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Chien-Yi
Chien-Yi Chang, Hsinchu City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090134936 | CHARGE PUMP CIRCUIT AND CELL THEREOF - A charge pump cell with an input and output nodes includes a first, second, and third equalization units, and a first, second, and third capacitors. The input node is coupled to the inputs of the first, second and third equalization units, and the output node is coupled to the second equalization unit. One end of the second capacitor is coupled to the control end of the first equalization unit for enabling or disabling the first equalization unit, and also coupled to the output of the third equalization unit. One end of the third capacitor is coupled to the output of the second equalization unit. One end of the first capacitor is coupled to the control ends of the second and third equalization units, and also coupled to the output of the first equalization unit. | 05-28-2009 |
Chien-Yi Chen, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20080304021 | LIGHT-SHIELDING MODULE AND PROJECTION APPARATUS USING THE SAME - A light-shielding module including a bracket, a pendulous member, a shielding member, a first magnet, a second magnet and a first coil is provided. The pendulous member has a first end and a second end opposite to each other and is pivoted on the bracket. The first end extends along a direction from a pivoting place of the pendulous member to a top of the bracket. The shielding member is connected to the first end. The first magnet is disposed at the pendulous member and located between the pivoting place and the first end. The second magnet is disposed at the pendulous member and adjacent to the second end. A mass-of-center of the second magnet is located beside a center line passing a center-of-mass of the first magnet and the pivoting center. The first coil is disposed on one of the first side wall and the second side wall. | 12-11-2008 |
Chien-Yi Chen, Niaosong Township TW
| Patent application number | Description | Published |
|---|---|---|
| 20080236667 | Photovoltaic cell, enhanced spectrum conversion film, preparation of enhanced spectrum conversion film - Photovoltaic cell and enhanced spectrum conversion film enhanced spectrum conversion film that moves light emitting spectrum between solar radiation peak wavelength (λ=470 nm) and maximum sensitive wavelength of monocrystal silicon chip to light (λ=860˜880 nm) with battery percent of effectiveness 14˜16%. The enhanced spectrum conversion film transfers radiation of solar short-wavelength visible light to yellow and yellow orange color. The enhanced spectrum conversion film is an oxygen-contained polymer filled with fluorescent powder particles that are prepared from an oxide compound of group II or III and using a starter that has electron transition in d-layer and f-layer. The fluorescent powder is composed of aluminate solid solution of barium and yttrium, having the chemical formula Ba | 10-02-2008 |
Chien-Yi Chen, Hsin-Chu TW
| Patent application number | Description | Published |
|---|---|---|
| 20100072635 | Protecting Sidewalls of Semiconductor Chips using Insulation Films - A method of forming an integrated circuit structure includes providing a wafer having a first semiconductor chip, a second semiconductor chip, and a scribe line between and adjoining the first semiconductor chip and the second semiconductor chip; forming a notch in the scribe line, wherein the notch has a bottom no higher than a top surface of a semiconductor substrate in the wafer; forming a first insulation film over the wafer, wherein the first insulation film extends into the notch; removing a portion of the first insulation film from a center of the notch, wherein a remaining portion of the first insulation film comprises an edge in the notch; and sawing the wafer to separate the first semiconductor chip and the second semiconductor chip. | 03-25-2010 |
Chien-Yi Chen, Tu-Cheng TW
| Patent application number | Description | Published |
|---|---|---|
| 20100051344 | TESTING DEVICE - A testing device includes a shielding case and a driving member opening and closing the shielding case. The shielding case includes a receiving space for receiving an electronic device therein, a cover, and a base. The driving member includes a first driving member mechanically connected to an outside of the cover of the shielding case and a second driving member mechanically connected to an outside of the base of the shielding case. The first driving member moves the cover vertically relative to the base. The second driving member moves the base horizontally relative to the cover. Movement of the shielding case in an open position allows the electronic device to be received in or removed from the shielding case. Movement of the shielding case in a closed position allows the electronic device to be tested. | 03-04-2010 |
Chien-Yi Huang, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20080203412 | LED assembly with molded glass lens - A LED assembly with a molded glass lens includes a base, at least one LED chip and a cover lens. The LED assembly feature on that the cover lens consists of a molded glass lens and a transparent resin layer. A molded glass lens is covered on a loading surface of the base and then liquid transparent resin is filled into space between an inner surface of the molded glass lens and the loading surface through preset filling holes to coat the LED chip completely. After hardening, the transparent resin integrated with the molded glass lens so as to replace conventional cover lens made from transparent resin. Therefore, not only thermal resistance, weather resistance, discoloration resistance, and mechanical strength of the LED assembly are increased, but the brightness and light-emitting efficiency of the LED assembly are also improved. | 08-28-2008 |
