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Chih-Cheng
Chih-Cheng Chan, Hsin-Chu TW
| Patent application number | Description | Published |
|---|---|---|
| 20090073088 | Multi-primary color display and color filter - When the coordinates of multiple primaries are set within specific ranges in a chromaticity diagram (e.g. the CIE 1931 chromaticity diagram), the proportion of the contrast ratio of one primary to the contrast ratio of the other primary should conform to some requirements to achieve the white balance of dark-state, so as to effectively display the natural color and mitigate the color shift of low-luminance images. | 03-19-2009 |
| 20090085834 | Multi-primary color display and the manufacturing method thereof - A multi-primary color display has pixels, and each pixel includes at least four sub pixels which display red primary color, green primary color, blue primary color and cyan primary color, respectively. When the four primary colors are displayed to achieve white balance, their luminance ratios are: the relative luminance of green primary color is greater than the relative luminance of red primary color, the relative luminance of red primary color is greater than the relative luminance of cyan primary color, and the relative luminance of cyan primary color is greater than the relative luminance of blue primary color. A method for manufacturing the multi-primary color display is disclosed as well. | 04-02-2009 |
| 20090086133 | Multi-Primary Color Display - A multi-primary color display has a backlight source and pixels. Each pixel has at least four sub pixels, which display red primary color, green primary color, blue primary color and a fourth primary color, respectively. At the peak position of the fourth primary color located in the wavelength range between 550 nm˜600 nm, the relative luminance ratio of the fourth primary color to the green primary color is greater than or equal to 0.5. When the ratio of the relative luminance meets the requirement and the relative luminance of a newly added primary color is greater than a certain value, the colors beyond the three-primary color gamut, which includes natural colors and other colors outside the natural color gamut, can be reproduced. | 04-02-2009 |
| 20110148747 | Multi-primary color display and the manufacturing method thereof - A multi-primary color display has pixels, and each pixel includes at least four sub pixels which display red primary color, green primary color, blue primary color and cyan primary color, respectively. When the four primary colors are displayed to achieve white balance, their luminance ratios are: the relative luminance of green primary color is greater than the relative luminance of red primary color, the relative luminance of red primary color is greater than the relative luminance of cyan primary color, and the relative luminance of cyan primary color is greater than the relative luminance of blue primary color. A method for manufacturing the multi-primary color display is disclosed as well. | 06-23-2011 |
| 20110286077 | DISPLAY DEVICE - A display device includes a display panel, a barrier layer, and a sealant. The display panel includes a backplane and a frontplane disposed on the backplane, wherein the frontplane includes a plurality of frontplane sidewalls. The frontplane sidewalls at least include a first frontplane sidewall and a second frontplane sidewall, forming a frontplane concavity. The barrier layer includes a first barrier layer sidewall and a second barrier layer sidewall, wherein the first barrier layer sidewall and the second barrier layer sidewall form a barrier layer concavity. The barrier layer concavity corresponds to the frontplane concavity, and at least one of the barrier layer concavity and the frontplane concavity does not include a right angle. The sealant is disposed in a sealant accommodating space defined by the frontplane sidewalls of the frontplane, an inner surface of the backplane and an inner surface of the barrier layer. | 11-24-2011 |
| 20110299151 | E-INK DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - An E-ink display device includes an active element array substrate, an E-ink layer, a protective layer and a sealant. The active element array substrate has a surface, and the surface includes a contacting region and a sealing region. The E-ink layer is disposed on the contacting region and has a first side wall, and a first included angle defined between the first side wall and the surface being smaller than 90 degrees or larger than 90 degrees. The protective layer is disposed on the E-ink layer and has a second side wall, and a second included angle defined between the second side wall and the surface is smaller than 90 degrees or larger than 90 degrees. The sealant is disposed on the sealing region and surrounds the E-ink layer and the protective layer. A method for manufacturing the E-ink display device is also provided. | 12-08-2011 |
Chih-Cheng Chang, Taipei County TW
| Patent application number | Description | Published |
