Patent application number | Description | Published |
20120268147 | STRUCTURE FOR MEASURING BUMP RESISTANCE AND PACKAGE SUBSTRATE COMPRISING THE SAME - A structure for measuring bump resistance and a package substrate comprising the same are disclosed, the structure for measuring bump resistance of the present invention comprises: plural connecting bumps arranged in a row; at least one first connecting element; and at least one second connecting element; wherein the nth connecting bump and the (n+1)th connecting bump connect by the first connecting element, the (n+1)th connecting bump and the (n+2)th connecting bump connect by the second connecting element, n is an odd number of 1 or more; the first connecting element connects with a first voltage-measurement pad; the second connecting element connects with an auxiliary pad, the auxiliary pad connects with an auxiliary bump, a second voltage-measurement pad connects with the auxiliary bump. | 10-25-2012 |
20130009071 | SPECIMEN BOX FOR ELECTRON MICROSCOPE - The present invention relates to a specimen box for an electron microscope, comprising a first substrate, a second substrate, one or more photoelectric elements, and a metal adhesion layer. The first substrate has a first surface, a second surface, a first concave, and one or more first through holes, wherein the first through holes penetrate through the first substrate. The second substrate has a third surface, a forth surface, and a second concave. The photoelectric element is disposed between the first substrate and the second substrate. In addition, the metal adhesion layer is disposed between the first substrate and the second substrate to form a space for a specimen contained therein. Besides, the present specimen box further comprises one or more plugs. When the plugs are assembled into the first through holes to seal the specimen box, the in-situ observation can be accomplished by using the electron microscope. | 01-10-2013 |
20130009072 | SPECIMEN BOX FOR ELECTRON MICROSCOPE - The present invention relates to a specimen box for an electron microscope, which comprises a first substrate, a second substrate, and a metal adhesion layer. The first substrate has a first surface, a second surface, a first concave, and one or more first through holes, wherein the first through hole penetrates through the first substrate. The second substrate has a third surface, a forth surface, and a second concave. Besides, the metal adhesion layer is disposed between the first substrate and the second substrate to form a space for a specimen placed therein. In addition, the specimen box of the present invention further comprises one or more plugs. When the plug is assembled into the first through hole to seal the specimen box, the in-situ observation can be accomplished by using an electron microscope. | 01-10-2013 |
20130009143 | PHOTO SENSOR AND METHOD OF FABRICATING THE SAME - A photo sensor and a method of fabricating the same are disclosed, the photo sensor of the present invention has ultra-high Schottky junction area per unit volume, and the photo sensor comprises: a first conductive layer; plural metallic nanowires, in which one end of each metallic nanowire connects with the first conductive layer and is covered with a semiconductive layer having a width of 1 nm to 20 nm; and a second conductive layer locating opposite to the first conductive layer, whereby the plural metallic nanowires locate between the first conductive layer and the second conductive layer, and the semiconductive layer contacts with the second conductive layer, wherein the photo sensor of the present invention is used to detect ultra violet (UV) light with a wavelength of 10 nm-400 nm. | 01-10-2013 |
20130037940 | METHOD FOR INHIBITING GROWTH OF INTERMETALLIC COMPOUNDS - The present invention relates to a method for inhibiting growth of intermetallic compounds, comprising the steps of: (i) preparing a substrate element including a substrate on which at least one layer of metal pad is deposited, wherein at least one thin layer of solder is deposited onto the layer of metal pad, and then carry out reflowing process; and (ii) further depositing a bump of solder with an appropriate thickness on the substrate element, characterized in that a thin intermetallic compound is formed by the reaction of the thin solder layer and the metal in the metal pad after appropriate heat treatment of the thin solder layer. In the present invention, the formation of a thin intermetallic compound is able to slow the growth of the intermetallic compound and to prevent the transformation of the intermetallic compounds. | 02-14-2013 |
