The first combining surface contacts with one of said two opposite surfaces of the supporting plate. The second heat-dissipating member includes a second combining surface and a heat-dissipating portion. The second combining surface contacts with the other of said two opposite surfaces of the supporting plate. The fastening member couples to the supporting plate, the first heat-dissipating member and the second heat-dissipating member to fix the combination of the supporting plate and the first and second heat-dissipating members. | 10-14-2010 |
| 20100295436 | LAMP - A lamp includes a housing, a heat sink, a light emitter, a fan and a blocking ring. The housing has an air inlet portion and an air outlet portion formed in a wall of the housing. The heat sink includes a base plate and a plurality of fins surrounding the base plate to define a compartment. Each of the fins have a first end facing the air inlet portion of the housing and a second end connecting with the base plate. The light emitter is fixed to the base plate of the heat sink. The fan is fixed inside the compartment of the heat sink. The blocking ring is mounted between the air inlet portion and the heat sink. Accordingly, the blocking ring blocks part of the heated airflow from flowing back to the air inlet portion and turbulence is avoided effectively. Therefore, the airflow inside the housing can flow smoothly through the air outlet to transfer heat to the environment and heat dissipating efficiency is enhanced. | 11-25-2010 |
| 20110279981 | Heat Dissipating Assembly - A heat dissipating assembly includes a circuit board having opposite first and second faces. The circuit board further includes a through-hole extending from the first face through the second face. A heat generating element is mounted on the first face of the circuit board and electrically coupled to the circuit board. The heat generating element includes a heat conducting portion aligned with the through-hole. A heat dissipating unit includes a base having an engaging face in contact with the second face of the circuit board. A metal solder is filled in the through-hole. The metal solder is engaged with the engaging face of the base and the heat conducting portion of the heat generating element. The heat generating element is directly engaged with the heat dissipating unit by the metal solder to effectively enhance the overall heat dissipating efficiency while reducing the number of members to lower the manufacturing costs. | 11-17-2011 |
| 20110284199 | Cooling Module - A cooling module comprises a heat sink, a cooling fan, a control assembly, a temperature sensor and a resilient heat conductor. The cooling fan facilitates cooling efficiency of the heat sink. The control assembly has a circuit board controlling rotation of the cooling fan. The temperature sensor is coupled to the circuit board of the control assembly and has a sensing face. The resilient heat conductor is disposed between the heat sink and the temperature sensor and has a first contact face and a second contact face, wherein the first contact face contacts the sensing face of the temperature sensor and the second contact face contacts a face of the heat sink. | 11-24-2011 |
| 20110292614 | Cooling Module Assembly Method - A cooling module assembly method comprises forming at least one through-hole on a circuit board; coupling the circuit board to a heat dissipating unit so that a face of the circuit board is coupled to a coupling face of the heat dissipating unit; filling the at least one through-hole with metal solders; fixing at least one heat-generating element to another face of the circuit board, wherein the at least one heat-generating element aligns with and covers the at least one through-hole; and soldering the at least one heat-generating element and the heat dissipating unit together by melting the metal solders in the at least one through-hole. | 12-01-2011 |
| 20110310559 | Heat Dissipating Assembly - A heat dissipating assembly includes a circuit board having opposite first and second faces. The circuit board further includes a through-hole extending from the first face through the second face. A heat generating element is mounted on the first face of the circuit board and electrically coupled to the circuit board. The heat generating element includes a heat conducting portion aligned with the through-hole. A heat dissipating unit includes a base having an engaging face in contact with the second face of the circuit board. A heat conducting adhesive is filled in the through-hole. The heat conducting adhesive is engaged with the engaging face of the base and the heat conducting portion of the heat generating element. The heat generating element is directly engaged with the heat dissipating unit by the heat conducting adhesive to effectively enhance the overall heat dissipating efficiency while reducing the number of members to lower the manufacturing costs. | 12-22-2011 |
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| 20090009198 | PROBING DEVICE - A probing device includes a rack that has an outer support member supporting a circuit layer and a center support member supporting a probe assembly. When the tester touching down the circuit layer of the probing device from the top side, the outer support member of the rack bears this touchdown stress. When the probes of the probe holder touching down the electronic components of an IC wafer under test, the center support member of the rack bears the reaction force from the IC wafer. | 01-08-2009 |