|---|---|---|
| 20080312046 | FOLDING MECHANISM FOR TREADMILLS - A folding mechanism for a treadmill, including a first support frame with two protruding portions mounted respectively at opposite ends of one side; a second support frame with two connector interfaces mounted respectively at opposite edges of two side frames, each of the connector interfaces corresponding respectively to the protruding portions; a pair of sliding bars having at least one sliding element at one end of each of the pair of sliding bars; a pair of stationary bars; and a pair of guide tracks mounted respectively in the interiors of two side walls of the first support frame, allowing the sliding elements to move along the guide tracks. | 12-18-2008 |
Chih-Cheng Chang, Hualien County TW
| Patent application number | Description | Published |
|---|---|---|
| 20100021426 | Methods for making and compositions comprising fermentation products of cordyceps sinensis - The present invention relates to novel and non-obvious methods and media for preparing fermentation products of | 01-28-2010 |
Chih-Cheng Chang, Shulin City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120098397 | Sliding hinge and a portable device with the sliding hinge - A portable device has lower and upper casings. A sliding hinge has a stationary frame attached to the lower casing, a sliding frame attached to the upper casing and a resilient positioning assembly mounted between the stationary and sliding frames. The sliding frame has multiple pushing pins protruding toward the stationary frame. The resilient positioning assembly has two sliders and multiple resilient elements disposed between and abutting the sliders. When the upper casing slides relative to the lower casing, the pushing pins move along and push corresponding sliders and pressing the resilient elements. As long as the pushing pins are moved to the other sides of the corresponding sliders, the resilient elements push the sliders back and the upper and lower casings of the portable device are open relative to each other. | 04-26-2012 |
Chih-Cheng Cheng, Banqiao City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110090317 | STEREOVISION SYSTEM AND METHOD FOR CALCUALTING DISTANCE BETWEEN OBJECT AND DIFFRACTIVE OPTICAL ELEMENT - A stereovision system is disclosed, which comprises: at least one diffractive optical element and an optical imaging device. Each of the diffractive optical element is used for allowing a first beam containing information relating to an object to pass through and thus transforming the same into a second beam containing information relating to the object. The optical imaging device is used for receiving the second beam so as to concentrate the energy thereof for forming an M | 04-21-2011 |
Chih-Cheng Chien, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110001229 | PACKAGE STRUCTURE AND PACKAGE PROCESS - A package structure including a circuit substrate, at least a chip, leads and an encapsulant is provided. The circuit substrate has a first surface, a second surface opposite to the first surface, and contacts disposed on the first surface. The chip is disposed on the second surface of the circuit substrate and electrically connected to the circuit substrate. The said leads are disposed on the periphery of the second surface and surround the chip. Each lead has an inner lead portion and an outer lead portion and is electrically connected to the circuit substrate via the inner lead portion. The encapsulant encapsulates the circuit substrate, the chip and the inner lead portion and exposes the first surface of the circuit substrate and the outer lead portion, wherein the upper surface of the encapsulant and the first surface of the circuit substrate are coplanar with each other. | 01-06-2011 |
Chih-Cheng Chien, Sanchong TW
| Patent application number | Description | Published |
|---|---|---|
| 20100146322 | METHOD FOR OVERCLOCKING CENTRAL PROCESSING UNIT OF COMPUTER MOTHERBOARD - A method for overclocking a central processing unit (CPU) of a computer motherboard is disclosed. Step A is to set a second frequency of front side bus (FSB) by an operating interface of BIOS. Step B is to determine FSB frequency F | 06-10-2010 |
Chih-Cheng Chiu, Xinzhung TW
| Patent application number | Description | Published |
|---|---|---|
| 20110006401 | METHOD AND SYSTEM FOR COMBINING PHOTOMASKS TO FORM SEMICONDUCTOR DEVICES - A photomask set includes at least two masks that combine to form a device pattern in a semiconductor device. Orthogonal corners may be produced in a semiconductor device pattern to include one edge defined by a first mask and an orthogonal edge defined by a second mask. The mask set may include a first mask with compensation features and a second mask with void areas overlaying the compensation features when the first and second masks are aligned with one another, such that the compensation features are removed when patterns are successfully formed from the first and second masks. The compensation features alleviate proximity effects during the formation of device features. | 01-13-2011 |
