| Patent application number | Description | Published |
|---|
| 20100059886 | Carrier structure of SoC with custom interface - The present invention discloses a carrier structure of a System-on-Chip (SoC) with a custom interface. The carrier structure includes a substrate, at least one common die, at least one custom interface and a molding compound. The common die and the custom interface are disposed on the substrate. The molding compound is used to package the common die which electrically connects to the substrate and the custom interface respectively. The carrier structure which includes the common die can form a complete SoC by connecting to an expansive die through the custom interface. The carrier structure with the common die which can be tested and certified in advance allows reducing and simplifying the developing procedures of the SoC. | 03-11-2010 |
| 20100330741 | FABRICATION METHOD FOR SYSTEM-ON-CHIP (SOC) MODULE - A fabrication method for a system-on-chip (SoC) module is provided. The fabrication method includes the steps of providing at least two SoC sub-modules and connecting the SoC sub-modules. The SoC sub-modules are electrically connected with each other by connection interfaces of the SoC sub-modules so as to form the SoC module. As the SoC sub-modules have been verified in advance, the time required for verifying the resulting SoC module can be significantly reduced. As for application-specific SoC modules, they are fabricated by connecting with application-specific SoC sub-modules via the appropriate connection interfaces. Thus, the time and costs for developing SoC modules can both be minimized. | 12-30-2010 |
| 20110096506 | MULTI-LAYER SOC MODULE STRUCTURE - A multi-layer system-on-chip (SoC) module structure is provided. The multi-layer SoC module structure includes at least two circuit board module layers and at least one connector module layer. Each connector module layer is sandwiched between and thus electrically connects two circuit board module layers such that the SoC module structure is formed by stacking. Each circuit board module layer is composed of at least one circuit board module while each connector module layer is composed of at least one connector module. Hence, the SoC module structure can be manufactured as a three-dimensional structure, thus allowing highly flexible connections within the SoC module structure. | 04-28-2011 |
| 20110138248 | METHOD FOR ARRANGING MEMORIES OF LOW-COMPLEXITY LDPC DECODER AND LOW-COMPLEXITY LDPC DECODER USING THE SAME - A method for arranging memories of a low-complexity low-density parity-check (LDPC) decoder and a low-complexity LDPC decoder using the same method are provided. The main idea of the method for arranging memories of a low-complexity LDPC decoder is to merge at least one or two small-capacity memory blocks into one memory group, so that the memory area can be reduced and the power consumption in reading or writing data is lowered. Besides, as the merged memory group shares the same address line in reading or writing data, at least one delay unit is used to adjust the reading or writing order and thereby ensure data validity. A low-complexity LDPC decoder using the disclosed method can meet the demands of high processing rate and low power consumption. | 06-09-2011 |
| 20110188210 | THREE-DIMENSIONAL SOC STRUCTURE FORMED BY STACKING MULTIPLE CHIP MODULES - A three-dimensional SoC structure formed by stacking multiple chip modules is provided. The three-dimensional SoC structure includes at least two vertical SoC modules and at least one connector module, wherein each connector module electrically connects two vertical SoC modules. Each vertical SoC module is constructed by stacking at least two chip modules vertically. Each chip module includes a module circuit board and at least one preset element. A recess is formed in each module circuit board and provided with a first connecting interface for electrically connecting with the corresponding at least one preset element. The at least two vertical SoC modules are connected by the connector module to form a three-dimensional SoC structure with multiple functions. Besides, the recesses formed in the module circuit boards provide effective heat dissipation paths for the preset elements. | 08-04-2011 |
| Patent application number | Description | Published |
|---|
| 20090070108 | METHOD AND SYSTEM FOR IDENTIFYING SPEECH SOUND AND NON-SPEECH SOUND IN AN ENVIRONMENT - In a method and system for identifying speech sound and non-speech sound in an environment, a speech signal and other non-speech signals are identified from a mixed sound source having a plurality of channels. The method includes the following steps: (a) using a blind source separation (BSS) unit to separate the mixed sound source into a plurality of sound signals; (b) storing spectrum of each of the sound signals; (c) calculating spectrum fluctuation of each of the sound signals in accordance with stored past spectrum information and current spectrum information sent from the blind source separation unit; and (d) identifying one of the sound signals that has a largest spectrum fluctuation as the speech signal. | 03-12-2009 |
| 20090322559 | WARNING SOUND DIRECTION DETECTING APPARATUS - A direction detecting apparatus is adapted for installation on a vehicle, and includes a first sound collecting unit, a second sound collecting unit, an identifying unit, a direction estimating unit, and a notifying unit. The first and second sound collecting units collect sounds from roads. The identifying unit identifies the types of the sounds collected by the first and second sound collecting units. The direction estimating unit determines whether a warning sound comes from the front when the sound type identified by the identifying unit is a warning sound. The direction estimating unit estimates the direction of the warning sound when the warning sound comes from the front, and estimates a lane in which the warning sound is located when the warning sound comes from behind. The notifying unit is for providing notification of the estimation result of the direction estimating unit. | 12-31-2009 |
| 20100290633 | METHOD AND APPARATUS FOR AUTOMATIC NOISE COMPENSATION USED WITH AUDIO REPRODUCTION EQUIPMENT - A method and an apparatus for automatic noise compensation used with audio reproduction equipment are provided. The method comprises: (a) collecting a plurality of mixed audio signals, each mixed audio signal including equipment sound output by the audio reproduction equipment, and background noise; (b) removing the equipment sound from the mixed audio signals to obtain the background noise therein; (c) determining whether or not a plurality of mixed audio signals under inspection include a significant sound; and (d) adjusting the volume of the audio reproduction equipment according to whether or not a significant sound has been generated in the surrounding area and the magnitude of the background noise in the mixed audio signals under inspection to satisfy a plurality of predetermined compensation conditions. | 11-18-2010 |
