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Chien-Wen Chen

Chien-Wen Chen, Xizhi City TW

Patent application numberDescriptionPublished
20100302749Controlling Warpage in BGA Components in a Re-flow Process - A method of manufacturing an integrated circuit package includes providing a ball grid array (BGA) module including BGA balls on a side of the BGA module; providing a base substrate; and placing the BGA module on the base substrate. The BGA balls are placed between the BGA module and the base substrate. An adhesive is applied between and contacting the BGA module and the base substrate. The adhesive is then cured. The BGA balls are re-flowed after the step of curing the adhesive.12-02-2010
20110023003Accurate Parasitic Capacitance Extraction for Ultra Large Scale Integrated Circuits - A system and method for extracting the parasitic contact/via capacitance in an integrated circuit are provided. Parasitic extraction using this system can lead to an improved accuracy on contact/via parasitic capacitance extraction by taking into account of the actual contact/via shape and size variation. The common feature of the various embodiments includes the step of generating a technology file, in which the contact/via capacitance in the capacitance table is derived from an effective contact/via width table. Each element of the effective contact/via width table is calibrated to have a parasitic capacitance matching to that of an actual contact/via configuration occurring in an IC.01-27-2011

Chien-Wen Chen, Kaohsiung City TW

Patent application numberDescriptionPublished
20090230523ADVANCED QUAD FLAT NO LEAD CHIP PACKAGE HAVING A CAVITY STRUCTURE AND MANUFACTURING METHODS THEREOF - A semiconductor package and related methods are described. In one embodiment, the package includes a die pad, a plurality of leads, a chip, and a package body. The die pad includes: (1) a peripheral edge region defining, a cavity with a cavity bottom including a central portion; (2) an upper sloped portion; and (3) a lower sloped portion. Each lead includes an upper sloped portion and a lower sloped portion. The chip is disposed on the central portion of the cavity bottom and is coupled to the leads. The package body is formed over the chip and the leads, substantially fills the cavity, and substantially covers the upper sloped portions of the die pad and the leads. The lower sloped portions of the die pad and the leads at least partially extend outwardly from a lower surface of the package body.09-17-2009
20090230524SEMICONDUCTOR CHIP PACKAGE HAVING GROUND AND POWER REGIONS AND MANUFACTURING METHODS THEREOF - A semiconductor package and related methods are described. In one embodiment the semiconductor package includes a die pad, a plurality of leads, a semiconductor chip, and a package body. The die pad includes a first part that includes a lower surface and a first peripheral edge region comprising a ground region. The die pad further includes a second part that is spaced apart from the first part and that includes a lower surface and a second peripheral edge region comprising a power region. The plurality of leads is disposed around the die pad. The semiconductor chip is disposed on the die pad and is electrically coupled to the ground region, the power region, and the plurality of leads. The package body is formed over the semiconductor chip and the plurality of leads.09-17-2009
20090230525ADVANCED QUAD FLAT NO LEAD CHIP PACKAGE HAVING MARKING AND CORNER LEAD FEATURES AND MANUFACTURING METHODS THEREOF - A semiconductor package and related methods are described. In one embodiment, the package includes a die pad, a first plurality of leads disposed in a lead placement area around the die pad, a second plurality of leads disposed in corner regions of the lead placement area, a semiconductor chip on the die pad and coupled to each lead, and a package body. Each lead includes an upper sloped portion and a lower sloped portion. An average of surface areas of lower surfaces of each of the second plurality of leads is at least twice as large as an average of surface areas of lower surfaces of each of the first plurality of leads. The package body substantially covers the upper sloped portions of the leads. The lower sloped portions of the leads at least partially extend outwardly from a lower surface of the package body.09-17-2009
20090230526ADVANCED QUAD FLAT NO LEAD CHIP PACKAGE HAVING A PROTECTIVE LAYER TO ENHANCE SURFACE MOUNTING AND MANUFACTURING METHODS THEREOF - A semiconductor package and related methods are described. In one embodiment, the package includes a die pad, multiple leads, a chip, a package body, and a protective layer. The die pad includes an upper sloped portion, a lower sloped portion, and a peripheral edge region defining a cavity with a cavity bottom. Each lead includes an upper sloped portion and a lower sloped portion. The chip is disposed on the cavity bottom and is coupled to the leads. The package body is formed over the chip and the leads, substantially fills the cavity, and substantially covers the upper sloped portions of the die pad and the leads. The lower sloped portions of the die pad and the leads at least partially extend outwardly from a lower surface of the package body. The protective layer substantially covers the lower sloped portion and the lower surface of at least one lead.09-17-2009

