| Patent application number | Description | Published |
|---|
| 20080245558 | VIA STRUCTURE OF PRINTED CIRCUIT BOARD - A printed circuit board ( | 10-09-2008 |
| 20090044968 | FLEXIBLE PRINTED CIRCUIT BOARD - An exemplary FPCB includes a signal layer having a differential pair consisting of two transmission lines arranged therein, a ground layer, and a dielectric layer lying between the signal layer and the ground layer. Two sheets made of conductive materials are respectively arranged at opposite sides of the differential pair, and both connected to ground. The sheets are apart from and parallel to the transmission lines. The ground layer has a void defined therein, and the void is located under the two transmission lines. | 02-19-2009 |
| 20090056983 | PRINTED CIRCUIT BOARD - A printed circuit board (PCB) includes first and second signal layers sandwiching a dielectric layer therebetween and a first differential pair and a second differential pair each having a positive differential trace and a negative differential trace. The positive differential traces of the two differential pairs are disposed within the first signal layer. The negative differential traces of the two differential pairs are disposed within the second signal layer. The positive differential trace of the first differential pair is defined at the left side of the positive differential trace of the second differential pair. The negative differential trace of the first differential pair is defined at the right side of the negative differential trace of the second differential pair. | 03-05-2009 |
| 20090065238 | PRINTED CIRCUIT BOARD - An exemplary PCB includes a first reference layer, a first signal layer, a second signal layer, and a third signal layer in that order, a first differential pair is arranged in the first signal layer in edge-coupled structure and references the first reference layer, a distance between the first signal layer and the second signal layer is greater than a distance between the first reference layer and the first signal layer, a second differential pair is arranged in the second signal layer and the third signal layer in broad-coupled structure. The PCB has a high density layout of transmission lines. | 03-12-2009 |
| 20090065241 | PRINTED CIRCUIT BOARD - A printed circuit board (PCB) includes first and second signal layers sandwiching a dielectric layer therebetween, and a differential pair having two differential traces respectively disposed within the first and second signal layers. Two ground parts are respectively arranged at opposite sides of each of the two differential traces. | 03-12-2009 |
| 20090078452 | FLEXIBLE PRINTED CIRCUIT BOARD - An exemplary FPCB includes a differential pair consisting of a first transmission line and a second transmission line, a signal layer with the first transmission line arranged therein, a ground layer having a void which includes the area beneath the first transmission line, and a dielectric layer lying between the signal layer and the ground layer. The second transmission line is arranged in the ground layer offset from the first transmission line in the horizontal direction. The FPCB can transmit high speed signals. | 03-26-2009 |
| 20090086452 | PRINTED CIRCUIT BOARD - A printed circuit board (PCB) includes parallel first and second signal layers sandwiching a dielectric layer therebetween, and a differential pair having two differential traces respectively disposed within the first and second signal layers at least partially overlapping in vertical alignment. Horizontal distance between midlines of the two differential traces is less than the width of either of the two differential traces. | 04-02-2009 |
| 20090259984 | METHOD OF PRINTED CIRCUIT BOARDS - A design method of printed circuit boards includes the following steps. First, simulate a printed circuit board including power layers, and vias connected to all the power layers. Then, change connections of the vias that tend to draw too much current to be connected to fewer power layers, than the vias that tend to draw less current. Repeat adjusting connections of the vias until all vias draw a similar amount of current such that no via draws more current than an upper limit the vias are designed for. Finally, according to the results, design/fabricate a PCB with vias respectively insulated, as needed, from the power layers that do not need to be connected to the vias. | 10-15-2009 |
| 20090260860 | FLEXIBLE PRINTED CIRCUIT BOARD - An exemplary FPCB includes two or more dielectric layers. Each dielectric layer is located between a signal layer and a ground layer. A differential pair including two transmission lines is arranged in each signal layer. Each ground layer includes one or more voids defined therein. Each void is opposite and adjacent to a differential pair. | 10-22-2009 |
| 20090294168 | PRINTED CIRCUIT BOARD - A printed circuit board includes a first layout layer, a second layout layer, a copper foil layer, a first via and a second via. The first layout layer has a first signal line and a second signal line, each of which has a curved first portion. The second layout layer has a third signal line and a fourth signal line, each of which also has a curved first portion. The curved first portions of the first signal line, the second signal line, the third signal line and the fourth signal line are coupled to the first via and the second via. In this case, the curved first portions of the first signal line, the second signal line, the third signal line and the fourth signal line cooperatively generate spiral inductance characteristic. | 12-03-2009 |
| 20100237961 | DIFFERENTIAL SIGNAL TRANSMISSION CABLE AND METHOD FOR COMPENSATING LENGTH OFFSET THEREOF - A compensation method compensates for a length offset between a first transmission line and a second transmission line of a differential signal transmission. The compensation method includes calculating a transmission speed of a first signal in the first transmission line, measuring lengths of the first and second transmission lines, calculating a transmission time of the first signal in the first transmission line, and calculating a relationship between permittivity values of the first and second transmission lines. The compensation method further changes the permittivity values of the first and second transmission lines according to the relationship. | 09-23-2010 |
