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Chih-Chao
Chih-Chao Chang, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20090189716 | FILTER DEVICE WITH FINITE TRANSMISSION ZEROS - A filter device with transmission zeros is provided according to the present invention, which has an odd mode resonant frequency and an even mode resonant frequency. The filter device includes: a substrate, a metallic rectangular ring, a signal couple-in/couple-out module, and a metallic ground plane, wherein the surface of said metallic ground plane is parallel to the plane enclosed by said metallic rectangular ring, and said metallic rectangular ring applied to the filter device of the present invention has a perimeter shorter than or equal to the wavelength corresponding to the mean of said odd mode resonant frequency and said even mode resonant frequency, thereby allowing said filter device of the present invention, in a situation of specific bandpass frequency, to reduce its perimeter to about half of the perimeter of conventional annular rectangular dual mode filters. In addition, the locations of the transmission zeros can be changed by adjusting the length/width ratio of said metallic rectangular ring, and the frequency response of the filter signal can also be reduced by disposing a ground capacitor module. Accordingly, the area of the dual mode filter can be greatly reduced. Furthermore, the frequency response of the filter signal can be increased by disposing a ground inductor module, accordingly, decreasing the size of dual mode filter and providing a means of easy fabrication thereof. | 07-30-2009 |
| 20100096306 | WATER FILTER WITH STERILIZING FUNCTION - A water filter with a sterilizing function has a filtering device, a sterilizing device and a pipe connecting the filtering device and the sterilizing device. The filtering device has a water inlet and a water outlet. The water inlet is connected with a water supplying pipe for receiving water. The sterilizing device has an inlet and an outlet. The outlet is connected with an output pipe for providing water. The inlet is connected to the water outlet of the filtering device. The water flows through the filtering device and the sterilizing device as it goes through the water filter. Therefore, chemical materials and bacteria in the drinking water are removed. | 04-22-2010 |
Chih-Chao Chang, Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110291984 | CAPACITIVE TOUCH PANEL AND GHOST POINT DETERMINATION METHOD - A capacitive touch panel and a ghost point determination method are provided. The capacitive touch panel includes a touch sensing plate and a touch sensing module. The touch sensing plate includes a plurality of sensing units. The sensing units are disposed along a first direction and a second direction to from an array. Capacitance values of the sensing units are decreased gradually along the first direction. The touch sensing module is coupled to the touch sensing plate for sensing at least two real touch points. | 12-01-2011 |
Chih-Chao Yang, Poughkeepsie TW
| Patent application number | Description | Published |
|---|---|---|
| 20080280434 | Enhanced Mechanical Strength Via Contacts - The present invention provides an enhanced interconnect structure with improved reliability. The inventive interconnect structure has enhanced mechanical strength of via contacts provided by embedded metal liners. The embedded metal liners may be continuous or discontinuous. Discontinuous embedded metal liners are provided by a discontinuous interface at the bottom of the via located within the interlayer dielectric layer. | 11-13-2008 |
Chih-Chao Yang, Beacon, NY US
| Patent application number | Description | Published |
|---|---|---|
| 20080220608 | MODIFIED VIA BOTTOM STRUCTURE FOR RELIABILITY ENHANCEMENT - The present invention provides an interconnect structure that can be made in the BEOL which exhibits good mechanical contact during normal chip operations and does not fail during various reliability tests as compared with the conventional interconnect structures described above. The inventive interconnect structure has a kinked interface at the bottom of a via that is located within an interlayer dielectric layer. Specifically, the inventive interconnect structure includes a first dielectric layer having at least one metallic interconnect embedded within a surface thereof; a second dielectric layer located atop the first dielectric layer, wherein said second dielectric layer has at least one aperture having an upper line region and a lower via region, wherein the lower via region includes a kinked interface; at least one pair of liners located on at least vertical walls of the at least one aperture; and a conductive material filling the at least one aperture. | 09-11-2008 |
| 20080254643 | STRUCTURE TO IMPROVE ADHESION BETWEEN TOP CVD LOW-K DIELECTRIC AND DIELECTRIC CAPPING LAYER - An interconnect structure in which the adhesion between an upper level low-k dielectric material, such as a material comprising elements of Si, C, O, and H, and an underlying diffusion capping dielectric, such as a material comprising elements of C, Si, N and H, is improved by incorporating an adhesion transition layer between the two dielectric layers. The presence of the adhesion transition layer between the upper level low-k dielectric and the diffusion barrier capping dielectric can reduce the chance of delamination of the interconnect structure during the packaging process. The adhesion transition layer provided herein includes a lower SiO | 10-16-2008 |