Patent application number | Description | Published |
20090242169 | HEAT-DISSIPATING DEVICE WITH CURVED VAPOR CHAMBER - A heat-dissipating device includes a vapor chamber shown as a flat long plate, a heat-dissipating plate superposed on the vapor chamber, and a first fin set. The middle portion of the vapor chamber is designed as a heated section, two sides of which respectively have a condensing section. Two curvedly extending sections are respectively disposed between the heated section and the condensing sections. Each condensing section is extended to a higher position of the heated section through the bending of each extending section. The heat-dissipating plate is horizontally attached onto the two condensing sections, thus that a section-differential space formed between the heat-dissipating plate and the heated section accommodates the first fin set thermally contacted with the heated section of the vapor chamber. | 10-01-2009 |
20100132922 | VAPOR CHAMBER AND COOLING DEVICE HAVING THE SAME - A vapor chamber is provided to include shell, capillary tissue, working fluid, heat-absorbing section and heat-releasing section. A hollow chamber is formed in the shell. The capillary tissue is arranged and accommodated in the hollow chamber. The working fluid is injected into and filled in the hollow chamber. Two corresponding surfaces of the shell at the heat-releasing section are respectively a non-planar shape. Because the two corresponding surfaces of the shell at the heat-releasing section are respectively a non-planar shape, the structure strength of the vapor chamber is higher and the anti-deforming ability is superior, thereby the using life of the vapor chamber being prolonged. In addition, the vapor chamber can be combined with cooling fins to become a cooling device. Since the two corresponding surfaces of the shell at the heat-releasing section are respectively designed as a non-planar shape, the vapor chamber and the cooling fins have larger contacting surfaces, making the heat-transferring effectiveness thereby enhanced significantly. | 06-03-2010 |
20100133553 | THERMALLY CONDUCTIVE STRUCTURE OF LED AND MANUFACTURING METHOD THEREOF - A thermally conductive structure of a light emitting diode (LED) includes a vapor chamber, an insulating layer, an electrically conductive layer and a plurality of LEDs. In the invention, the insulating layer is plated over a surface of the vapor chamber; the electrically conductive layer disposed on the insulating layer is electrically separated from the vapor chamber and has a first electrode and a second electrode; and the LEDs arranged on the insulating layer respectively have a first leg connected to the first electrode and a second leg connected to the second electrode; thereby, the invention has an excellent performance of thermal conduction and heat dissipation, which is capable of prolonging the lifespan of LED. | 06-03-2010 |
20100175856 | VAPOR CHAMBER WITH WICK STRUCTURE OF DIFFERENT THICKNESS AND DIE FOR FORMING THE SAME - A vapor chamber with a wick structure of different thickness includes a casing, a wick structure, a supporting body and a working fluid. The casing has a chamber. The wick structure is adhered to the inner wall of the chamber. The wick structure has a first wick section and a second wick section extending from the first wick structure. The thickness of the first wick section is larger than that of the second wick section. The supporting body is received within the wick structure. The working fluid is filled within the chamber. Via the above arrangement, the heat-conducting efficiency can be increased while the cost can be reduced. | 07-15-2010 |
20100242952 | SOLAR POWER SYSTEM WITH TOWER TYPE HEAT DISSIPATING STRUCTURE - A tower type heat dissipating structure is applied to dissipate the heat of a solar power system. The solar power system is provided with a reflector having a hemispheric surface for reflecting the sunlight to a solar cell. The heat dissipating structure comprises a heat-conducting plate, a plate type heat pipe and a plurality of heat dissipating fins. One side of the heat-conducting plate is connected with the solar cell, and the other side is provided with a groove for being embedded an end of the plate type heat pipe. The heat dissipating fins is arranged with an inclination angle against the plate type heat pipe that can promote the heated air within the gaps to rise. The heat is rapidly conduced to prevent the solar cell from being destroyed by overheating for reducing the repairing costs. | 09-30-2010 |
