| Patent application number | Description | Published |
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| 20080197765 | Layered amorphous diamond materials and associated methods for enhanced diamond electroluminescence - An electroluminescence device having enhanced overall luminescence or brightness resulting from a plurality of luminescence groups arranged in a stacked configuration, such that the luminescence output from one luminescent group is caused to blend with the luminescent output from one or more additional luminescent groups to provide an improved luminescence output that enhances the intensity of the overall luminescence generated by the device as compared to a device with a single luminescent group, or electrode assembly containing such. In some aspects, the improvement or increase may be at least additive, and in some cases synergistic. The device can include a multi-layer diamond electroluminescence device configured to provide enhanced luminescence intensity, wherein the device comprises a plurality of operating pairs of electrode layers; at least one diamond-like carbon layer disposed between each of the operating pairs of electrode layers, and electrically coupled to an electrode layer within a respective pair of electrode layers; and at least one luminescent layer disposed between each of the operating pairs of electrode layers, and electrically coupled to the diamond-like carbon layer and the respective pair of electrode layers, such that upon receiving electrons from the diamond-like carbon layer the luminescent layer illuminates. | 08-21-2008 |
| 20080210950 | Diamond-like carbon electronic devices and methods of manufacture - Materials, devices, and methods for enhancing performance of electronic devices such as solar cells, fuels cells, LEDs, thermoelectric conversion devices, and other electronic devices are disclosed and described. A diamond-like carbon electronic device can include a conductive diamond-like carbon cathode having specified carbon, hydrogen and sp | 09-04-2008 |
| 20080292869 | Methods of bonding superabrasive particles in an organic matrix - Superabrasive tools and their methods of manufacture are disclosed. In one aspect, a method of improving retention of superabrasive particles held in a solidified organic material layer of an abrading tool, a portion of each of said superabrasive particles protruding out of the solidified organic material layer is provided. Such a method may include securing the plurality of superabrasive particles in the solidified organic material layer such that the organic material layer wicks up the protruding portions of the superabrasive particles. In addition to the wicking of the organic material layer around the superabrasive particles, various additional parameters may be utilized to improve retention. For example, in another aspect the plurality of superabrasive particles may be secured in an arrangement that minimizes mechanical stress impinging on protruding portions of any individual superabrasive particle when used to abrade a work piece. As an example, the arrangement of the plurality of superabrasive particles may be configured to uniformly distribute drag forces across substantially each superabrasive particle. | 11-27-2008 |
| 20090260680 | Photovoltaic Devices and Associated Methods - Materials, devices, and methods for enhancing performance of electronic devices such as solar cells, thermoelectric conversion devices and other electronic devices are provided. In one aspect, for example, an electronic device is provided. Such a device may include a charge carrier separation layer further including a layer of a P-type material comprising copper, gallium, indium and at least one member selected from the group consisting of selenide and sulfide, and a layer of an N-type material adjacent to the P-type material, where the N-type material includes diamond-like carbon doped with an N dopant. The electronic device may further include a first electrode adjacent to the layer of P-type material of the charge carrier separation layer opposite to the N-type material. | 10-22-2009 |
| 20110011628 | HIGHLY THERMAL CONDUCTIVE CIRCUIT BOARD - A highly thermal conductive circuit board includes a composite substrate, and a metal layer, an insulating layer, and a conductor layer sequentially disposed on the composite substrate. When at least one electronic element is electrically disposed on the conductor layer of the highly thermal conductive circuit board, heat produced by the electronic element in operation is rapidly dissipated through characteristics such as a high thermal conductivity and a low thermal expansion coefficient of the highly thermal conductive circuit board. | 01-20-2011 |
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| 20090068937 | CMP Pad Conditioners with Mosaic Abrasive Segments and Associated Methods - A CMP pad conditioner comprises a plurality of abrasive segments. Each abrasive segment includes a segment blank and an abrasive layer attached to the segment blank, the abrasive layer including a superhard abrasive material. A pad conditioner substrate is also provided. Each of the plurality of abrasive segments is permanently affixed to the pad conditioner substrate in an orientation that enables removal of material from a CMP pad by the abrasive layer as the pad conditioner and the CMP pad are moved relative to one another. | 03-12-2009 |
| 20090170407 | Pad Conditioner Dresser - Methods for extending the service life of a CMP pad dresser having a substrate and a plurality of superabrasive particles disposed thereon which is used to dress a CMP pad are disclosed and described. The method may include dressing the chemical mechanical polishing pad with the dresser; determining superabrasive particle wear by measuring a mechanical property of the pad, dresser, or combination thereof; and responding to the mechanical property measurement by varying pressure and RPM between the pad and the dresser in relation to the superabrasive particle wear in order to extend dresser life. Additionally, a method may include dressing the chemical mechanical polishing pad with the dresser; vibrating, in a direction substantially parallel to a working surface of the pad, a member selected from the pad, the dresser, a wafer being polished by the pad, or any combination thereof, to minimize a mechanical stress on the pad, dresser, wafer, or combination thereof; and varying the pressure and RPM between the pad and the dresser, including gradually increasing the pressure and/or the RPM between the pad and the dresser in a non-linear manner over time as the dresser is used, such that the dresser life is extended, wherein the pressure and the RPM is increased when the chemical mechanical polishing pad surface exhibits wear. | 07-02-2009 |