20130122326 | Electrodeposited Nano-Twins Copper Layer and Method of Fabricating the Same - An electrodeposited nano-twins copper layer, a method of fabricating the same, and a substrate comprising the same are disclosed. According to the present invention, at least 50% in volume of the electrodeposited nano-twins copper layer comprises plural grains adjacent to each other, wherein the said grains are made of stacked twins, the angle of the stacking directions of the nano-twins between one grain and the neighboring grain is between 0 to 20 degrees. The electrodeposited nano-twins copper layer of the present invention is highly reliable with excellent electro-migration resistance, hardness, and Young's modulus. Its manufacturing method is also fully compatible to semiconductor process. | 05-16-2013 |
20130302646 | Electric connecting structure comprising preferred oriented Cu6Sn5 grains and method for fabricating the same - An electric connecting structure comprising preferred oriented Cu | 11-14-2013 |
20140090880 | ELECTRICAL CONNECTING ELEMENT HAVING NANO-TWINNED COPPER, METHOD OF FABRICATING THE SAME, AND ELECTRICAL CONNECTING STRUCTURE COMPRISING THE SAME - An electrical connecting element, a method of fabricating the same, and an electrical connecting structure comprising the same are disclosed. The method of fabricating the electrical connecting structure having twinned copper of the present invention comprises steps of: (A) providing a first substrate; (B) forming a nano-twinned copper layer on part of a surface of the first substrate; (C) forming a solder on the nano-twinned copper layer of the first substrate; and (D) reflowing the nano-twinned Cu layer and solder to produce a solder joint, wherein at least part of the solder reacts with the nano-twinned copper layer to produce an intermetallic compound (IMC) layer which comprises a Cu | 04-03-2014 |
20140103501 | CIRCUIT BOARD WITH TWINNED CU CIRCUIT LAYER AND METHOD FOR MANUFACTURING THE SAME - A circuit board with twinned Cu circuit layer and a method for manufacturing the same are disclosed, wherein the method comprises the following steps: (A) providing a substrate with a first circuit layer formed thereon, wherein the first circuit layer comprises a conductive pad; (B) forming a first dielectric layer on the surface of the substrate; (C) forming plural openings in the first dielectric layer, wherein each opening penetrates through the first dielectric layer and communicates with the conductive pad to expose the conductive pad; (D) forming a Cu seeding layer in the openings; (E) forming a nano-twinned Cu layer in the openings with an electroplating process; and (F) annealing the substrate to transfer the material of the Cu seeding layer into nano-twinned Cu, wherein the nano-twinned Cu layer and the transferred Cu seeding layer are formed into a second circuit layer. | 04-17-2014 |
20150064496 | SINGLE CRYSTAL COPPER, MANUFACTURING METHOD THEREOF AND SUBSTRATE COMPRISING THE SAME - The present invention relates to a single crystal copper having [100] orientation and a volume of 0.1˜4.0×10 | 03-05-2015 |
Patent application number | Description | Published |
20100090827 | Location based proximity alert - A method of location based proximity alert retrieves, from a location based proximity alert physical server, a current location of wireless client devices and determines if it is within a given area. The method accesses, from the location based proximity alert physical server, a physical law enforcement database comprising a restraining order target identifier and a restraining order limit identifier. A geo-proximity alert message is transmitted if the current location of the restraining order target identifier matches the restraining order limit identifier. | 04-15-2010 |
20100093371 | Location based geo-reminders - Location based geo-reminding system retrieves, from a location based geo-reminder physical server, a current location of wireless client devices within a given area. The method accesses, from the location based geo-reminder physical server, a physical location based geo-reminder database comprising an identity of a trigger identifier and a limits of trigger identifier. Transmission of a location based geo-reminder message is initiated if the current location of a particular wireless client device is within a limits of restriction distance from a location of the identity of the trigger. | 04-15-2010 |
20140002262 | Location Based Proximity Alert | 01-02-2014 |
20150057029 | Location Based Geo-Reminders - Location based geo-reminding system retrieves, from a location based geo-reminder physical server, a current location of wireless client devices within a given area. The method accesses, from the location based geo-reminder physical server, a physical location based geo-reminder database comprising an identity of a trigger identifier and a limits of trigger identifier. Transmission of a location based geo-reminder message is initiated if the current location of a particular wireless client device is within a limits of restriction distance from a location of the identity of the trigger. | 02-26-2015 |