| 20100253378 | PROBE FOR HIGH FREQUENCY SIGNAL TRANSMISSION - A probe for high frequency signal transmission includes a metal pin, and a metal line spacedly arranged on and electrically insulated from the metal pin and electrically connected to grounding potential so as to maintain the characteristic impedance of the probe upon transmitting high frequency signal. The maximum diameter of the probe is substantially equal to or smaller than two times of the diameter of the metal pin. Under this circumstance, a big amount of probes can be installed in a probe card for probing a big amount of electronic devices, so that a wafer-level electronic test can be achieved efficiently and rapidly. | 10-07-2010 |
| 20110221462 | PROBE CARD HAVING CONFIGURABLE STRUCTURE FOR EXCHANGING OR SWAPPING ELECTRONIC COMPONENTS FOR IMPEDANCE MATCHING AND IMPEDANCE MATCHING METHOD THEREFORE - A probe card having a configurable structure for exchanging/swapping electronic components for impedance matching and an impedance method therefore are provided. In the probe card, an applied force is exerted on the electronic component so as to make the electronic component electrically connected with at least one conductive contact pad of a supporting unit. The supporting unit is a circuit board or a space transformer. In order to facilitate the exchange or swap of the electronic component, the applied force can be removed. The probe card includes a pressing plate which can be moved between a pressing position and a non-pressing position. The pressing plate has a pressing surface which is contacted with the top end of the electronic component while the pressing plate is in the pressing position. Therefore, the applied force can be generated or removed by changing the positioning of the pressing plate. | 09-15-2011 |
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| 20120025152 | CONDUCTIVE SILVER POWDER PREPARATION METHOD - A conductive silver powder preparation method includes the following steps: forming a silver salt solution by mixing a silver salt with a DI (De-ionized) water; forming a sodium citrate solution by well-mixing a sodium citrate with the DI water; heating the silver salt solution until maintaining the silver salt solution at a constant temperature of no less than 80° C.; forming a brown solution by adding the sodium citrate solution into the heated silver salt solution; cooling the brown solution to the room temperature for precipitating to form a brown powder; and forming a conductive silver powder by freezing and drying the brown powder. This method simplifies the prior chemical method without usages of toxic reducing agent and additional protective agent, and complies with the requirements of environment, step simplification and economy. | 02-02-2012 |
| 20120027940 | PROTECTION COATINGS, MANUFACTURING METHOD AND USE THEREOF - A protection coating, a manufacturing method and a use thereof are provided. The manufacturing method includes (1) mixing tetraethyl orthosilicate with acrylic silane and evenly stirring at room temperature for 0.5-1.5 hours, so as to obtain an inorganic mixture; (2) mixing the inorganic mixture with deionized water and an organic solvent and continuously stirring at room temperature for 48-72 hours, so as to obtain a clear transparent solution A; (3) preparing a solution of nano-scale silica gel by a sol-gel process; and (4) mixing the solution A with the solution of nano-scale silica gel, adding a predetermined amount of benzoyl peroxide into a mixture of the solution A and the solution of nano-scale silica gel, and evenly stirring at the room temperature for 0.5-1 hour, so as to form a protection coatings of the present invention. The protection coating is applicable on a surface of a plastic product. | 02-02-2012 |
| 20120028028 | MANUFACTURING METHOD OF CONDUCTIVE THIN FILM AND PRODUCT THEREOF - A manufacturing method of conductive thin film includes: (A) preparing tetraethyl orthosilicate (TEOS), 3-methacryloxypropyl-trimethoxysilane and one of or a mixture of vinyl-triethoxysilane (VTEO) and vinyl-trimethoxysilane (VTMO) in a mole ratio of 1:1:1, so as to obtain a silicon-containing reactant; (B) mixing the silicon-containing reactant with a solvent containing water and alcohol, wherein the total quantity of moles of the solvent is two times of that of the silicon-containing reactant; and evenly stirring for at least 12 hours, so as to obtain a semi-finished paint; (C) adding a conductive material in an amount of 3-50 wt % based on a final total weight into the semi-finished paint and evenly stirring, so as to obtain a finished paint; and (D) applying the finished paint to a substrate by coating means, and heating at a temperature of 70-250° C. for 5-60 minutes, so as to form a conductive thin film with continuous pores. | 02-02-2012 |
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| 20100233362 | Method of Resisting Dust and Dirt with Nanotechnology - A method of resisting dust and dirt with nanotechnology adapted for electronic products is described hereinafter. Firstly, make an initial reactant into a metal oxide gel of nanometer by way of a sol-gel method. Secondly, dilute the metal oxide gel of nanometer with a diluent to form a coating solution, and then stand the coating solution for a period of time to make the metal oxide gel of nanometer and the diluent well mixed with each other. Next, coat the coating solution onto surfaces of the product evenly to fill up tiny holes on the surfaces of the product. Lastly, put the product coated with the coating solution at the temperature of 20˜22° C. to make the coating solution evaporate so as to form continuous protective films on the surfaces of the product for fully filling up the tiny holes. | 09-16-2010 |
