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| 20090110947 | APPARATUS AND METHOD OF DECORATING A SURFACE OF A WORKPIECE AND DECORATED PART - A method of decorating a surface of a workpiece includes the step of positioning a decorating film over the surface, wherein the decorating film has a first side and an opposite second side with a decorating pattern facing the surface. The decorating film is then fitted tightly on the surface by applying negative pressure therebetween. Next, the decorating pattern is transferred onto the surface by providing a heated gas current to heat the decorating film. | 04-30-2009 |
| 20090236772 | PATTERN TRANSFER MOLD AND PATTERN TRANSFER METHOD - A pattern transfer mold is suitable for transferring at least one decorative pattern of a film to at least one workpiece. The pattern transfer mold includes a mold base and a mold core. The mold base has a mold cavity and an air vent associated with the mold cavity. The mold core is inserted in the mold cavity of the mold base and has an upper surface and a plurality of upper air grooves on the upper surface. The mold cavity and the mold core have a plurality of mold air channels located between the mold cavity and the mold core. The upper air grooves are associated with the air vent via the mold air channels. | 09-24-2009 |
| 20110061798 | PRODUCTION METHOD OF THREE-DIMENSIONAL PATTERN - A production method of a three-dimensional pattern is disclosed. First, an adhesive layer is applied on a three-dimensional workpiece. Next, a film is vacuum adsorbed on the adhesive layer so that the film is impressed onto the adhesive layer to form the three-dimensional pattern on the adhesive layer. Finally, the adhesive layer is cured. | 03-17-2011 |
| 20110064915 | METAL WORKPIECE WITH THREE-DIMENSIONAL PATTERN AND PRODUCTION METHOD THEREOF - A production method of metal workpiece is provided. First, an adhesive layer is applied on a metal workpiece. The adhesive layer is impressed by a mold, so that the adhesive layer forms a three-dimensional pattern. The adhesive layer is then cured by implementing a plurality of heat treatments thereon. A metal workpiece with three-dimensional pattern is also provided. | 03-17-2011 |
| 20110064924 | PRODUCTION METHOD, WORKPIECE AND PRODUCTION DEVICE OF THREE-DIMENSIONAL PATTERN - A production method of three-dimensional pattern is disclosed. First, an adhesive layer is applied on a three-dimensional workpiece. Next, a film is vacuum adsorbed on the adhesive layer so that the film is impressed onto the adhesive layer to form the three-dimensional pattern on the adhesive layer. Finally, the adhesive layer is cured by implementing a plurality of heat treatments thereon. A workpiece of three-dimensional pattern and a production device of three-dimensional pattern are also disclosed. | 03-17-2011 |
| 20110183270 | METHOD FOR FORMING THREE-DIMENSIONAL PATTERN - A method for forming a three-dimensional pattern includes following steps. A shaped workpiece having an inner surface and an outer surface is provided, and a first photoresist layer and a second photoresist layer are respectively formed on the outer surface and the inner surface. The shaped workpiece is placed on a transparent fixture. The first photoresist layer and the second photoresist layer are exposed and developed, such that the first photoresist layer forms a patterned photoresist layer, and the second photoresist layer forms an etching protection layer. The shaped workpiece is etched to form the three-dimensional pattern on the outer surface of the shaped workpiece. The patterned photoresist layer and the etching protection layer are removed. | 07-28-2011 |
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| 20100101937 | METHOD OF FABRICATING TRANSPARENT CONDUCTIVE FILM - A method of fabricating transparent conductive film including the following steps is provided. First, a reactive chamber having at least a target and at least a heating device is provided. Subsequentially, a plasma is generated in the reactive chamber, wherein the plasma is located above the target. Next, the plasma is heated by the heating device from a standby temperature to a working temperature. Simultaneously, a hard plastic substrate is passed above the plasma at a specific speed, wherein the particles of the target are bombarded by the plasma so as to form transparent conductive film on the hard plastic substrate. | 04-29-2010 |
| 20110056244 | METHOD OF STRENGTHENING GLASS PLATE - A method of strengthening glass plate is provided. A plasma treating process is performed on a glass plate so that a surface pore variation of the glass plate after the plasma treating process is reduced relative to the surface pore variation of the glass plate before the plasma treating process, wherein the surface pore variation is a variation degree of surface pores in different unit areas of the glass plate. In the mean time, a melted network crosslinking structure is formed on the surface of the glass plate. Based on the above-mentioned mechanisms, the glass plate is strengthened. The plasma treating process is conducive to strengthen the glass plate whether the plasma treating process is performed before or after the conventional chemical strengthening process. | 03-10-2011 |
| 20110234507 | INTEGRATED TOUCH PANEL AND MANUFACTURING METHOD THEREOF - The present invention provides an integrated touch panel comprising a transparent substrate, one of an icon or artwork layer, a first layer of optical film, and a first sensing layer. The icon layer or artwork layer is coated on the periphery of one side face of the transparent substrate, and the inner periphery of the icon layer or artwork layer is not perpendicular to the adjacent line of the transparent substrate. The first layer of optical film is stacked on icon layer or artwork layer and the areas on the transparent substrate uncovered with icon layer. The first sensing layer is stacked on the first layer of optical film by sputtering. The interchangeability is included in the patent claim of the present invention. As icon layer or artwork layer is not perpendicular to the transparent substrate, the subsequent cladding of the structures may be completed by sputtering or other methods. | 09-29-2011 |