20100243211 | HEAT DISSIPATING STRUCTURE OF HIGH POWER LED PROJECTOR LAMP - A heat dissipating structure is capable of dissipating heat quickly in a high power LED projector lamp to improve the heat dissipating efficiency. The structure includes a heat-conducting plate, a plate type heat pipe and a plurality of heat dissipating fins. One side of the heat-conducting plate provides a plurality of grooves for mounting one end of the plate type heat pipe, wherein those two are perpendicular to each other. Furthermore, the heat dissipating fins having a plurality of slots are stacked and arranged at intervals for disposing the plate type heat pipe with an inclined angle. Hence, the heat generated from the high power LED will be conducted quickly and the heat dissipating efficiency will be improved. | 09-30-2010 |
20100243212 | NON-FLAT VAPOR CHAMBER WITH STIFFENING PLATE - A non-flat vapor chamber includes a casing, a capillary tissue, a stiffening plate, a support structure and a working fluid. The casing includes a lower case plate and an upper case plate sealed with the lower case plate. The lower case plate has a partial area protruded downward to form a chamber and a retaining portion formed within the chamber. A capillary tissue is installed on internal walls of the upper and lower case plates. The stiffening plate with a through hole is installed onto the retaining portion, and the casing contains a support structure. Upper and lower ends of the support structure abut the capillary tissue and the stiffening plate. A working fluid is filled into the casing, such that a support action is provided by pressing the stiffening plate at the retaining portion for stiffening the upper case plate of a vacuumed vapor chamber. | 09-30-2010 |
20100309671 | LED LAMP HEAT DISSIPATING MODULE - A heat dissipating module embedded into an LED lamp house for dissipating heat of an LED light emitting element includes two flat heat pipes, a heat dissipating body and a conducting base. The heat dissipating body includes a cylindrical pillar, heat sinks radially formed around the cylindrical pillar, two longitudinal through grooves at the cylindrical pillar for passing a condensation section of the flat heat pipe. The conducting base includes corresponding first and second surfaces, and the first surface is attached to an evaporation section of the flat heat pipe, and the second surface is attached to the LED light emitting element. The conducting base perpendicular to an axis of the cylindrical pillar includes an embedding slot for embedding the heat dissipating module into an internal wall of the lamp house, such that the heat dissipating module can quickly dissipate the heat generated by the LED light emitting element. | 12-09-2010 |
20100326629 | VAPOR CHAMBER WITH SEPARATOR - A vapor chamber with separator includes shell, capillary tissue, separator, supporting structure and working fluid. The shell includes inter-sealed lower and upper shell plates. Partial section of the lower shell plate projects downwardly and forms accommodating room therein. The capillary tissue is arranged by distributing over inner wall of the lower shell plate. The separator overlapped the capillary tissue is arranged penetrating trough corresponding to the accommodating room. Liquid passage is formed between the lower shell plate and the separator. The supporting structure is accommodated in the shell with upper and lower sides respectively inter-abutted against the upper shell plate and the separator. Vapor passage formed between the upper shell plate and the separator is communicated to the liquid passage. The working fluid is filled into the shell. Since the vapor and liquid working fluids are separated by the separator to avoid interference, the cooling performance is thus boosted. | 12-30-2010 |
20110027738 | SUPPORTING STRUCTURE WITH HEIGHT DIFFERENCE AND VAPOR CHAMBER HAVING THE SUPPORTING STRUCTURE - A vapor chamber having supporting structure with height difference, includes a shell, tissue wick structure, working fluid filled into the shell and supporting structure with height difference, disposed over inner walls of the shell, accommodated in the shell, abutted against the wick structure, and including first corrugated piece and second corrugated piece, both of which are connected to each other. The longitudinal distance between top and bottom of the first corrugated piece is a first amplitude. The longitudinal distance between top and bottom of the second corrugated piece is a second amplitude larger than the first amplitude. Since the second amplitude provides the shell with greater supporting force, when the shell is pressed to make heating element and the shell contact closely, a recessing phenomenon won't occur to the shell, thereby, increasing the contact tightness and promoting the thermally conductive efficiency. | 02-03-2011 |