Chih-Cheng Hsu, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20090119265 | DISTRIBUTED MULTIMEDIA ACCESS SYSTEM AND METHOD - A distributed media access system and method. The method includes making each of a plurality nodes in a P2P network designate at least one nearest neighbors as a first node candidate and perform at least one random walk to obtain a second node candidate according to the peer list; calculating user preferences of the request node and user preferences of the first and second node candidates according to the first and second node candidates and the preference parameters corresponding to the first and second node candidates so as to obtain a plurality of similarity values; selecting the more similar candidate as buddies of user of the node according to the calculated similarity values; and establishing a buddy list according to the buddies of user and storing the buddy list such that the P2P network can quickly find buddies of the node through the buddy list. | 05-07-2009 |
| 20110102730 | LIQUID CRYSTAL DEVICE - The invention provides a liquid crystal device. The liquid crystal device includes a first transparent substrate and a second transparent substrate, wherein the first transparent substrate and the second transparent substrate are parallel to each other. Spacers are formed between the first transparent substrate and the second transparent substrate, to define a cavity; and a cholesteric liquid crystal is disposed into the cavity. Particularly, the liquid crystal device is coupled to a supply voltage, and three states of the liquid crystal device are selectively switched by adjusting the voltage, wherein the three states includes a first transparent state, a scattering state and a second transparent state. | 05-05-2011 |
Chih-Cheng Hsu, Rochester Hills, MI US
| Patent application number | Description | Published |
|---|---|---|
| 20100052360 | Door Assembly and Method for a Vehicle - A door assembly for a vehicle includes an outer panel. A support panel is operatively connected to the outer panel and configured such that the support panel provides bending resistance to the outer panel when the outer panel is deflected toward the support panel during a first deflection distance of the outer panel. A cable is operatively connected in the door assembly between a first end and a second end of the outer panel such that the cable provides additional bending resistance to the outer panel when the outer panel is deflected toward the support panel during a second deflection distance of the outer panel, greater than the first deflection distance. | 03-04-2010 |
| 20110113697 | AUTOMOTIVE VEHICLE DOOR CONSTRUCTION - One embodiment includes a lightweight automotive vehicle door construction including an inner panel partially formed from a lightweight metal casting. The casting provides a toe pan, hinge pillar and beltline. A lightweight stamping connected with the casting provides a remainder of the inner skin. The stamping provides an opposite pillar and latch mount. A header connected to the casting along a first end and with the beltline at a second end provides a window frame. A side intrusion beam extends between the hinge pillar and the opposite pillar. An outer panel is connected with the inner panel. | 05-19-2011 |
| 20110274957 | SECONDARY BATTERY MODULE AND COMPOSITE ARTICLE THEREOF - A composite article for dissipating thermal energy from a secondary battery cell includes a first graphite layer, a second graphite layer spaced away from and arranged parallel to the first graphite layer, and a metal layer sandwiched between and disposed in contact with each of the first graphite layer and the second graphite layer. The composite article has a thermal conductivity of greater than or equal to about 1,200 W/mK and an electrical conductivity of greater than or equal to about 10,000 S/cm. A secondary battery module includes the composite article and a secondary battery cell having a length and an average measurable temperature along the length during operation of the secondary battery module. The composite article is disposed adjacent and in contact with the secondary battery cell to thereby dissipate thermal energy from the secondary battery cell during operation of the secondary battery module. | 11-10-2011 |
| 20110293992 | BATTERY CONNECTION TOPOLOGY - A battery module comprising a plurality of battery cells arranged in a stacked configuration, each of the battery cells including a first terminal disposed on a first end of the battery cell and a second terminal disposed on a second end of the battery cell, wherein the first terminal of at least one of the battery cells is in direct electrical communication with the second terminal of another non-adjacent one of the battery cells. | 12-01-2011 |