| 20120009354 | Method for treating surface of glass substrate and apparatus for performing same - A method for treating a surface of a glass substrate according to the invention has the steps of placing the glass substrate into a vacuum treatment chamber, introducing a gas into the vacuum treatment chamber, providing electric power to generate an ion source and using the ion source to treat the surface of the glass substrate. By this way, the invention can achieve an effect of surface cleaning and further render the conductive film to be coated on the glass substrate in the subsequent stage to have a reduced surface resistance, thereby improving the conductivity of the glass substrate. The film coated on the glass substrate in the subsequent stage will have higher crystalline level as well. | 01-12-2012 |
| 20120009392 | Strengthened substrate structure - The substrate according to the invention includes at least one surface coated with an organic buffer layer and the organic buffer layer is provided with a coating layer on a surface thereof opposite to its surface attached to the substrate. The provision of the organic buffer layer diminishes the effect of the coating layer on the strength of the substrate, thereby maintaining the strength of the substrate. | 01-12-2012 |
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| 20100040821 | Molding glass lens and mold thereof - A molding glass lens and a mold thereof are disclosed. The molding glass lens consists of an upper optical surface, a lower optical surface, two outers surrounding the optical surfaces and at least three grooves arranged in the form of a circle disposed on the lower outer and/or the upper outer. The disposition of the grooves has no affecting in original size of the outers as well as assembling with other mechanical parts in les group. The mold of the lens includes an upper molding unit and a lower molding unit. Cavity of each molding unit is composed of a central part for forming an optical surface of the lens and an outer circular part for forming outer of the lens. At least three protrudent parts with the same height are disposed in the form of a circle on the outer circular of the lower molding unit and/or the upper molding unit. Thus the air in the mold cavity is easy to exhaust through the gap formed by protrudent parts and glass preform. Therefore, air bubbles generated during the molding processes are prevented and precision of the glass lens is provided. | 02-18-2010 |
| 20100157428 | GLASS LENS ARRAY MODULE WITH ALIGNMENT MEMBER AND MANUFACTURING METHOD THEREOF - A glass lens array module with alignment fixture and a manufacturing method thereof are revealed. A glass lens array is produced by multi-cavity glass molding and alignment members are arranged on a peripheral of non-optical area of the glass lens array. Optical axis of each of two adjacent glass lens arrays is aligned by corresponding alignment members and the glass lens arrays are assembled by glue. A spacer is disposed between the two adjacent glass lens arrays to form a preset interval if needed. Thus a glass lens array module is formed after curing of the glue. Thereby the alignment of the optical axis of the glass lens is achieved easily and optical precision is also attained. Moreover, the manufacturing processes are simplified and the cost is reduced. | 06-24-2010 |
| 20100284089 | STACKED OPTICAL GLASS LENS ARRAY, STACKED LENS MODULE AND MANUFACTURING METHOD THEREOF - A stacked optical glass lens array, a stacked lens module and a manufacturing method thereof are disclosed. The stacked optical glass lens array includes at least two optical glass lens arrays whose optical axis are aligned and then stacked with each other by cement glue in glue grooves. A stacked optical glass lens element can be singularized by cutting along with the alignment notches of stacked optical glass lens array. The stacked lens module is formed by a single stacked optical glass lens element and related optical element mounted in a lens holder. Thereby the optical axis of the lenses of the stacked lens module are aligned precisely, the manufacturing processes are simplified and the production cost is reduced. | 11-11-2010 |
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| 20100015534 | METHOD FOR MONITORING PHOTOLITHOGRAPHY PROCESS AND MONITOR MARK - A method for monitoring a photolithography process includes providing a monitor mark having high sensitivity of the focus of the photolithography process, transferring the monitor mark together with the product patterns through the photolithography process onto a substrate, and measuring the deviation dimension of the monitor mark formed on the substrate to real-time monitor the focus of the photolithography process. | 01-21-2010 |
| 20100149535 | METHOD OF MEASURING NUMERICAL APERTURE OF EXPOSURE MACHINE, CONTROL WAFER, PHOTOMASK, AND METHOD OF MONITORING NUMERICAL APERTURE OF EXPOSURE MACHINE - A method of measuring a numerical aperture of an exposure machine is described. A control wafer having vernier marks thereon and an aberration mask having pinholes therein are provided, wherein each pinhole corresponds to a vernier mark in position. A lithography process using the exposure machine and the aberration mask is performed to the control wafer, so as to form over each vernier mark a photoresist pattern having the same shape of the illumination pattern of the light source of the exposure machine. The numerical aperture of the exposure machine is then derived from a graduation of the vernier mark corresponding to an outer edge of the photoresist pattern. | 06-17-2010 |
| 20100265774 | METHOD FOR DETERMINING NATIVE THRESHOLD VOLTAGE OF NONVOLATILE MEMORY - A method for determining native threshold voltage of nonvolatile memory includes following steps. A memory cell including a control gate, a charge storage layer, a source region, and a drain region is provided. A programming operation is performed on the memory cell by using F-N tunneling effect to obtain a programming curve of time versus threshold voltage. In the programming operation, a positive voltage is applied to the control gate. An erase operation is performed on the memory cell by using F-N tunneling effect to obtain an erasure curve of time versus threshold voltage. In the erase operation, a negative voltage is applied to the control gate. The absolute values of the positive voltage and the negative voltage are the same. The native threshold voltage of memory cell is determined from the cross point of the programming curve and the erasure curve. | 10-21-2010 |