| 20110120974 | Method For Atomizing A Surface Of A Substrate - A method for atomizing a surface of a substrate includes the steps of: coating a proper quantity of chemical solvent onto the surface of the substrate to react with substrate material of the substrate for a certain time; then rinsing off the remaining chemical solvent on the substrate with water to obtain an atomized surface on the substrate. Therefore, it can achieve a simple process, a high productivity and a low manufacture cost without any effect on properties of the substrate. | 05-26-2011 |
| 20110136960 | METHOD OF MAKING AN ATOMIZING AGENT - A method of making atomizing agent is described hereinafter. Firstly, make a nanometer silicon dioxide gel by means of a sol-gel method. Next, mix a proper quantity of nanometer silicon dioxide gel and organic solvent together to form a nanometer silicon dioxide solution. Lastly, add a proper quantity of water-based polyurethane resin or de-ionized water into the nanometer silicon dioxide solution so as to obtain the atomizing agent by means of being stirred for 1 hour and then aging for 24 hours under a room temperature. | 06-09-2011 |
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| 20080252867 | OVERLAY MARK, AND FABRICATION AND APPLICATION OF THE SAME - An overlay mark is described, including a portion of a lower layer having two x-directional and two y-directional bar-like patterns therein, and two x-directional and two y-directional photoresist bars defined by the lithography process for defining an upper layer and surrounded by the bar-like patterns. At least one of the patterning process for defining the lower layer and the above lithography process includes two exposure steps respectively for defining a first device area and a second device area. When the patterning process includes two exposure steps, one x-directional and one y-directional bar-like patterns are defined simultaneously and the other x-directional and the other y-directional bar-like patterns are defined simultaneously. When the lithography process includes two exposure steps, one x-directional and one y-directional photoresist bars are defined simultaneously and the other x-directional and the other y-directional photoresist bars are defined simultaneously. | 10-16-2008 |
| 20080292974 | EXPOSURE PROCESS AND PHOTOMASK SET USED THEREIN - An exposure process is described, for defining in a photoresist layer a plurality of first patterns having a first pitch and a second pattern between them that is wider than one first pattern. A first exposure step is conducted to the photoresist layer with a first photomask that has a plurality of the first patterns without a second pattern between them, wherein the first patterns on the first photomask have the first pitch only. A second exposure step is conducted to the photoresist layer with a second photomask that has a third pattern narrower than the second pattern at a position corresponding to the second pattern. The exposure dose of the first or second exposure step alone is not sufficient to define any pattern in the photoresist layer. | 11-27-2008 |
| 20100035191 | METHOD FOR PATTERNING MATERIAL LAYER - The invention is directed to a method for patterning a material layer. The method comprises steps of providing a material layer. The material layer has a first hard mask layer and a second hard mask layer successively formed thereon. Then, the second hard mask layer is patterned to form a plurality of openings therein. A patterned photoresist layer is formed to cover the second hard mask layer and the patterned photoresist layer exposes a portion of the openings. The first hard mask layer with the patterned photoresist layer and the patterned second hard mask layer together as a mask. Then, the patterned photoresist layer and the patterned second hard mask layer are removed. The material layer is patterned with the patterned first hard mask layer as a mask. | 02-11-2010 |
| 20100053616 | ALIGNMENT MARK AND METHOD OF GETTING POSITION REFERENCE FOR WAFER - An alignment mark on a wafer is described, including at least one dense pattern and at least one block-like pattern adjacent thereto and shown as at least one dark image and at least one bright image adjacent thereto. A method of getting a position reference for a wafer is also described. An above alignment mark is formed. The alignment mark, which is shown as at least one dark image and at least one bright image adjacent thereto that are formed by the at least one dense pattern and the at least one block-like pattern, is then detected. | 03-04-2010 |
| 20110169175 | OVERLAY MARK - An overlay mark is used in pattern registration on a semiconductor wafer with an oxide layer. Four sets of two trenches each are formed in the oxide layer. Each trench in a set is parallel to the other trench of the same set. The trenches are configured such that each set forms one side of a box shape. | 07-14-2011 |
| 20110191728 | INTEGRATED CIRCUIT HAVING LINE END CREATED THROUGH USE OF MASK THAT CONTROLS LINE END SHORTENING AND CORNER ROUNDING ARISING FROM PROXIMITY EFFECTS - An integrated circuit that includes a line end created through use of a mask that controls line end shortening and corner rounding arising from proximity effects is provided. The mask includes a main feature having opaque and transmissive areas arranged to reflect a patterned feature of the line end, at least one of an opaque edge or a transmissive edge located at each end of the main feature, wherein the opaque edge has a set of transmissive assist features arranged therein such that the set of transmissive assist features align alternately with the transmissive areas of the main feature, and the transmissive edge has a set of opaque assist features arranged therein such that the set of opaque assist features align alternately with the opaque areas of the main feature. | 08-04-2011 |