| 20110090704 | Molded Fluorescent Glass Lens and Manufacturing Method Thereof - A molded fluorescent glass lens and a manufacturing method thereof are disclosed. Firstly, coat fluorescent material on surface of a glass preform or a cavity of a mold core. Then by glass precision molding, the mold core is heated and pressured for casting the glass preform into a molded fluorescent glass lens. The fluorescent glass lens not only has shape and optical properties of the molded forming lens, but also has fluorescent properties from a fluorescent surface layer formed by fluorescent material inserted into the glass. Thus the produced molded fluorescent glass lens is applied to road reflectors, white light LED or other optical elements for use. | 04-21-2011 |
Chien-Yi Huang, Taipei Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20100230140 | RIGID-FLEX PRINTED CIRCUIT BOARD MODULE, AND MANUFACTURING METHOD AND PROCESSING METHOD THEREFOR - A rigid-flex printed circuit board module includes a non-working zone and a working zone. The non-working zone defines a receiving space. The working zone is disposed in the receiving space, and is connected to the non-working zone through a plurality of interconnecting zones. The interconnecting zones are flexible regions having greater flexibility than the non-working zone, and are of the same thickness and material. The interconnecting zones are defined by flexible circuit board member such that the interconnecting zones can be quickly cut off using a single machine during processing of the rigid-flex printed circuit board module. Thus, the speed of separating the working zone from the non-working zone can be increased, and costs and time associated with processing and manufacturing can be reduced. Additionally, the processing flow can be simplified, and the product quality of the working zone after cutting can be ensured. | 09-16-2010 |
| 20110155361 | Heat dissipation module and portable device having the heat dissipation module - A heat dissipation module for lowering the temperature of a heating element is disclosed. The heat dissipation module comprises a heat dissipation module body, a container, and a liquid element. The heat dissipation module body is made of a heat conductive material; the container is installed in the heat dissipation module body; and the liquid element is disposed in the container. Therefore, when the heat dissipation module is in contact with the heating element, heat generated by the heating element is absorbed by the heat dissipation module body and the liquid element. | 06-30-2011 |
Chien-Yi Kao, Taoyuan TW
| Patent application number | Description | Published |
|---|---|---|
| 20090039922 | Multi-level comparator for fix power consumption - A multi-level comparator with fixed power consumption is disclosed. By using the switch character of differential pair and parallelizing single side of common source amplifier with multi-level input, the power of the multi-level comparator can be fixed by the current bias. This result shows that the multi-level comparator is able to heighten input stages at fixed power. Therefore, the multi-level comparator has the functionalities of several different comparators while maintaining fixed power consumption. | 02-12-2009 |
Chien-Yi Lin, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20100177058 | CAPACITIVE TOUCH SENSING AND LIGHT EMITTING DIODE DRIVE MATRIX - A pulse is applied through a capacitive touch key sensor to a sampling capacitor of an analog-to-digital converter (ADC). The voltage charge arriving at the sampling capacitor will be maximum when there is substantially no shunt capacitance between the capacitive touch key sensor and the sampling capacitor. However, a object such as an operator's finger when in close proximity to the capacitive touch key sensor will create a shunt to ground capacitance that diverts some of the charge that is supposed to go to the sampling capacitor and thereby reducing the voltage charge on the sampling capacitor. This change in charge voltage when the capacitive touch key sensor is activated (touched) may be easily detected with the ADC. In addition, light emitting diode (LED) displays may be integrated with the capacitive touch key sensors and use the same connections on an integrated circuit device in a time division multiplexed manor. | 07-15-2010 |
| 20110074609 | CAPACITIVE KEY TOUCH SENSING USING ANALOG INPUTS AND DIGITAL OUTPUTS - A pulse is applied through a capacitive touch key sensor to a sampling capacitor of an analog-to-digital converter (ADC). The voltage charge arriving at the sampling capacitor will be maximum when there is substantially no shunt capacitance between the capacitive touch key sensor and the sampling capacitor. However, a object such as an operator's finger when in close proximity to the capacitive touch key sensor will create a capacitive shunt to ground that diverts some of the charge that is supposed to go to the sampling capacitor and thereby reduces the voltage charge on the sampling capacitor. This change in charge voltage when the capacitive touch key sensor is activated (touched) may be easily detected with the ADC. In addition, light emitting diodes (LEDs) may be integrated with the capacitive touch key sensors and use the same connections on an integrated circuit device in a time division multiplexed manor. | 03-31-2011 |
Chien-Yi Wu, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20090195474 | DUAL-FEED PLANAR ANTENNA - The invention provides a dual-feed planar antenna including a first resonant portion, a second resonant portion, and a grounding portion. The first resonant portion provides a first radiation path and includes a first feed-in portion and a grounding end receiving a grounding level. The first feed-in portion receives a first antenna signal to transmit the first antenna signal to the first radiation path. The second resonant portion provides a second radiation path and a third radiation path and includes a second feed-in portion respectively receiving a second antenna signal and a third antenna signal to correspondingly transmit the second antenna signal and the third antenna signal to the second radiation path and the third radiation path. The grounding portion receives the grounding level and is disposed between the first and second resonant portions. The dual-feed planar antenna covers the communication bands for GSM850, GSM900, GPS, DCS, PCS, and UMTS. | 08-06-2009 |