Chien-Chi

Chien-Chi Chen, Taipei TW

Patent application number	Description	Published
20090316346	Computer housing - A computer housing is adapted for mounting an interface card, and includes a housing body and a positioning device. The housing body includes a mounting portion and a first fixing portion disposed adjacent to the mounting portion. The positioning device includes a positioning component having a second fixing portion. The positioning component is pivotable relative to the housing body between a card retaining position, where the second fixing portion engages the first fixing portion and the positioning component is disposed to be capable of blocking removal of the interface card from the mounting portion, and a card releasing position, where the second fixing portion is disengaged from the first fixing portion and the positioning component is disposed to permit removal of the interface card from the mounting portion.	12-24-2009

Patent application number	Description	Published
20080218482	Input apparatus - The invention provides an input apparatus, which includes a signal-scanning line, a plurality of signal-outputting lines, an output end, and a plurality of first keys. In addition, the signal-scanning line has a first signal level, whereas each of the signal-outputting lines has a second signal level. Moreover, the output end is coupled with each of the signal-outputting lines and determines a key code based on the signal level of the signal-outputting lines. Furthermore, each of the first keys has at least three contacts, one of which is coupled with the signal-scanning line, and the others are selectively coupled with the signal-outputting lines. Particularly, when one of the first keys is pressed, the contacts and signal-outputting lines corresponded to the pressed first keys has the first signal level.	09-11-2008

Patent application number	Description	Published
20100166290	DIE DEFECT INSPECTING SYSTEM WITH A DIE DEFECT INSPECTING FUNCTION AND A METHOD OF USING THE SAME - A die defect inspecting system with a die defect inspecting function includes a wafer-positioning module, an image-capturing module, a die-sucking module, a die defect analyzing module, a die-classifying module and a control module. The image-capturing module is disposed beside one side of the wafer-positioning module in order to capture an image of each die. The die-sucking module is disposed above the wafer-positioning module and the image-capturing module in order to suck each die from the wafer-positioning module to a position above the image-capturing module for capturing a back image of a back surface of each die. The die defect analyzing module is electrically connected to the image-capturing module in order to judge whether the back image of the back surface of each die passes inspection standard.	07-01-2010