| 20100243310 | PRINTED CIRCUIT BOARD - A printed circuit board (PCB) includes a power layer, a ground layer, a through hole, and a conductor. The through hole goes through the power layer and the ground layer. The conductor includes a hollow columnar main body and an extending portion. The main body is formed in a bounding wall of the through hole, and is conductively connected to one of the power layer and the ground layer, and insulated from the other one of the power layer and the ground layer by an insulation area. The extending portion extends out from the circumferential surface of the main body. The extending portion extends into the insulation area and is insulated from the other one of the power layer and the ground layer, to increase an area of the power layer facing the ground layer. | 09-30-2010 |
| 20100271149 | HIGH-FREQUECY MODULE FOR WIRELESS COMMUNICATIONS - A high-frequency module includes an antenna, an impedance matching circuit, and a transmission wire. The transmission wire is connected between the antenna and the impedance matching circuit. The transmission wire includes a dielectric layer, a signal layer, and two ground layers. The signal layer and the ground layers are located on the dielectric layer. The ground layers are located at opposite sides of the signal layer respectively. A space is formed between a signal and each ground layer. | 10-28-2010 |
| 20100283697 | ELECTRONIC DEVICE AND MULTI-FREQUENCY ANTENNA THEREOF - An electronic device includes a multi-frequency antenna. The multi-frequency antenna includes a ground portion, a support body, a radiation portion, and a strap. The ground portion defines a gap, and two grooves communicating with the gap and located at opposite ends of the gap. The radiation portion resists against a sidewall bounding the gap, and is connected to the strap. The radiation portion is accommodated in the gap and substantially coplanar with the ground portion. The radiation portion defines a slot. The support body is located in the gap and on the radiation portion, to support the strap. | 11-11-2010 |
| 20100307806 | PRINTED CIRCUIT BOARD - A printed circuit board includes a signal layer and a power layer. A differential pair with two transmission lines is set on the signal layer. A cross-trench portion is formed in the power layer. A first width of each transmission line which is not located above the cross-trench portion is less than a second width of the transmission line which is located above the cross-trench portion. A first distance between the two transmission lines which are not located above the cross-trench portion is greater than a second distance between the two transmission lines which are located above the cross-trench portion. | 12-09-2010 |
| 20110037556 | PRINTED CIRCUIT BOARD - A printed circuit board includes a first layer, a second layer, a number of vias each passing through the first and second layers, and a number of transmission lines. Each transmission line is connected between bonding pads of the two of the number of vias to form a helical-shaped transmission path by the vias and the transmission lines. As a result, the printed circuit board can generate inductive effect. | 02-17-2011 |
| 20110050365 | SIGNAL TRANSMISSION APPARATUS - A signal transmission apparatus includes a first ground layer, a second ground layer and a band pass filter. The band pass filter includes a first transmission line positioned in a void defined in the first ground layer and a second transmission line positioned in a void defined in the second ground layer. Each of the first transmission line and the second transmission line includes a coil with a plurality of turns spirally extending in the same plane, a gasket extending from the coil and located in the center of the coil, and a signal terminal extending from extremity of the coil. According to employing the band pass filter, the signal transmission apparatus has filtering function, therefore, quality of signals transmitted through the signal transmission apparatus is improved. | 03-03-2011 |
| 20110051793 | SYSTEM AND METHOD FOR EVALUATING PERFORMANCE OF A MIMO ANTENNA SYSTEM - A performance evaluation system for a multiple-input multiple-output (MIMO) antenna system receives simulation parameters from an input device, and simulates a MIMO antenna system accordingly. A method, also provided, further evaluates performance of the simulated MIMO antenna system when a series of radio frequency (RF) signals are transmitted through the MIMO antenna system, and displays a performance analysis result of the MIMO antenna system on a display device for evaluation of the performance of the simulated MIMO antenna system. | 03-03-2011 |
| 20110094786 | PRINTED CIRCUIT BOARD - A printed circuit board includes a number of signal layers, a number of ground layers, a first transmission line, a second transmission line, a first via, and a second via. The first transmission is located on one of the number of signal layers. The second transmission line is located on another of the number of signal layers. The first and second vias pass through the printed circuit board. The first via is electrically coupled to the first and second transmission lines, and is isolated from the number of ground layers. The second via is electrically coupled to one or more of the number of ground layers, and is isolated from the other of the number of ground layers to increase an inductance, thus compensating capacitive nature of an open stub and improving signal integrity. | 04-28-2011 |
| 20110122296 | SYSTEM AND METHOD FOR DEBLURRING MOTION BLURRED IMAGES - An image deblurring system deblurs motion blurred images of a video stream captured from a moving object. An image deblurring method selects a blurred image from the video stream, selects blurred pixels from the blurred image, and calculates a movement offset for each of the blurred pixels according to coordinates of the blurred pixel in a frequency domain during the movement of the moving object. The method generates a point spread function according to the movement offset, and generates an image conversion formula according to the point spread function. The method converts each of the blurred pixels into a sharp pixel according to the image conversion formula, and generates a sharp image based on all of the sharp pixels. | 05-26-2011 |
