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Chien
Chien Chen, Hsinchu County TW
| Patent application number | Description | Published |
|---|---|---|
| 20100142424 | DATA SCHEDULING MODULE, METHOD, AND COMPUTER PROGRAM PRODUCT THEREOF FOR A WIRELESS COMMUNICATION APPARATUS - A data scheduling module, a data scheduling method and computer program product thereof for a wireless communication apparatus are provided. The data scheduling method comprises the following steps: determining that the frame length of a second data transmission interval is not smaller than a frame length of a first data transmission interval; summing at least one first data and at least one second data according to the frame length of the second data transmission interval; calculating an average value according to the frame length of the second data transmission interval and the summed result; calculating an aggregate data transmission interval according to a data transmission capacity, the average value, and an integer adjusting value; and transmitting the at least one first data and the at least one second data via a plurality of frames in accordance with the aggregate data transmission interval. | 06-10-2010 |
| 20100268445 | FLEET MAINTENANCE METHOD AND IN-VEHICLE COMMUNICATION SYSTEM - A fleet maintenance method for generating a suggested speed for each vehicle in a fleet to maintain the vehicle in the fleet is provided. In the fleet maintenance method, vehicles are clustered into a plurality of sub-fleets, and in each sub-fleet, one vehicle is selected as a leader vehicle and the other vehicles are considered as member vehicles. Besides, a position coordinate and a speed of each vehicle in each sub-fleet are obtained, and the position coordinate is converted into a corresponding linear coordinate. In addition, a sub-fleet gravity center of each sub-fleet and a fleet gravity center of the entire fleet are calculated according to the linear coordinates. Moreover, a suggested speed of each leader vehicle is generated according to a gravity center distance of the leader vehicle, and a suggested speed of each member vehicle is generated. | 10-21-2010 |
Chien Ming-Far, Taipei County TW
| Patent application number | Description | Published |
|---|---|---|
| 20100110051 | CONTROL METHOD FOR LENS DRIVE SCREEN - The present invention provides a control method and its system of lens drive screen, wherein a lens connected to electronic device is displaced, then a displacement signal is generated and sent to the microprocessor of electronic device for identification, and then the displacement signal is converted into a control signal to control the display screen of the electronic device; the system mainly comprising: a lens, used for acquiring initial images and shift images; a control program, loaded into an electronic device; it employs shape detection algorithm and target tracking algorithm to position the initial images and track the varying shift, rotation or zooming of the lens as well as the relative displacement, and convert it into a displacement signal to the electronic device; then, the microprocessor of the electronic device converts the displacement signal into a control signal so as to control on-screen operation by the application. | 05-06-2010 |
Chien Nguyen, Huntigton Beach, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090195163 | Single LED String Lighting - A solid state lighting unit constituted of: a control circuitry; a single string of light emitting diodes, the single string constituted of a plurality of sections each comprising a plurality of light emitting diodes; and a plurality of bypass paths each responsive to the control circuitry, each of the plurality of bypass paths arranged to provide bypass to a particular one of the plurality of sections, wherein the control circuitry is operative to identify an open circuit condition of a particular one of the plurality of sections, and activate the bypass path arranged to bypass the open circuit section, thereby providing light through sections not exhibiting an open circuit condition. | 08-06-2009 |
Chien Nguyen, Huntington Beach, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20110141775 | NON-DISSIPATIVE START UP CIRCUIT - A start up circuit constituted of: a first alternating current lead; a second alternating current lead, said second alternating current lead exhibiting an opposing phase of said first alternating current lead; a first capacitor, a first end of said first capacitor coupled to said first alternating current lead; a second capacitor, a first end of said second capacitor coupled to said second alternating current lead; a breakdown diode coupled between a second end of said first capacitor and a second end of said second capacitor; and a third capacitor coupled in parallel with said breakdown diode. A direct current power is developed across the breakdown diode without requiring dissipative elements. | 06-16-2011 |
| 20110187283 | DIMMING INPUT SUITABLE FOR MULTIPLE DIMMING SIGNAL TYPES - A lighting circuit constituted of: a single dimming input; a pulse width modulation acceptance circuit arranged to convert a pulse width modulated dimming signal received at the single dimming input into a local dimming signal, the local dimming signal exhibiting a predetermined format; an analog voltage level acceptance circuit arranged to convert an analog voltage dimming signal received at the single dimming input into the local dimming signal exhibiting the predetermined format; and a luminaire driving circuit responsive to the local dimming signal. | 08-04-2011 |
Chien Wei-Chih, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20110230012 | METHOD FOR FILLING MULTI-LAYER CHIP-STACKED GAPS - A method for filling multi-layer chip-stacked gaps is revealed, primarily comprising the steps as below. Firstly, a chip-stacked assembly is provided, comprising a substrate and a plurality of chips vertically stacked on the substrate where at least a first underfilling gap is formed between each two adjacent ones of the stacked chips with a height difference from the substrate. Then, the chip-stacked assembly is flipped and dipped into an underfilling material where the underfilling material is disposed in a storage tank in a flowing state to completely fill the first underfilling gap. Then, the chip-stacked assembly is taken out. Finally, the chip-stacked assembly is heated to cure the underfilling material filled in the first underfilling gap. Accordingly, multi-layer chip-stacked gaps with different heights can be simultaneously filled at one single step. The conventional underfilling difficulty of multi-layer chip-stacked gaps can be solved leading to higher productivity. | 09-22-2011 |