20110056670 | HEAT SINK - A heat sink includes a frame, a vapor chamber fixed to the frame, and a heat-dissipating plate adhered to one surface of the vapor chamber. The heat-dissipating plate has a first heat-dissipating fins region and a second heat-dissipating fins region. The first heat-dissipating fins region and the second heat-dissipating fins region are composed of a plurality of first heat-dissipating fins and a plurality of second heat-dissipating fins that are arranged at intervals, respectively. The pitch of the first heat-dissipating fins in the first heat-dissipating fins region is smaller than that of the second heat-dissipating fins in the second heat-dissipating fins region. By this arrangement, airflow can flow freely among the respective heat-dissipating fins. The first heat-dissipating fins region is used to dissipate a great amount of heat, while the second heat-dissipating fins region is used to exhaust the air rapidly. Thus, the heat-dissipating efficiency can be increased. | 03-10-2011 |
20110067844 | PLANAR HEAT PIPE - The planar heat pipe includes a metallic tube composed of two flat extensions and a shrinked intermediate structure, a wick structure, a working fluid and a support element. The flat extensions are separately located at two ends of the metallic tube. The intermediate structure connects between the flat extensions. The wick structure is arranged in the metallic tube. The working fluid is injected in the metallic tube and attached in the wick structure. The support element is disposed in the metallic tube for supporting the wick structure. | 03-24-2011 |
20110067850 | Buckling Device with Cooling Function - A buckling device for electronic heating element, inter-assembled with a thermally conductive body, includes a cooling plate, a pair of fixing legs bent-and-extended from the cooling plate and formed under the cooling plate and a fixing arm bent-and-extended from the cooling plate and formed under the cooling plate. On the cooling plate, a plurality of slots are stamped, one side of each of which is bent and configured into a cooling piece. The thermally conductive body is fixed by being sandwiched between the fixing arm and the cooling plate. Thereby, the buckling device can be used in a thin electronic device to reduce its assembly and machining costs on a large scale. | 03-24-2011 |
20110069500 | Heat Dissipation Module For Bulb Type LED Lamp - The heat dissipation module includes a heat dissipation assembly and a heat conducting element. The heat dissipation assembly includes a cylinder provided with a central hole. The central hole tapers off inwards to form two corresponding inclined surfaces. The heat conducting element, which is accommodated in the central hole, has a heat-absorbing section and two heat-releasing sections extending from the heat-absorbing section and being in contact with the inclined surfaces. | 03-24-2011 |
20110088874 | HEAT PIPE WITH A FLEXIBLE STRUCTURE - A heat pipe includes a metal pipe, a flexible structure, a woven mesh, a working fluid, and a support element. The flexible structure is formed on the metal pipe, and the woven mesh is disposed inside the metal pipe, and the working fluid is filled into the metal pipe and attached onto the woven mesh, and the support element is passed into the woven mesh, such that the heat pipe can be bent into a desired shape manually by an easy way according to actual using requirements. | 04-21-2011 |
20110094723 | COMBINATION OF FASTENER AND THERMAL-CONDUCTING MEMBER - A combination of a fastener and a thermal-conducting member is mounted on an electronic heat-generating member. The fastener includes a plate provided with an opening for allowing the electronic heat-generating element to be disposed therein; posts connected to the plate and formed around the opening; and clamping arms extending from the plate opposite to the posts. The thermal-conducting member is disposed on the plate to span the opening. The clamping arms are bent to press in the thermal-conducting member, thereby forming on the surface of the thermal-conducting member with a plurality of positioning notches for allowing the clamping arms to be inserted therein. With this arrangement, the fastener can be combined with the thermal-conducting member tightly. Thus, the heat generated by the electronic heat-generating element can be continuously conducted to the outside, so that the temperature of the electronic heat-generating element can be kept in a normal range. | 04-28-2011 |
