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Chien-Ping
Chien-Ping Chen, Taoyuan County TW
| Patent application number | Description | Published |
|---|---|---|
| 20110002074 | PROTECTION CIRCUIT FOR CONTROL BOARD - A protection circuit for a control board is provided. The protection circuit is suitable for being disposed on a light on tester that may output a test voltage to a display module. The protection circuit includes a control device and a voltage stabilizer. The control device includes a first switching element and a control element. The control element enables the first switching element to output an operating voltage. The voltage stabilizer includes a second switching element and an operation module. The operation module may control the second switching element according to the operating voltage, so as to switch on or switch off an input of the test voltage to the display module. | 01-06-2011 |
Chien-Ping Chung, Taipei County TW
| Patent application number | Description | Published |
|---|---|---|
| 20080222345 | METHOD FOR ACCESSING MEMORY DATA - A memory access method for accessing data from a non-volatile memory in a south bridge is provided. Memory access is performed under a system management mode (SMM). Under the protection of the SMM mode, the desired memory address is not altered by an interrupt handler, therefore memory data is accessed correctly. | 09-11-2008 |
Chien-Ping Huang, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20090004784 | METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE FREE OF SUBSTRATE - A semiconductor package and a fabrication method thereof are provided in which a dielectric material layer formed with a plurality of openings is used and a solder material is applied into each of the openings. A first copper layer and a second copper layer are in turn deposited over the dielectric material layer and solder materials, and the first and second copper layers are patterned to form a plurality of conductive traces each of which has a terminal coated with a metal layer. A chip is mounted on the conductive traces and electrically connected to the terminals by bonding wires, with the dielectric material layer and solder materials being exposed to the outside. This package structure can flexibly arrange the conductive traces and effectively shorten the bonding wires, thereby improve trace routability and quality of electrical connection for the semiconductor package. | 01-01-2009 |
Chien-Ping Huang, Hsinchu Hsein TW
| Patent application number | Description | Published |
|---|---|---|
| 20090096115 | Semiconductor package and method for fabricating the same - A semiconductor package and a method for fabricating the same are disclosed. The present invention discloses mounting and electrically connecting a semiconductor chip to a chip carrier, forming an interfacial layer or a heat-dissipating member having the interfacial layer on the semiconductor chip, and forming an encapsulant for covering the semiconductor chip, the interfacial layer or the heat dissipating member. The method further includes cutting the encapsulant along edges of the interfacial layer, and removing the redundant encapsulant on the interfacial layer so as to expose the semiconductor chip or the heat-dissipating member without forming burr or heavily wearing cutting tools. | 04-16-2009 |
Chien-Ping Huang, Tantzu TW
| Patent application number | Description | Published |
|---|---|---|
| 20110156180 | PACKAGE STRUCTURE HAVING MICRO-ELECTROMECHANICAL ELEMENT AND FABRICATION METHOD THEREOF - Proposed is a package structure having a micro-electromechanical (MEMS) element, including a chip having a plurality of electrical connecting pads and a MEMS element formed thereon; a lid disposed on the chip for covering the MEMS element; a stud bump disposed on each of the electrical connecting pads; an encapsulant formed on the chip with part of the stud bumps being exposed from the encapsulant; and a metal conductive layer formed on the encapsulant and connected to the stud bumps. The invention is characterized by completing the packaging process on the wafer directly to enable thinner and cheaper package structures to be fabricated within less time. This invention further provides a method for fabricating the package structure as described above. | 06-30-2011 |
Chien-Ping Huang, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20110180649 | BUILT-IN MODULE FOR INVERTER AND HAVING TENSION CONTROL WITH INTEGRATED TENSION AND VELOCITY CLOSED LOOPS - A built-in module for an inverter and having tension control with integrated tension and velocity closed loops, where required tension feedbacks can be obtained by internal calculations of the inverter or feedback signals of a tension sensor. The tension control module is applied to provide a tension control for a winding mechanism which is operated by driving at least one motor. The tension control module firstly builds a tension control to provide a balanced tension to the winding mechanism. Afterward, the tension control module builds a velocity control to provide an accelerated or decelerated adjustment for the winding mechanism. Accordingly, the winding mechanism can stably maintain a tension-balanced operation. | 07-28-2011 |
Chien-Ping Lee, Hsin Chu TW
| Patent application number | Description | Published |
|---|---|---|
| 20100117060 | Quantum dot infrared photodetector apparatus - The present invention is disclosed that a device capable of normal incident detection of infrared light to efficiently convert infrared light into electric signals. The device comprises a substrate, a first contact layer formed on the substrate, an active layer formed on the first contact layer, a barrier layer formed on the active layer and a second contact layer formed on the barrier layer, wherein the active layer comprises multiple quantum dot layers. | 05-13-2010 |
Chien-Ping Wu, Jungjeng Chiu TW
| Patent application number | Description | Published |
|---|---|---|
| 20110295885 | REMOTE-INTERACTION APPARATUS AND INTERACTION UNIT THEREOF - A remote-interaction apparatus comprises a portable electronic device installing a specific software and an interaction unit having an interaction-mode database. The interaction unit can detect a sensory information inputted by a user and find out an interaction information corresponding to the sensory information from the interaction-mode database for transmitting the first interaction information to the portable electronic device by a first communication protocol. And the specific software employs the portable electronic device to transmit the interaction information to another remote-interaction apparatus by a second communication protocol. The specific software can also employ the portable electronic device to transmit another interaction information transmitted from the said another remote-interaction apparatus to the interaction unit by the first communication protocol, so that the interaction unit can find out a control command corresponding to the said another interaction information from the interaction-mode database and perform a response action according to the control command. | 12-01-2011 |
Chien-Ping Wu, Hsinchu City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100297393 | METHOD FOR SURFACE FROSTING OF GLASS PRODUCT - Provided is a method for surface frosting of glass product, wherein a glass product is first immersed in a pre-treatment solution having a composition including water (H | 11-25-2010 |