Chien-Wen Chen, Taichung City TW

Patent application numberDescriptionPublished
20080221249Water dispersible polyisocyanate composition and its uses - The present invention relates to a water dispersible polyisocyanate composition bearing urea comprising 09-11-2008
20090192283PROCESS FOR PREPARING HIGH PERFORMANCE WATERBORNE ALIPHATIC-AROMATIC MIXED POLYURETHANES - The present invention relates to an improved process for preparing high performance aliphatic-aromatic mixed waterborne polyurethanes (PUs). Waterborne PUs prepared from mixed aromatic diisocyanates and aliphatic diisocyanates exhibit superior mechanical properties as compared with those prepared from aliphatic diisocyanates alone.07-30-2009

Chien-Wen Chen, Erlin Township TW

Patent application numberDescriptionPublished
20090168275SHORT PROTECTION DEVICE FOR ALTERNATOR - A short circuit protection device for the protection of an alternator in which turning on/off a trigger switch causes conduction/cutoff of the field current of the field coil of the alternator is disclosed. The protection device enables the field current to pass through a sensor so that when the field current is abnormally high and the voltage drop across the sensor rises, the potential of an input end of a boost circuit electrically connected to the sensor correspondingly arises and an output end of the boost circuit electrically connected to a shutoff device drives the shutoff device to turn off the trigger switch, and the boost circuit further keeps the shutoff device in on-state to hold the trigger switch off till the short circuit condition is eliminated and the protection circuit system is reset.07-02-2009

Chien-Wen Chen, Hsinchu TW

Patent application numberDescriptionPublished
20090055574NAND Flash Memory Device And Related Method Thereof - The NAND flash memory device contains a NAND flash memory, a mirror data area, and a controller. The mirror data area has a size at least to hold a page of data and is usually formed by random access memory. The controller saves a data to be written into the NAND flash memory that occupies a partial number of the sectors of a first page of the NAND flash memory into the sectors of a second page of the mirror data area. When a new data is to be written into the remaining sectors of the first page of the NAND flash memory, the new data is stored instead into the second page's remaining sectors of the mirror data area. When the second page of the mirror data area is full, the entire second page is written into the first page of the NAND flash memory.02-26-2009
20110176777Apparatus For Optical Fiber Connection - An apparatus for optical fiber connection is provided, including a shell base and at least an optical fiber coupling tube. The inner shape and the outer shape of the shell base are made according to the different types of optical fiber connection apparatus specifications. The optical fiber coupling tube is fixed to the inside of the shell base. The optical fiber tube includes a hard tube wall along the axis of the tube and at least a deformable tube wall. The deformable tube wall is resilient and can be slightly deformed and restored to original shape. When used for connecting optical fibers, the present invention provides precise positioning and the optical signal loss and pulling torque are all within specifications.07-21-2011

Chien-Wen Chen, Hsin-Chu TW

Patent application numberDescriptionPublished
20090007035Accurate Parasitic Capacitance Extraction for Ultra Large Scale Integrated Circuits - A system and method for extracting the parasitic contact/via capacitance in an integrated circuit are provided. Parasitic extraction using this system can lead to an improved accuracy on contact/via parasitic capacitance extraction by taking into account of the actual contact/via shape and size variation. The common feature of the various embodiments includes the step of generating a technology file, in which the contact/via capacitance in the capacitance table is derived from an effective contact/via width table. Each element of the effective contact/via width table is calibrated to have a parasitic capacitance matching to that of an actual contact/via configuration occurring in an IC.01-01-2009

Chien-Wen Chen, Hsinchu City TW

Patent application numberDescriptionPublished
20080237885Method for Improving Design Window - A method of forming photo masks having rectangular patterns and a method for forming a semiconductor structure using the photo masks is provided. The method for forming the photo masks includes determining a minimum spacing and identifying vertical conductive feature patterns having a spacing less than the minimum spacing value. The method further includes determining a first direction to expand and a second direction to shrink, and checking against design rules to see if the design rules are violated for each of the vertical conductive feature patterns identified. If designed rules are not violated, the identified vertical conductive feature pattern is replaced with a revised vertical conductive feature pattern having a rectangular shape. The photo masks are then formed. The semiconductor structure can be formed using the photo masks.10-02-2008