20110232877 | COMPACT VAPOR CHAMBER AND HEAT-DISSIPATING MODULE HAVING THE SAME - A compact vapor chamber configured to thermally conduct heat of an electronic heat-generating element includes a flat sealed casing; a wick structure arranged on inner walls of the flat sealed casing; a working fluid filled inside the flat sealed casing; and an evaporating section formed on a portion of the vapor chamber. An outer surface of the flat sealed casing on the evaporating section has a recess for covering the electronic heat-generating element. The recess is brought into thermal contact with the electronic heat-generating element. With this arrangement, when the compact vapor chamber is brought into thermal contact the electronic heat-generating element for heat dissipation, the distance of the electronic heat-generating element protruding from the compact vapor chamber is reduced, thereby facilitating the compact design of an electronic product. Further, the present invention provides a heat-dissipating module having such a compact vapor chamber. | 09-29-2011 |
20110297355 | HEAT-CONDUCTING MODULE AND HEAT-DISSIPATING DEVICE HAVING THE SAME - A heat-conducting module for heat conduction of an electronic heat-generating element includes a heat pipe and a vapor chamber. The vapor chamber has an evaporating section brought into thermal contact with the electronic heat-generating element and a heat-conducting section located away from the evaporating section and wrapping around the heat pipe. With this arrangement, the contact area and heat-conducting efficiency between the vapor chamber and the heat pipe can be increased greatly, thereby obtaining a heat-conducting module with an excellent heat-conducting efficiency. With a heat-dissipating fin assembly and a fan being connected to the heat pipe, a heat-dissipating device having the aforesaid heat-conducting module can be obtained, whereby the heat of the vapor chamber and the heat pipe can be rapidly dissipated to the outside. | 12-08-2011 |
20110310563 | CLAMP-TYPE HEAT SINK FOR MEMORY - A clamp-type heat sink for a memory includes two heat conducting modules, a pivot shaft, and an elastic element. The heat conducting module includes an isothermal vapor chamber plate and a heat dissipating body coupled to the isothermal vapor chamber plate. The heat dissipating body includes a base plate and heat dissipating fins extended from the base plate. The base plate includes a shaft hole for passing the pivot shaft, such that each heat dissipating body is installed serially, and the elastic element is sheathed onto the pivot shaft and includes two elastic arms extended from the elastic element and abutted against each heat dissipating body, such that each isothermal vapor chamber plate is clamped and attached onto an external side of the memory to improve the convenience and integrity of the assembling and removal process to achieve a quick assembling or removal effect and prevent the components from missing. | 12-22-2011 |
20110315351 | VAPOR CHAMBER HAVING COMPOSITE SUPPORTING STRUCTURE - A vapor chamber having a composite supporting structure includes a flat sealed casing; a wick structure, a working fluid and a composite supporting structure. The composite supporting structure has a waved supporting rack and at least one supporting pillar. The waved supporting rack is configured to support upper and lower inner walls of the flat sealed casing. The waved supporting rack has plural separated channels for allowing vapor of the working fluid to flow through. Both ends of the at least one supporting pillar are respectively connected to the flat sealed casing or the wick structure. With this arrangement, compressive strength and tensile strength of the vapor chamber can be increased simultaneously without obstructing the circulation of liquid/vapor phases of the working fluid and reducing the thermal-conducting efficiency thereof. | 12-29-2011 |