| 20120061998 | ALUMINUM ROOF PANEL FOR ATTACHMENT TO SUPPORTING STEEL VEHICLE BODY MEMBERS - The substitution of aluminum alloy roof panels for the low carbon steel roof panels most commonly used in motor vehicles is an attractive option for vehicle mass reduction. Often, however, the remainder of the vehicle body structure continues to be fabricated of steel. The combination of the aluminum alloy roof attached to the steel body may create compressive stresses in the aluminum roof when the body is subjected to elevated temperatures such as those required to cure or bake the paint applied to the body. These stresses may lead to unacceptable appearance features in the visible segment of the roof. By modifying the roof stamping to introduce a tabbed flange for attachment to the body and/or modifying the generally-vertical wall joining the flange to the roof interior, the stresses may be minimized and relocated to segments of the roof not normally visible. | 03-15-2012 |
Chih-Cheng Hsu, Chu-Pei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110024610 | IMAGE SENSOR PACKAGE STRUCTURE - The present invention discloses an image sensor package structure. The image sensor package structure includes a substrate, a chip, a transparent lid, a first casing and a package material. The transparent lid covers a sensitization area of the chip and it also adheres to the chip which is deposed on the substrate. The first casing, which adheres to the transparent lid, forms an opening so that light can pass through the opening and the transparent lid to enter into the sensitization area. The package material covers around the chip and the transparent lid and fills between the substrate and the first casing. Because of the arrangement of adhesive layers placed between the first casing and the transparent lid and between the transparent lid and the chip, the blockage area from moisture is elongated. Therefore, the reliability of the image sensor package structure can be enhanced. | 02-03-2011 |
| 20110024861 | MANUFACTURING METHOD FOR MOLDING IMAGE SENSOR PACKAGE STRUCTURE AND IMAGE SENSOR PACKAGE STRUCTURE THEREOF - A manufacturing method for molding an image sensor package structure and the image sensor package structure thereof are disclosed. The manufacturing method includes following steps of providing a half-finished image sensor for packaging, arranging a dam on the peripheral of a transparent lid of the half-finished image sensor, positioning the half-finished image sensor within a mold, and injecting a mold compound into the mold cavity of the mold. The dam is arranged on the top surface of the transparent lid and the inner surface of the mold can exactly contact with the top surface of dam so that the mold compound injected into the mold cavity is prevented from overflowing to the transparent lid by the dam. Furthermore, the arrangement of the dam and the mold compound can increase packaged areas and extend blockage to invasive moisture so as to enhance the reliability of the image sensor package structure. | 02-03-2011 |
Chih-Cheng Hsu, Chu-Pei TW
| Patent application number | Description | Published |
|---|---|---|
| 20110024862 | IMAGE SENSOR PACKAGE STRUCTURE WITH LARGE AIR CAVITY - The present invention discloses an image sensor package structure with a large air cavity. The image sensor package structure includes a substrate, a chip, a cover and a package material. The chip is combined with the substrate. A plastic sheet of the cover is adhered to the chip and a transparent lid of the cover is combined with the plastic sheet to provide a covering over a sensitization area of the chip so as to form an air cavity. The package material is arranged on the substrate and encapsulated around the chip and the cover. The plastic sheet having a predetermined thickness can increase the distance between the transparent lid and the chip to enlarge the air cavity. Thus, the image-sensing effect of the image sensor package structure can be improved and the ghost image problem resulting from multi-refraction and multi-reflection of light can be minimized. | 02-03-2011 |
| 20110241146 | MANUFACTURING METHOD AND STRUCTURE OF A WAFER LEVEL IMAGE SENSOR MODULE WITH PACKAGE STRUCTURE - The present invention discloses a manufacturing method and structure of a wafer level image sensor module with package structure. The structure of the wafer level image sensor module with package structure includes a semi-finished product, a plurality of solder balls, and an encapsulant. The semi-finished product includes an image sensing chip and a wafer level lens assembly. The encapsulant is disposed on lateral sides of the image sensing chip and the wafer level lens assembly. Also, the manufacturing method includes the steps of: providing a silicon wafer, dicing the silicon wafer, providing a lens assembly wafer, fabricating a plurality of semi-finished products, performing a packaging process, mounting the solder balls, and cutting the encapsulant. Accordingly, the encapsulant encapsulates each of the semi-finished products by being disposed on the lateral sides thereof. | 10-06-2011 |