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| 20090174463 | Multi-system module having functional substrate - A multi-system module having a functional substrate includes a substrate comprising therein at least one control circuit units, and a plurality of main circuit units provided on one side surface of the substrate. The main circuit units are electrically connected to the control circuit unit, whereby the control circuit unit is used to manage the operation of the main circuit units. Via the above module structure, the substrate can improve the function of controlling multiple systems. | 07-09-2009 |
| 20090192750 | Parallel testing system with shared golden calibration table and method thereof - A parallel testing system with shared golden calibration table includes: a storage unit, multiple testing platforms, and a server. The storage unit is used for storing the golden calibration table, and the testing platforms are used to test a device under test (DUT) respectively by utilizing the golden calibration table. The server is connected to the storage unit and the testing platforms to send the golden calibration table to the testing platforms, and then, to cumulatively record calibration data produced after the testing platforms respectively test the DUTs, so that the server can further perform a weighted arithmetic operation to the calibration data so as to update the golden calibration table. Thereby, the purpose of accelerating the convergence speed of the golden calibration table can be achieved. | 07-30-2009 |
| 20100009501 | Packaging structure, method for manufacturing the same, and method for using the same - A packaging structure applied for a surface mounting process, comprising: a chip module having a packaging surface; and a pre-cured layer formed on the packaging surface of the chip module. As above-mentioned, the structure is employed for protecting the external surface of the wafer. The pre-cured layer is formed on pre-curing a gluing material and the gluing material is uniformly filled with the space between the connecting protrusions on the packaging surface. The pre-cured later is post-curing in a connecting process for mounting the connecting protrusions to the substrate so that the connecting strength is improved. Moreover, the rate of the packaging process is increasing. | 01-14-2010 |
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| 20080225243 | PROJECTION APPARATUS - A projection apparatus including a projection body and at least one adjusting leg is provided. The projection body has a casing, and the bottom of the casing has at least one accommodating cave. The adjusting leg includes a supporter and a pivoting rod. The supporter has a supporting portion and a screw connected to the supporting portion, and the projection body is capable of being supported on a surface by the supporting portion. The pivoting rod is pivoted to the casing and has a threaded hole, and the screw is screwed into the threaded hole. The pivoting rod is capable of being rotated along an axis of the pivoting rod to drive the supporter to rotate, so as to accommodate the supporting portion in the accommodating cave. | 09-18-2008 |
| 20080266236 | Driving method of liquid crystal display device having dynamic backlight control unit - A dynamic control method for controlling backlight module of liquid crystal display (LCD) comprises steps of: receiving a frame data which is transferred to the LCD and consists a plurality of raw grayscale level; processing a statistical analysis for distribution of the plurality of raw grayscale level; and transferring a plurality of corrected grayscale level which is resulted from the statistical analysis corresponding to the raw grayscale level to the backlight control unit and a data modification simultaneously, wherein the backlight control unit uses the plurality of corrected grayscale level to modify brightness of backlight module and the data modification uses the plurality of corrected grayscale level to compare with the plurality of raw grayscale level for accurate display performance, so that the electrical power consumption is reduced and image quality is enhanced. | 10-30-2008 |
| 20090059186 | LAMP HOLDER OF A PROJECTION APPARATUS AND FABRICATION THEREOF - A method for forming a lamp holder. The lamp holder is applied in a projection apparatus. First, the lamp holder comprising metal is provided. An insulating layer is formed on one surface of the lamp holder to insulate the lamp holder from another element of the projection apparatus. | 03-05-2009 |
| 20090103057 | AUTOMATIC IRIS DIAPHRAGM MODULE - An automatic iris diaphragm module is adapted to a projector having a casing, and is capable of adjusting a size of luminous flux of a light source of the projector. The automatic iris diaphragm module is provided with a chassis, a fixed mask, a movable mask, a drive rack, and a motor. The chassis is fixed on the casing. The fixed mask is fixed on the chassis and has an opening. The movable mask is slidably disposed on the fixed mask. The drive rack is fixed on the movable mask. The motor is fixed on the chassis and has a driving gear engaging with the drive rack for driving the drive rack to make the movable mask slide relative to the fixed mask, for adjusting the size of the luminous flux of the light source through the opening. | 04-23-2009 |
