Chih-Chia

Chih-Chia Tsai, Shulin City TW

Patent application number	Description	Published
20110266589	Light Emitting Diode Package Structure and Manufacturing Method Therefor - A light emitting diode (LED) package and a manufacturing method therefor are disclosed. In one aspect, a manufacturing method of a light emitting diode package may: heat a first light transmission insulation material to cause the first light transmission insulation material to become a sticky member; connect a lead frame to the sticky member; perform a chip-bonding step that bonds at least one light-emitting diode chip on the sticky member using a light transmission glue; encapsulate the at least one light-emitting diode chip with a second light transmission insulation material; and perform a drying step that forms the sticky member and the second light transmission insulation material into shape.	11-03-2011

Patent application number	Description	Published
20080252612	Touch panel display device with signal transmission channel - An exemplary touch panel display device (	10-16-2008

Patent applications by Chih-Chia Yu, Miao-Li TW