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Chih-Chien
Chih-Chien Hsieh, Taichung Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20090200190 | Socket holder - A socket holder is adapted for retaining a socket thereon. The socket has an internal surrounding surface. The socket holder includes a first retaining portion extending along a first axis, a second retaining portion extending along a second axis parallel to the first axis and in the same direction as the first retaining portion, and movable relative to the first retaining portion, and a biasing component for biasing the second retaining portion to move away from the first retaining portion. The second retaining portion cooperates with the first retaining portion to abut against the internal surrounding surface of the socket to retain the socket on the socket holder. | 08-13-2009 |
| 20100065520 | SOCKET HOLDING DEVICE - A socket holding device includes a peg component, a holding component, a positioning component, and a spring component. The peg component has a pin portion formed with a recess. The holding component has an insert portion that is movable between first and second positions relative to the pin portion. The insert portion has an outer peripheral wall that permits sleeving of a socket on the holding component. The insert portion is formed with a retainer hole that is registered with the recess. The positioning component is movably disposed in the retainer hole. The positioning component and the recess are configured such that the positioning component projects from the outer peripheral wall for interference engagement with the socket when the holding component is at the first position, and such that the positioning component permits removal of the socket when the holding component is at the second position. The spring component biases the holding component to the first position. | 03-18-2010 |
Chih-Chien Hsieh, Tai-Ping City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090166305 | Tool Storage Rack - A tool storage rack is adapted for retaining a plurality of tool heads therein, and includes a positioning seat and a base seat coupled to the positioning seat. The positioning seat has a top wall, a surrounding wall extending downwardly from the top wall, and a plurality of spaced apart positioning holes formed in the top wall. The base seat has a base wall connected to the surrounding wall, and a plurality of positioning units formed on the base wall at positions corresponding respectively to the positioning holes. Each of the positioning units includes a pair of spaced apart positioning plates that extend upwardly from the base wall, and a pair of protrusions formed respectively at the positioning plates and adapted to abut against an internal wall surface of a tool head when the latter is sleeved on the positioning unit via a corresponding one of the positioning holes. | 07-02-2009 |
Chih-Chien Lee, Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090154121 | Clock generator - A clock generator includes a printed circuit board, a resonant circuit and a pair of compensating capacitors. The resonant circuit is disposed on the printed circuit board. The compensating capacitors are embedded in the printed circuit board and electrically connected to both terminals of the resonant circuit respectively. | 06-18-2009 |
| 20090189628 | Reworkable bonding pad layout and debug method thereof - The reworkable bonding pad layout includes a first point, a second point, a reworkable bonding pad, a first leading wire, and a second leading wire. There is a debug position defined between the first point and the second point. The reworkable bonding pad is formed at the debug position. The first leading wire may connect the reworkable bonding pad and the first point. The second leading wire may connect the reworkable bonding pad and the second point. The reworkable bonding pad is cut into a first debug area connecting with the first leading wire, and a second debug area connecting with the second leading wire. | 07-30-2009 |
| 20100001658 | LIGHT EMITTING DIODE CIRCUIT AND LIGHT EMITTING DIODE DRIVING CIRCUIT - A light-emitting diode circuit and a light-emitting diode driving circuit are disclosed. The light-emitting diode driving circuit includes the DC-DC converter and the switch circuit. The DC-DC converter converts a DC voltage to the driving voltage for driving the light-emitting diode. One end of the switch circuit is electrically connected to the DC-DC converters and a cathode of the light-emitting diode, the other end of the circuit switching is electrically connected to a ground terminal. The switch circuit controls the connection between the DC-DC converters, the Light-emitting diodes and the ground terminal based on the control signal. | 01-07-2010 |
Chih-Chien Liao, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20100064262 | Optical multi-touch method of window interface - An optical multi-touch method of a window interface is adapted to control an object in the window interface. The method includes providing a first optical sensing window to obtain a first tracking signal and providing a second optical sensing window to obtain a second tracking signal; resolving the first tracking signal to determine a first displacement direction and resolving the second tracking signal to determine a second displacement direction; and controlling a motion of the object in the window interface according to a relative relation between the first displacement direction and the second displacement direction. | 03-11-2010 |
Chih-Chien Liu, Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20080246061 | STRESS LAYER STRUCTURE - A stress layer structure disposed on a substrate including a device region and a non-device region is provided. The device region includes active regions and a non-active region. The stress layer structure has stress patterns, at least one partition line, and at least one dummy stress pattern. Each of the stress patterns is disposed on the substrate of each of the active regions, respectively. The partition line exposes a portion of the substrate and divides the two adjacent stress patterns. The dummy stress pattern is disposed on the substrate in the partition line. | 10-09-2008 |
| 20090146311 | INTERCONNECT STRUCTURE - An interconnect structure is disposed on a substrate with a conductive part thereon and includes a first porous low-k layer on the substrate, a damascene structure in the first porous low-k layer, a second porous low-k layer over the first porous low-k layer and the damascene structure, and a first UV cutting layer at least between the first porous low-k layer and the second porous low-k layer. The damascene structure is electrically connected with the conductive part. The UV cutting layer is a UV reflection layer or a UV reflection-absorption layer. | 06-11-2009 |
| 20090201625 | CONDUCTIVE STRUCTURE HAVING CAPACITOR - A three-dimensional conductive structure has a first electrode and a second electrode of a capacitor structure, and thereby defines a capacitor space. At least a signal line is further included in the capacitor space where both the first electrode and the second electrode can cross and detour round the signal line. Therefore, the signal line can go directly through the capacitor space for transferring various signals without making a detour to avoid the whole capacitor structure. | 08-13-2009 |
| 20090261419 | SEMICONDUCTOR DEVICE HAVING ASSIST FEATURES AND MANUFACTURING METHOD THEREOF - A semiconductor device having assist features and manufacturing method thereof includes a substrate having at least an active region and a peripheral region defined thereon. The semiconductor device also includes a plurality of assist features positioned in the peripheral region, or in the active region with a dotted line pattern. The assist features are electrically connected to active circuits formed in the active region, respectively, for serving as redundant circuits that repair or replace defective circuits. | 10-22-2009 |
Chih-Chien Pan, Goleta, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20110103077 | LIGHT EMITTING DIODE PACKAGING METHOD WITH HIGH LIGHT EXTRACTION AND HEAT DISSIPATION USING A TRANSPARENT VERTICAL STAND STRUCTURE - A packaging method for light emitting diodes provides both high light extraction and heat dissipation using a transparent vertical stand structure. A light emitting diode (LED) is attached to a vertical stand structure for supporting the LED, wherein the LED is bonded to the vertical stand structure, so that one of the LED's sides faces vertically upwards, another of the LED's sides faces vertically downwards, a top surface of the LED faces horizontally sideways in one direction, and a bottom surface of the LED faces horizontally sideways in another direction. The vertical stand structure comprises a connecting stem between the LED and a header, and is made of a material that provides for heat dissipation and may also be transparent to light generated in the LED, such as sapphire or zinc oxide. The LED and the vertical stand structure may be encapsulated within a mold. | 05-05-2011 |