| 20110241147 | WAFER LEVEL IMAGE SENSOR PACKAGING STRUCTURE AND MANUFACTURING METHOD OF THE SAME - The present invention discloses a wafer level image sensor packaging structure and a manufacturing method of the same. The manufacturing method includes the following steps: providing a silicon wafer, dicing the silicon wafer, providing a plurality of transparent lids, fabricating a plurality of semi-finished products, performing a packaging process, mounting solder balls, and cutting an encapsulant between the semi-finished products. The manufacturing method of the invention has the advantage of being straightforward, uncomplicated, and cost-saving. Thus, the wafer level image sensor package structure is lightweight, thin, and compact. To prevent the image sensor chip from cracking on impact during handling, the encapsulant will be arranged on the lateral sides of the semi-finished products during the packaging process. | 10-06-2011 |
Chih-Cheng Huang, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20110256231 | METHOD FOR PREPARING A MICRO-PARTICLE DRUG IN HEMISPHERE-SHAPED DOSAGE FORM AND APPLICATIONS THEREOF - A method for preparing drug in hemisphere-shaped dosage form. A high molecular weight solution containing the drug is prepared, and the solution is then dropped on a base material. The interface phenomena between the solution and different base materials makes the drop of high molecular weight solution containing the drug form a hemisphere-shape. After solidifying by cross-link or evaporation, the drug in hemisphere-shaped dosage form is obtained. The advantages of the preparation method are a simple and fast process, and simple operation. Applications of the method to prepare a drug in hemisphere-shaped dosage form are also provided. | 10-20-2011 |
Chih-Cheng Lee, Taipei County TW
| Patent application number | Description | Published |
|---|---|---|
| 20120032331 | CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF AND PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A circuit substrate includes the following elements. A conductive layer and a dielectric layer are disposed on an inner circuit structure in sequence, and a plurality of conductive blind vias are embedded in the dielectric layer and connected to a portion of the conductive layer. A plating seed layer is disposed between each of the first blind vias and the first conductive layer. Another conductive layer is disposed on the dielectric layer, wherein a portion of the another conductive layer is electrically connected to the conductive layer through the conductive blind vias. A third plating seed layer is disposed between the third conductive layer and each of the first blind vias and on the first dielectric layer. | 02-09-2012 |
Chih-Cheng Lee, Banchiao City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100163287 | SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF - A substrate structure is provided. The substrate structure includes a substrate, a first insulation layer, a conductive part, a second insulation layer, a seed layer and a conductive layer. The substrate has a first circuit pattern layer and a second circuit pattern layer, which are located on two opposite surfaces of the substrate respectively. The first insulation layer formed on the first circuit pattern layer has a first insulation hole, which exposes a first opening in the outer surface of the first insulation layer. The conductive part formed on the first insulation hole for electrically connecting with a chip is enclosed by the edge of the first opening. The second insulation layer formed on the second circuit pattern layer has a second insulation hole in which the seed layer is formed. The conductive layer is formed on the seed layer for electrically connecting with a circuit board. | 07-01-2010 |
| 20110056739 | SUBSTRATE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a substrate structure is provided. The method includes the following steps. A substrate is provided. The substrate has a patterned first metal layer, a pattern second metal layer and a through hole. After that, a first dielectric layer and a second dielectric layer are formed at a first surface and a second surface of the substrate, respectively. The second surface is opposite to the first surface. Then, the first dielectric layer and the second dielectric layer are patterned. After that, a first trace layer is formed at a surface of the patterned first dielectric layer. The first trace layer is embedded into the patterned first dielectric layer and is coplanar with the first dielectric layer. Then, a second trace layer is formed on a surface of the second dielectric layer. | 03-10-2011 |
