Patent application number | Description | Published |
20090071698 | CIRCUIT BOARD - A circuit board includes a capacitor having two pins disposed thereon. A line determined by the two pins of the capacitor is not perpendicular to any of main sides of the circuit board. | 03-19-2009 |
20090166062 | PRINTED CIRCUIT BOARD ASSEMBLY - A printed circuit board assembly includes a printed circuit board, a carrier, a semiconductor chip mounted on the carrier, a plurality of tin balls soldered between the printed circuit board and the carrier for transmitting signals, and a heat sink glued to the semiconductor chip to dissipate heat. A pressing portion is formed on the bottom of the heat sink and does not make contact with the semiconductor chip. The pressing portion contacts with the periphery of the carrier to reinforce the tin balls located between the printed circuit board and the carrier. | 07-02-2009 |
20090166164 | BUTTON ASSEMBLY - A button assembly for pressing a switch in a computer bezel includes a button connected to an arm. A cutout is defined in the computer bezel. The button is inserted in the cutout, and the arm is pivotably mounted on the computer bezel. A pressing portion extends outward from a side of the arm. A slanted pressing plane is formed on the pressing portion. Pressing the button moves the arm so that one end of the slanted pressing plane away from the arm contacts the switch. The switch resists the pressing portion, causing the arm to rotate so that the other end of the slanted pressing plane moves forward, thereby the slanted pressing plane entirely contacts and activates the switch. | 07-02-2009 |
20090168361 | PRINTED CIRCUIT BOARD ASSEMBLY - A printed circuit board assembly includes a printed circuit board with a heat generating component attached thereon, a base, and a thermal plate. The heat generating component comprises a side surface. The base defines a receiving room and an opening configured for access into the receiving room. The printed circuit board is received in the receiving room via the opening. The thermal plate is mounted on the base to cover the opening. A conducting piece is formed on the thermal plate and extends into the receiving room. The conducting piece includes a contacting portion extending from the thermal plate and in contact with the side surface. The conducting piece is configured for conducting heat from the heat generating component to the thermal plate. A heat dissipating hole is defined on the thermal plate in alignment with the contacting portion configured for dissipating heat from the base. | 07-02-2009 |
20090171604 | METHOD AND APPARATUS FOR COMPENSATING S-PARAMETERS OF PASSIVE CIRCUITS - The invention related to a method and circuit that is used to compensate for S-parameters of a passive circuit which do not satisfy passivity. The method includes the following steps: (1) getting S-parameters which do not satisfy passivity, these S-parameters being composed of an S-parameter matrix S; (2) computing matrix [S×S′], wherein matrix S′ is a complex conjugate transposed matrix of the S-parameter matrix S; (3) computing the eigenvalues of the matrix [S×S′], and choosing an eigenvalue Ψ whose real part real(Ψ) is the biggest; (4) computing a compensating value ξ, the compensating value ξ being equal to real(Ψ) | 07-02-2009 |
20090188699 | PRINTED CIRCUIT BOARD - A printed circuit board includes a base and a signal trace laid on the base. The signal trace includes a plurality of straight line segments parallel to the first fibers. The signal trace is laid on the base in such a manner that the line segments of the signal trace mapped on the base partly superpose the first fibers and partly superpose gaps between two adjacent first fibers. | 07-30-2009 |
20090213549 | HEAT SINK ASSEMBLY - A heat sink assembly includes a printed circuit board, an electronic component mounted on the printed circuit board, and a heat sink mounted on the printed circuit board for dissipating heat from the electronic component. The printed circuit board includes a heat-conduction layer. The heat sink includes a base configured to contact the heat-conduction layer, and a main body extending upward from the base configured to contact the electronic component. The cross section of the base is larger than the cross section of the main body. A plurality of fins extends from the main body. | 08-27-2009 |
20100014244 | THERMAL DEVICE FOR HEAT GENERATING SOURCE - A heat sink for dissipating heat from a heat source, includes a base configured to connect with a heat source, and a plurality of fins positioned on the base. A cutout is defined within the plurality of parallel fins. | 01-21-2010 |
20100096170 | CIRCUIT BOARD AND LAYOUT METHOD THEREOF - A circuit board includes a signal plane and a ground plane. The signal plane is configured to have a plurality of signal traces arranged thereon. Each of the signal traces includes a plurality of straight line segments. Each line segment extends along a path different from the others. The ground plane includes a plurality of tiles connected in an array. Each tile is formed by ground traces. The straight line segments of each signal trace mapped on the ground plane are arranged at an angle relative to any one ground trace of the tiles. The angle is defined within a range determined by one of ground traces of a tile and an adjacent diagonal line of the tile. A method for laying out such a circuit board is also provided. | 04-22-2010 |
20100128442 | HEAT SINK ASSEMBLY - A heat sink assembly includes a printed circuit board, a socket attached on a top surface of the board for receiving a chip, and a heat sink attached onto the chip of the board. The socket includes a plurality of legs integrally extending down from a bottom surface of the socket. The legs contact the top surface of the board to support the socket on the board. The heat sink includes a base, a plurality of fins extending up from the base, and a plurality of legs extending down from the base. | 05-27-2010 |
20100165579 | CIRCUIT BOARD ASSEMBLY - A circuit board assembly includes a circuit board with two heat dissipating assemblies mounted thereon and an L-shaped back plate attached to an underside of the circuit board. Each of the heat dissipating assembly includes at least a pair of securing members at opposite corners thereof. The back plate includes a first portion and a second portion each defining at least a pair of circular protrusions corresponding to the securing members of the heat dissipating assemblies. | 07-01-2010 |
