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Chien-Chung Huang
Chien-Chung Huang, Wufong Township TW
| Patent application number | Description | Published |
|---|---|---|
| 20110060077 | Process for Manufacturing High-Performance Natural Fiber Reinforced Composites - In this patent, fibers have been successfully extracted from various natural occurring materials using a series of chemical, biological and mechanical methods. Moreover, these fibers can be conjugated onto certain polymer chains via coupling agent and chemical modification. Consequently, the thermal stability and mechanical properties of the polymers can be dramatically elevated with the incorporation of these fibers. The intended polymers include conventional plastics (epoxy resins, polyesters and polyolefins etc.), rubbers (natural rubbers and thermoplastic rubbers etc.) and biodegradable polymers. Apart from the enhancement of mechanical properties and thermal stability, the incorporation of natural fibers can reduce the production cost of the materials and meet the demand of environmental protection. | 03-10-2011 |
Chien-Chung Huang, Taichung TW
| Patent application number | Description | Published |
|---|---|---|
| 20100072622 | Method for forming Barrier Layer and the Related Damascene Structure - A method for forming barrier layers comprises steps of forming a first metal barrier layer covering a first dielectric layer and contacting a conductive layer through a via of the first dielectric layer, forming a barrier layer of metalized materials on the first metal layer, optionally forming a second metal barrier layer on the barrier layer of metalized materials, removing portions of the barrier layer of metalized materials above the via bottom in the first dielectric layer, and leaving the barrier layer of metalized materials remaining on the via sidewall in the first dielectric layer; and forming a second metal layer covering the barrier layer of metalized materials. The accomplished barrier layers will have lower resistivity on the via bottom in the first dielectric layer and they are capable of preventing copper atoms from diffusing into the dielectric layer. | 03-25-2010 |
| 20100254148 | Lamp holder structure having heat dissipation fins - A lamp holder structure having heat dissipation fins comprises a base having a recess with threaded holes for install a luminous lamp set and at least one power line-in for connecting a power line. A plurality of heat dissipation fins arranged in parallel is extended and integrated from a corresponding exterior of the recess and a plurality of heat dissipation diverging fins is extended and integrated from an extreme exterior of the heat dissipation fins. Symmetric protruding plates are connected to predetermined places of the exterior of the base to pivotally connect a positioning plate capable of adjusting angles. A light-transmissive plate further seals the base and symmetric side strips are used to respectively lock symmetric frame borders of the base to position the light-transmissive plate. The corresponding sides of the recess of the base have locking holes for locking symmetric side covers. | 10-07-2010 |
Chien-Chung Huang, Hsichih TW
| Patent application number | Description | Published |
|---|---|---|
| 20090257184 | DRAM MODULE WITH SOLID STATE DISK - A dynamic radon access memory (DRAM) module includes a printed circuit board, a number of DRAM units, a number of flash memory units, a number connecting pins and an interface controller. The DRAM units and the flash memory units are distributed on the printed circuit board. The connecting pins are formed at an edge of the printed circuit board. The interface controller is electrically connected to the flash memory units and a portion of the connecting pins, wherein each of the interface controller provides at least one serial interface between the flash memory units and the portion of connecting pins thereby enabling data transmission through the portion of connecting pins in at least one serial mode. The flash memory units integrally constitute a flash disk drive in the DRAM module. Therefore, frequently installation and uninstallation of the flash memory drive can be avoided. A motherboard assembly including the aforementioned DRAM module can be developed. | 10-15-2009 |
Chien-Chung Huang, Tu-Cheng TW
| Patent application number | Description | Published |
|---|---|---|
| 20090186597 | SYSTEM AND METHOD FOR MANAGING A PHONE BOOK IN A MOBILE PHONE - A method for managing a phone book in a mobile phone is provided. The method sets a priority level for each contact history in a history list based on a type of the contact history, assigns a weight value to each contact history based on the priority level of the contact history. The method further obtains a totalized weight value of each contact by totalizing weight values of all contact histories of the contact, and sorts entries of the contacts in the phone book according to totalized weight values of all the contacts. | 07-23-2009 |