Chien-Wen Chen, Taoyuan County TW

Patent application numberDescriptionPublished
20110217954METHOD, SYSTEM, AND MOBILE DEVICE FOR MANAGING MESSAGES AND COMPUTER-READABLE MEDIUM USING THE METHOD - A method, a system, and a mobile device for managing messages and a computer-readable medium using the method are provided. In the present invention, the messages received by the mobile device are uploaded to a network server. Besides, the messages to be retained in the mobile device are determined according to a retention rule, and the messages not satisfying the retention rule are deleted from the mobile device.09-08-2011
20110217965METHOD, SYSTEM AND COMPUTER-READABLE MEDIUM FOR SYNCHRONIZING SPOT INFORMATION - A method, a system, and a computer-readable medium for synchronizing spot information, adapted to synchronize a plurality of spot information displayed on a mobile device and a terminal device, are provided. In the present method, when the mobile device logs in to a service end device, the spot information in a spot database of the mobile device is synchronized to the service end device. When the terminal device logs in to the service end device, the spot information synchronized from the mobile device to the service end device is downloaded to the terminal device and displayed in a spot information browsing webpage. When the mobile device receives spot information edited by a user, the mobile device synchronizes the edited spot information to the service end device, and the service end device updates the spot information displayed in the spot information browsing webpage of the terminal device.09-08-2011
20110218965SYSTEM FOR REMOTELY ERASING DATA, METHOD, SERVER, AND MOBILE DEVICE THEREOF, AND COMPUTER PROGRAM PRODUCT - A system for remotely erasing data, a method, a server, and a mobile device thereof, and a computer program product are provided. The method is adapted for the mobile device having an internal storage unit and an external storage unit, wherein a user account of a service website is set up for the mobile device. In the method, a relationship between the user account and the mobile device is recorded in the server. The server receives a data erasing request corresponding to the user account through the service website, and sends a remote control command to the mobile device corresponding to the user account. Then, the mobile device erases data stored in the external storage unit thereof according to the remote control command.09-08-2011
20110219316METHOD, SYSTEM, APPARATUS AND COMPUTER-READABLE MEDIUM FOR TRANSMITTING MESSAGE - A method, a system, an apparatus, and a computer-readable medium suitable for a terminal device to transmit a message through a mobile communication device are provided. In the present method, a message editing interface is displayed, and a message comprising at least one contact and message content, edited on the message editing interface by a user, is received. The edited message is then synchronized to the mobile communication device and the message is transmitted to each of the at least one contact in the message by the mobile communication device.09-08-2011
20110219429ONLINE SERVICE PROVIDING SYSTEM, METHOD, SERVER AND MOBILE DEVICE THEREOF, AND COMPUTER PROGRAM PRODUCT - An online service providing system, a method, a server, and a mobile device thereof, and a computer program product are provided. The method includes sending a verification link corresponding to a user account that is not verified; after receiving a verification request corresponding to the verification link, determining whether a device identification sent by the mobile device that has logged in the user account is received; when receiving the device identification, confirming whether the user account is verified according to the device identification; after confirming that the user account is verified, when receiving a service request sent by a terminal device logging the user account into a service website, determining a homepage of the service website according to the device identification, and providing the online service corresponding to the mobile device to the terminal device through the service web site.09-08-2011
20110257957PERSONALIZED INFORMATION SERVICE METHOD AND INFORMATION PLATFORM - A personalized information service method for an information platform having several subscribers is provided. Each subscriber uses a portable device to communicate with the information platform, and the information platform stores several personalized behavior models respectively corresponding to the subscribers. For each subscriber, the personalized information service comprises the steps of collecting operating information related to the subscriber operating the portable device, and transmitting the operating information to the information platform. The information platform analyzes the operating information to adjust the personalized behavior model corresponding to the subscriber.10-20-2011
20110258160DATA SYNCHRONIZATION METHODS FOR SYNCHRONIZING DATA IN COMMUNICATION SYSTEM AND COMMUNICATION SYSTEMS - A data synchronization method for synchronizing data in a communication system including an account server including a first data record of an account, a mobile device including a second data record, and a data server including a third data record is disclosed. The mobile device is connected to the account server and the data server. First, a first synchronization procedure is performed to synchronize data between the first data record of the account server and the second data record of the mobile device according to a first identification data. After the first synchronization procedure has been completed, a second synchronization procedure is performed to synchronize data between the synchronized second data record of the mobile device and the third data record of the data server according to the first identification data and a second identification data.10-20-2011
20110258292FILE DOWNLOAD METHOD FOR MOBILE DEVICE, SERVER AND MOBILE DEVICE THEREOF, AND COMPUTER-READABLE MEDIUM - A file download method for a mobile device, a server and a mobile device thereof, and a computer-readable medium are provided. In the method, the server obtains file identification information according to an access operation of a terminal device on a service website. When the file identification information corresponds to a file of a first type, the server transmits the file of the first type to the mobile device directly. When the file identification corresponds to a file of a second type, the server transmits the file identification information to the mobile device, so that the mobile device downloads the file of the second type according to the file identification information.10-20-2011
20110258329METHOD AND SYSTEM FOR PROVIDING ONLINE SERVICES CORRESPONDING TO MULTIPLE MOBILE DEVICES, SERVER, MOBILE DEVICE, AND COMPUTER PROGRAM PRODUCT - A method and a system for providing online services corresponding to multiple mobile devices, a server, a mobile device, and a computer program product are provided. The server provides a service website. In the present method, a login request of a user account of the service website is received from a terminal device. A first connection with a first mobile device of the user account is established, and a first device data of the first mobile device is obtained. A second connection with a second mobile device of the user account is established while maintaining the first connection, and a second device data of the second mobile device is obtained. A first online service corresponding to the first mobile device and a second online service corresponding to the second mobile device are provided on the service website according to the first device data and the second device data.10-20-2011
20110258555SYSTEMS AND METHODS FOR INTERFACE MANAGEMENT - Methods and systems for interface management are provided. First, a request message, requesting for arrangement information of at least one interface is received from a server, wherein the at least one interface contains at least one object and can be displayed on a screen of an electronic device according to the arrangement information. In response to the request message, respective arrangement information of the at least one interface is obtained and then transmitted to the server, such that a simulated interface of the at least one interface is displayed on a user interface at the server side based on the respective arrangement information received by the server, wherein when a change is made to the simulated interface of the at least one interface at the server side, the arrangement of the at least one interface is accordingly changed.10-20-2011
20120059576METHOD, SYSTEM, APPARATUS AND COMPUTER-READABLE MEDIUM FOR BROWSING SPOT INFORMATION - A method, a system, an apparatus, and a computer-readable medium for browsing spot information, adapted to an electronic device, are provided. In the present method, a plurality of spot information are retrieved, in which each of the spot information at least comprises a picture and a location of a spot. Next, an electronic map is displayed and a spot marker is marked at the spot location of each spot information on the electronic map. Meanwhile, a spot browsing bar is displayed on a side of the electronic map and the spot pictures of the spot information are sequentially displayed in the spot browsing bar. When a select operation of a certain spot marker on the electronic map is received, the spot browsing bar is scrolled to show the spot picture corresponding to the selected spot marker.03-08-2012