20110164380 | CIRCUIT BOARD ASSEMBLY - A circuit board assembly is provided, includes a circuit board having a first side and a second side opposite to the first side. A chip is connected to the first side of the circuit board. A first heat dissipating device is located on the first side of the circuit board. The chip is located between the first heat dissipating device and the first side of the circuit board. A second heat dissipating device abuts the second side of the circuit board, and the second heat dissipating device are secured to the first heat dissipating device to clamp the circuit board and the chip. | 07-07-2011 |
20120057290 | ALL-IN-ONE COMPUTER - An all-in-one computer includes a mainframe shell, a display frame, and a power supply unit (PSU). The PSU includes an outer shell, a power supply module, and a fan module. The power supply module and the fan module are accommodated in the outer shell. The power supply module includes a main body. An axis of the fan module is perpendicular to the main body. | 03-08-2012 |
20120097562 | ELECTRONIC DEVICE ENCLOSURE - An electronic device enclosure includes a chassis and an operating member. The chassis includes a front plate and a top plate connected to the front plate. A clipping hole is defined in the front plate. The operating member includes a positioning portion and a securing piece. The positioning portion is received so it can be slid in the clipping hole, and the securing piece is attached to the front plate. | 04-26-2012 |
20120267148 | CIRCUIT BOARD - A circuit board includes a signal plane and a ground plane. The signal plane is configured to have a plurality of signal traces. Each of the signal traces includes a plurality of straight line segments. Each line segment extends along a path different from the others. The ground plane includes a plurality of tiles connected in an array. Each tile is formed by ground traces. The straight line segments of each signal trace mapped on the ground plane are arranged at an angle relative to any one ground trace of the tiles. The angle is defined within a range determined by one of ground traces of a tile and an adjacent diagonal line of the tile. A method for laying out such a circuit board is also provided. | 10-25-2012 |
20120275109 | ELECTRONIC DEVICE WITH EMI SHIELDING HEAT DISSIPATION MEMBER - An electronic device include a metal chassis, a motherboard within the metal chassis, a central processing unit (CPU) socket attached on the motherboard, a CPU attached to the CPU socket, a heat dissipation pad attached on the CPU, and a metal heat dissipation member. The metal heat dissipation member is attached on the heat dissipation pad to transfer heat from the CPU and abuts the metal chassis to provide electro magnetic interference (EMI) shielding for the CPU. | 11-01-2012 |
20130008626 | HEAT DISSIPATING APPARATUS FOR DATA STORAGE DEVICE - A heat dissipating apparatus for a data storage device includes a mounting bracket, and a dissipating structure. The mounting bracket is configured for securing the data storage device. The dissipating structure includes a first heat dissipating panel, a second heat dissipating panel, and a plurality of heat dissipating pieces located between the first heat dissipating panel and the second heat dissipating panel. Each of the first heat dissipating panel and the second heat dissipating panel is secured to the mounting bracket. The data storage device abuts the first heat dissipating panel or the second heat dissipating panel. | 01-10-2013 |
20130014920 | HEAT SINK ASSEMBLYAANM CHAO; CHIH-HANGAACI Tu-ChengAACO TWAAGP CHAO; CHIH-HANG Tu-Cheng TWAANM CHENG; WEI-CHENGAACI Tu-ChengAACO TWAAGP CHENG; WEI-CHENG Tu-Cheng TWAANM CHIANG; CHIH-HSIANGAACI Tu-ChengAACO TWAAGP CHIANG; CHIH-HSIANG Tu-Cheng TW - A heat sink assembly includes a heat sink, a first fan, and a second fan. The heat sink includes a first base contacting a first heat generating element, a first heat pipe connected to the first base, and a fin assembly. The first heat pipe is located in the fin assembly. The first fan defines a first input opening and a first output opening substantially perpendicular to the first input opening. The second fan defines a second input opening and a second output opening substantially parallel to the second input opening. The first and second input openings correspond to the fin assembly. | 01-17-2013 |
20130027876 | COMPUTER SYSTEM WITH HEAT DISSIPATION APPARATUS - A computer system includes a computer case, a cover, and an air duct. The computer case includes a display, a housing connected to the display, a motherboard attached to the housing, and a fan module. The motherboard includes a heat generating component. An input opening and an output opening are defined in the cover. The output opening corresponds to the fan module. The air duct is mounted over the heat generating component. The air duct includes a top plate substantially parallel to the motherboard and a first side plate extending from the top plate. The first side plate is substantially perpendicular to the top plate. The first side plate defines a plurality of first airflow holes corresponding to the input opening. The top plate defines a plurality of through holes corresponding to the heat generating component. | 01-31-2013 |
20130052933 | AIR DIRECTOR FOR ELECTRONIC DEVICE - An exemplary air director includes a top plate, a bottom plate, side plates, an air baffle, an air inlet, and an air outlet. The bottom plate is opposite to the top plate. The plurality of side plates is connected together end to end between the top plate and bottom plate. The top plate, the bottom plate and the plurality of side plates cooperatively define a receiving chamber therebetween. The air baffle substantially vertically extends along an outer surface of one side plate of the plurality of side plates. The air inlet and the air outlet are respectively provided at opposite lateral sides of the air baffle. | 02-28-2013 |
20130109289 | ELECTRONIC DEVICE | 05-02-2013 |