Chien-Chung Huang, Hsinchu City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090157455 | INSTRUCTION SYSTEM AND METHOD FOR EQUIPMENT PROBLEM SOLVING - A method and system of providing instructions in addressing an equipment problem are provided. An indication of an equipment problem is checked against a solution database to identify at least one suggested solution to the equipment problem. A suggested solution from the at least one suggested solution is provided. An actual fix solution implemented in association with the equipment problem is recorded. | 06-18-2009 |
Chien-Chung Huang, Taichung County TW
| Patent application number | Description | Published |
|---|---|---|
| 20090104773 | METHOD OF FORMING CONTACT - A substrate having at least two metal oxide semiconductor devices of a same conductive type and a gap formed between the two devices is provided. A first stress layer is formed over the substrate to cover the metal-oxide semiconductor devices and the substrate, filling the gap. An etching back process is then performed to remove a portion of the stress material layer inside the gap. A second stress layer and a dielectric layer are sequentially formed on the first stress layer. The first stress layer and the second stress layer provide a same type of stress. A portion of the second stress layer is removed to form a contact opening. A second conductive layer is filled into the contact opening to form a contact. | 04-23-2009 |
| 20110127589 | SEMICONDUCTOR STRUCTURE HAIVNG A METAL GATE AND METHOD OF FORMING THE SAME - A method of forming a semiconductor structure having a metal gate. Firstly, a semiconductor substrate is provided. Subsequently, at least a gate structure is formed on the semiconductor substrate. Afterwards, a spacer structure is formed to surround the gate structure. Then, an interlayer dielectric is formed. Afterwards, a planarization process is performed for the interlayer dielectric. Then, a portion of the sacrificial layer is removed to form an initial etching depth, such that an opening is formed to expose a portion of the spacer structure. The portion of the spacer structure exposed to the opening is removed so as to broaden the opening. Afterwards, remove the sacrificial layer completely via the opening. Finally, a gate conductive layer is formed to fill the opening. | 06-02-2011 |
| 20110147948 | FORMING METHOD AND STRUCTURE OF POROUS LOW-K LAYER, INTERCONNECT PROCESS AND INTERCONNECT STRUCTURE - A structure of a porous low-k layer is described, comprising a bottom portion and a body portion of the same atomic composition, wherein the body portion is located on the bottom portion, and the bottom portion has a density higher than the density of the body portion. An interconnect structure is also described, including the above porous low-k layer, and a conductive layer filling up a damascene opening in the porous low-k layer. | 06-23-2011 |
Chien-Chung Huang, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20080225525 | LIGHT SOURCE MODULE - A light source module for a projection apparatus including a light source unit, a fan, a temperature sensor and a temperature controller is provided. The fan is disposed towards the light source unit and is capable of cooling the light source unit. The temperature sensor is disposed adjacent to the light source unit and is capable of sensing an operating temperature of the light source unit. The temperature controller is electrically coupled to the fan and the temperature sensor, and is capable of adjusting a rotation speed of the fan according to the operating temperature of the light source unit. The invention is capable of keeping the operating temperature of the light source unit at or close to the predetermined operating temperature thereof by adjusting the rotation speed of the fan. | 09-18-2008 |
Chien-Chung Huang, New Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110235260 | DRAM MODULE WITH SOLID STATE DISK - A dynamic radon access memory (DRAM) module includes a printed circuit board, a number of DRAM units, a number of flash memory units, a number connecting pins and an interface controller. The DRAM units and the flash memory units are distributed on the printed circuit board. The connecting pins are formed at an edge of the printed circuit board. The interface controller is electrically connected to the flash memory units and a portion of the connecting pins, wherein each of the interface controller provides at least one serial interface between the flash memory units and the portion of connecting pins thereby enabling data transmission through the portion of connecting pins in at least one serial mode. The flash memory units integrally constitute a flash disk drive in the DRAM module. Therefore, frequently installation and uninstallation of the flash memory drive can be avoided. A motherboard assembly including the aforementioned DRAM module can be developed. | 09-29-2011 |