Chien-Wen Chen, Hsinchu County TW

Patent application numberDescriptionPublished
20110228431BATTERY CELL AND ELECTRONIC APPARATUS WITH ELECTROSTATIC DISCHARGE PROTECTION - An electronic apparatus with electrostatic discharge protection includes: a conducting casing and a circuit board. The circuit board has a power ground node and a conditional conducting path, and is set inside the conducting casing. The conditional conducting path further includes: a conducting element and an electrostatic discharging component. One end of the conducting element is electrically connected to the conducting casing, and the electrostatic discharging component is electrically connected between another end of the conducting element and the power ground node. When the voltage variation between the two ends of the electrostatic discharging element reaches a preset condition, the electrostatic discharging component functions as a short circuit; otherwise, the electrostatic discharging element is equivalent to a high impedance element. The power ground node electrically connects to an electrode of a battery for using it as a vessel of receiving electrostatic charges.09-22-2011

Chien-Wen Chen, Taipei County TW

Patent application numberDescriptionPublished
20110270415ARTIFICIAL KNEE JOINT - An artificial knee joint includes a lower joint member, an axle, a kneecap member, and a press member. The lower joint member is formed with a horizontally extending axle-receiving hole, and a clearance extending from and in spatial communication with the axle-receiving hole. The axle is received in the axle-receiving hole. The kneecap member is pivoted to the lower joint member, and is adapted to be connected to a prosthetic thigh. The press member is mounted to the kneecap member for pressing the lower joint member when the kneecap member pivots in a direction relative to the lower joint member. Therefore, the clearance and the axle-receiving hole are constricted to result in tightened connection between the lower joint member and the axle and resistance to relative rotation between the lower joint member and the axle.11-03-2011

Chien-Wen Chen, Tai Chung County TW

Patent application numberDescriptionPublished
20110293870COMPOSITE COVER SHEET AND COVER SHEET ASSEMBLY - A composite cover sheet includes a first protective film, a first adhesive layer, a second protective film and a second adhesive layer. The first protective film has a first sticking part and a first movable part. The first protective film is attached to a base sheet through the first adhesive layer, and the first protective film is removed from the base sheet through the first movable part. The second protective film has a second sticking part and a second movable part, and the second protective film and the first protective film are separately formed. The second protective film is attached to the first protective film through the second adhesive layer, and the second protective film is removed from the first protective film through the second movable part.12-01-2011

Chien-Wen Chen, New Taipei City TW

Patent application numberDescriptionPublished
20120021564Method for packaging semiconductor device - The present invention provides a method for packaging semiconductor device which is using more than once reflow processes to heat the solder ball to prevent the deformation of solder ball, so that the yield of the manufacturing process can be increased and the reliability of the semiconductor device can be increased.01-26-2012

Chien-Wen Chen, Taichung TW

Patent application numberDescriptionPublished
20120108742Biodegradable and biocompatible waterborne polyurethane - The present invention relates to a waterborne polyurethane containing biodegradable segments and the process for synthesizing the same. The waterborne polyurethane according to the present invention has excellent biodegradable, biocompatible and mechanical characteristics and thus is a useful biomedical material, in particular for making films for medical applications.05-03-2012