Chih-Cheng Liao, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20100133398 | ELECTRONIC DEVICE WITH MAGNETIC SUPPORTING STRUCTURE - A linkage and a supporter are attached to a back of the housing via a magnetic element of an electronic device with a magnetic supporter. The supporter is drawn to a supporting position via the linkage to support the electronic device body and provide various angles for the user to easily operate the electronic device in several modes. Moreover, since the linkage and the supporter are attached via the magnetic element, when the electronic device body is overloaded, for example, a user applies overlarge force to operate a touch panel, the magnetic element is detached from the electronic device body to prevent the linkage and the supporter from being damaged or permanently destroyed. | 06-03-2010 |
Chih-Cheng Lin, Sinhua Township TW
| Patent application number | Description | Published |
|---|---|---|
| 20090251287 | Electronic vehicle license and a reading and writing control device therefor - An electronic vehicle license is installed on a vehicle to store a record and insurance data of the vehicle, and a reading and writing control device is provided for an authority/official organization to read and write data into the electronic vehicle license; the electronic vehicle license includes a storage unit, a non-contact transferring unit, and a central processing unit; the reading and writing control device includes a central controlling unit, which has a weight assigned thereto in accordance with a jurisdiction of the authority that is authorized to use the reading and writing control device so that the central controlling unit is allowed to handle certain categories of data; the reading and writing control device further includes an encrypting and decrypting unit, a non-contact transferring unit, and a displaying unit to show the data of the vehicle license. | 10-08-2009 |
Chih-Cheng Lin, Hsin Chuang City TW
Chih-Cheng Lin, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20090119689 | OPTICAL DISC DRIVE - An optical disc drive suitable for reading a data in an optical disc is provided. The optical disc drive includes a housing, a tray suitable for carrying the optical disc, and a panel. The housing has a first opening, and the panel is disposed at the first opening. The tray is disposed in the housing. The tray has a blocking plate. The blocking plate is disposed on a front edge of the tray, and multiple protrusions are disposed on an upper edge of the blocking plate. Furthermore, the panel has a second opening, and the second opening has multiple notches corresponding to the protrusions. The tray is suitable for exiting out of the housing through the second opening, and the protrusions are suitable for passing through the notches. | 05-07-2009 |
Chih-Cheng Lin, Taipei Hsien 221 TW
| Patent application number | Description | Published |
|---|---|---|
| 20100026592 | Antenna module and an electronic device having the antenna module - An antenna module for wireless signal transmission of an electronic device is disclosed. The antenna module comprises an antenna body and a fixing part. The antenna body comprises a radiating element, a grounding element, a connecting element, and a feeding point. The radiating element has a first radiating area and a second radiating area. The connecting element has a first end and a second end. The first end is connected with the first radiating area of the radiating element and the second end is connected with the grounding element. The feeding point is disposed on the radiating element and is used to feed a signal. The fixing part comprises a main body and a first clip portion. The main body is used to match the shape of the antenna body. The first clip portion is used to clip and fix the antenna body. | 02-04-2010 |
Chih-Cheng Lin, Gi-An Hsiang TW
| Patent application number | Description | Published |
|---|---|---|
| 20080277341 | Method for Making Reverse Osmosis Permeate Water and Mineral Water From Deep Seawater - A method for making reverse osmosis permeate water and mineral water from deep seawater includes the steps of: a) sand-filtering or ultra-filtering the deep seawater; b) conducting a first nano-filtering step to nano-filter the deep seawater after the step a) to obtain first nano-filtration permeate water and first nano-filtration concentrated water; c) filtering the first nano-filtration permeate water using a reverse osmosis apparatus to obtain reverse osmosis permeate water and reverse osmosis concentrated water; and d) treating the first nano-filtration concentrated water by electrodialysis to obtain anion-rich water, cation-rich water, and mineral water. | 11-13-2008 |
Chih-Cheng Liu, Danshuei Township TW
| Patent application number | Description | Published |
|---|---|---|
| 20080228328 | OMNIDIRECTIONAL MOVEMENT CONTROL SYSTEM - The present invention discloses an omnidirectional movement control system, having a move signal generator for generating a plurality of movement signals based on a plurality of first position signals and a plurality of second position signals, and an omnidirectional movement controller for generating a plurality of pulse width modulation signals and a plurality of motor direction change signals based on the movement signals and a plurality of motor encoding disc signals, and a driving circuit for driving motors to rotate a plurality of omnidirectional wheels based on the pulse width modulation signals and the motor direction change signals, such that a mobile platform can be moved in any direction and rotated in different directions, so as to provide excellent mobility and flexibility to the mobile platform. | 09-18-2008 |
