Patent application number | Description | Published |
20100048052 | ELECTRONIC DEVICE AND AIRPROOF CONNECTOR MODULE THEREOF - An electronic device and an airproof connector module thereof are provided. The electronic device is connected to a peripheral device by the connector module. The connector module includes a casing, an adapting board, a first connector, a second connector, a first elastic sealing element, and a second elastic sealing element. The adapting board is disposed in a containing space in the casing. The casing has a connection hole and an opening. The first connector is disposed at the connection hole, and the second connector is disposed at the opening. The first connector and the second connector are coupled to the adapting board. The first elastic sealing element fills space between the first connector and the connection hole. The second elastic sealing element fills space between the second connector and the opening. | 02-25-2010 |
20100143648 | FIBER-REINFORCED POLYMERIC CASING AND METHOD FOR MANUFACTURING THE SAME - This invention discloses a fiber-reinforced polymeric casing and a method for manufacturing the same. According to this invention, the casing includes a multi-layer structure, an intermedium film, and a structural part. The multi-layer structure is formed by shaping and stacking up a plurality of layers of fiber-reinforced polymeric mats. The intermedium film is disposed on a surface of the multi-layer structure. The structural part includes a polymer and is one-step molded on the intermedium film together with the multi-layer structure. | 06-10-2010 |
20100143650 | CASING AND METHOD FOR MANUFACTURING THE SAME - This invention discloses a casing and a method for manufacturing the same. The casing includes a fiber-reinforced thermosetting polymeric mat and a fiber-reinforced thermoplastic polymeric mat. The fiber-reinforced thermosetting polymeric mat is molded to have a predetermined shape with a curved inner surface. The fiber-reinforced thermoplastic polymeric mat is molded on the inner surface of the fiber-reinforced thermosetting polymeric mat and agrees with the curved inner surface. | 06-10-2010 |
20110043989 | MOTHERBOARD AND PORTABLE ELECTRONIC DEVICE USING THE SAME - This invention provides a motherboard and a portable electronic device using the same. The motherboard includes a first circuit board and a second circuit board. The first circuit board includes a first connector, an input/output controller, and a plurality of peripheral device connectors. The input/output controller is electrically connected with the first connector and the peripheral device connectors, respectively. The second circuit board includes a second connector, a central processing unit (CPU), and a chipset. The chipset is electrically connected with the second connector and the CPU, respectively. The first circuit board is connected with the second circuit board via the first connector and the second connector. | 02-24-2011 |
20130168897 | METHOD FOR MANUFACTURING FIBER-REINFORCED POLYMERIC CASING - This invention discloses a method for manufacturing a fiber-reinforced polymeric casing. According to this invention, the method includes the steps of shaping and stacking up a plurality of layers of fiber-reinforced polymeric mats to build a multi-layer structure, disposing an intermedium film on a surface of the multi-layer structure, and performing an one-step molding process to form a structural part including a polymer on the intermedium film and the multi-layer structure. | 07-04-2013 |
20140241406 | WIRELESS COMMUNICATIONS SYSTEM PERFORMING TRANSMISSION AND RECEPTION ACCORDING TO OPERATIONAL STATES OF CO-LOCATED INTERFACE APPARATUS AND RELATED WIRELESS COMMUNICATIONS METHOD THERE OF - A wireless communications system co-located with an interface apparatus includes a radio subsystem. The radio subsystem includes a transmission circuit arranged for performing a radio transmission, and a reception circuit arranged for performing a radio reception when the interface apparatus operates in a first operational state. The interface apparatus operates in one of a plurality of operational states including the first operational state and a second operational state, and a power consumption of the interface apparatus in the first operational state is lower than a power consumption of the interface apparatus in the second operational state. | 08-28-2014 |
20140244852 | Method of Reducing Mutual Interference between Universal Serial Bus (USB) data transmission and wireless data transmission - A method of reducing mutual interference between Universal Serial Bus (USB) data transmission and wireless communication for an electronic device is disclosed. The method comprises establishing a plurality of physical layer links for the USB data transmission in a plurality of supported USB modes; dynamically selecting one of the supported USB modes according to the wireless communication; and performing the USB data transmission in the selected USB mode. | 08-28-2014 |
20140244872 | Method of Handling Transmission in Data Transmission System - A method of handling transmission for a host in a data transmission system includes establishing a connection with a device of the data transmission system via a first frequency; receiving a negotiating information from the device; and re-establishing the connection with the device via a second frequency when the negotiating information reveals that the second frequency is available for the host to communicate with the device; wherein the second frequency is different than the first frequency. | 08-28-2014 |