Chih-Cheng Peng, Singapore Science Park Lll SG
| Patent application number | Description | Published |
|---|---|---|
| 20110076416 | METHOD OF MAKING POROUS MATERIALS AND POROUS MATERIALS PREPARED THEREOF - The present invention concerns a method of making a porous material comprising the following steps in the order a-b-c-d: | 03-31-2011 |
Chih-Cheng Tsai, Pingtung Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20090286449 | SEESAW-TYPED INFLATABLE PUPPET - A seesaw-typed inflatable puppet has an inflatable and seesaw-typed main body, a first envelope, a second envelope, a blower generating air and being connected to the main body and a valve assembly being connected between the first envelope and the second envelope. The air generated by the blower flows into the main body to inflate the main body, selectively flows into the first envelope to deflate the second envelope and flows into the second envelope to deflate the first through the valve assembly. Thus, the first envelope and the second envelope inflate and deflate alternatively. The main body swings back and forth like a seesaw and performs entertaining and novel movements. | 11-19-2009 |
Chih-Cheng Wang, Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110090106 | DIGITAL-TO-ANALOG CONVERTER WITH MULTI-SEGMENTED CONVERSION - A 12-bit DAC includes a resistor string, three 16-to-1 selectors and an adder. The 12-bit DAC receives a 12-bit digital input data and provides a corresponding analog output voltage with 3-segmented conversion. The resistor string includes a plurality of voltage-dividing units for providing a plurality of reference voltages corresponding to each segment of conversion. After receiving the plurality of reference voltages generated by the resistor string, the three 16-to-1 selectors output 3 reference voltages corresponding to the three segments of conversion according to the 4 most significant bits, 4 least significant bits and the other 4 bits in the 12-bit digital input data, respectively. The adder can then generate the corresponding output analog voltage by summing the 3 reference voltages. | 04-21-2011 |
Chih-Cheng Yang, Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20080256400 | System and Method for Information Handling System Error Handling - Non-fatal errors at an information handling system link are managed by firmware of the information handling system. For example, a PCI Express link controller initiates an SMI interrupt upon detection of a non-fatal error associated with the PCI Express link. A non-fatal error monitor associated with an SMI handler in the BIOS of the information handling system receives the interrupt, determines the component of the information handling system associated with non-fatal error and issues an error message if the non-fatal error meets a predetermined condition, such as a predetermined number of errors associated with the component. | 10-16-2008 |
| 20090292910 | SYSTEM AND METHOD OF ACCESSING BIOS CHANGE SUMMARY INFORMATION WITHIN A BIOS OPERATING ENVIRONMENT - A system and method of accessing basic input output system (BIOS) change summary information within a BIOS operating environment is disclosed. According to an aspect, a basic input output system (BIOS) set-up interface is disclosed. The BIOS set-up interface includes a navigation routine accessible via a BIOS set-up menu and operable to initiate displaying a secondary user display interface. The BIOS set-up interface further includes a BIOS change summary interface accessible using the secondary display user interface and configured to display BIOS set-up changes made using the BIOS set-up menu. | 11-26-2009 |
| 20100037044 | Method and system for using a server management program for an error configuration table - Methods and systems are disclosed for using a server management program for an error configuration table, wherein a user loads the management program, which receives a Hardware Error Configuration Table (HECT) from baseboard management controller (BMC) firmware, the HECT table containing error control parameters for a hardware error event table. A replica of the HECT is maintained in SRAM using BMC firmware. The HECT is sent via the basic input output system (BIOS) during system power up. An interface is set up to allow the user to configure error event thresholds. The user can set preferred threshold of a system management requirement without rebooting system. If the user makes changes to the HECT, the management program sends the new HECT to BMC firmware to feedback the completion. A software SMI is issued to inform BIOS of HECT changes during the BMC completion. BIOS informs the operating system (OS) to discard and reload the new HECT. | 02-11-2010 |