20110315356 | HEAT-DISSIPATING BODY HAVING RADIAL FIN ASSEMBLY AND HEAT-DISSIPATING DEVICE HAVING THE SAME - A heat-dissipating device includes a heat-dissipating body, a vapor chamber and a fan assembly. The heat-dissipating body includes a thermal-conductive element and a radial fin assembly. The thermal-conductive element includes a solid post and extending arms extending therefrom. The radial fin assembly includes radially-arranged heat-dissipating fins that form a central hole to enclose the sold post, engaging troughs inserted by the extending arms, and an airflow space. An air channel is formed between any two heat-dissipating fins. The vapor chamber is provided at one end of the solid post, while the fan assembly is arranged on the other end and received in the airflow space to correspond to the respective air channels. Thus, the mobility of air and the heat-dissipating efficiency can be increased, thereby conforming to the requirements for compact design. | 12-29-2011 |
20120037344 | FLAT HEAT PIPE HAVING SWIRL CORE - A flat heat pipe having a swirl core includes a flat sealed casing having smooth inner walls, a working fluid filled within the flat sealed casing, and a swirl core disposed along a central axis of the flat sealed casing to support upper and lower inner walls of the flat sealed casing. Two airflow channels are formed between the swirl core and left and right inner walls of the flat sealed casing for allowing vapors of the working fluid to flow through. The swirl core is made by winding a metallic woven mesh in at least two circles for allowing the working fluid to flow through. A center of the swirl core is formed with a reflow channel. By this arrangement, the swirl core is used as a wick structure for allowing the working fluid to flow through, thereby saving the cost and time for manufacturing the wick structure. | 02-16-2012 |
20120097371 | SERIALLY-CONNECTED HEAT-DISSIPATING FIN ASSEMBLY - A serially-connected heat-dissipating fin assembly includes a plurality of heat-dissipating fins and a thermal-conducting element. Each of the heat-dissipating fins is provided with a hollow connecting portion for allowing the thermal-conducting element to be disposed through. The inner edge of the connecting portion of the respective heat-dissipating fins is provided with a protruding wall. The protruding wall is provided with a plurality of abutting portions slightly protruding toward the connecting portions. The surface of the thermal-conducting element is brought into frictional contact with the abutting portions to thereby tightly fit into the connecting portions of the respective heat-dissipating fins. With the interference fit between the respective abutting portions and the surface of the thermal-conducting element, it is unnecessary to use solders. | 04-26-2012 |
20120186798 | COOLING MODULE FOR LED LAMP - A cooling module for an LED lamp includes a thermostatic plate, a hollow column, and a plurality of cooling fins. The thermostatic plate has an evaporating segment and a pair of condensing segments extending from the evaporating segment. The outer surface of the hollow column has a pair of grooves corresponding to each other. The condensing segments of the thermostatic plate are buried in the grooves. The cooling fins surround and thermally contact the outer rim of the hollow column and the condensing segments. | 07-26-2012 |
20120279687 | FLAT-TYPE HEAT PIPE AND WICK STRUCTURE THEREOF - The present invention provides a flat-type heat pipe and a wick structure thereof. The flat-type heat pipe has a flat tube. The wick structure is arranged inside the flat tube along an axial line of the flat tube. The wick structure comprises a first wick portion and two second wick portions connected on both sides of the first wick portion. The thickness of the first wick portion is larger than that of the second wick portion. The first wick portion abuts against an upper inner wall of the flat tube. An air channel is formed between each of the second wick portions and the upper inner wall of the flat tube. The wick structure supports the inner wall of the flat-type heat pipe without providing additional supporting structure, so that the heat pipe can be made more compact. | 11-08-2012 |
20120285662 | VAPOR CHAMBER WITH IMPROVED SEALED OPENING - The vapor chamber includes a casing, wick structure, working fluid and filling/degassing tube. The casing is composed of two plates and has a chamber therein. The wick structure and working fluid are disposed in the chamber. The filling/degassing tube is connected with the casing to form a passage communicating with the chamber. A portion of the plates which overlaps the filling/degassing tube is pressed to deform for making the passage closed. And the outer end of the filling/degassing tube is flush with the side of the casing. | 11-15-2012 |
20120325437 | FLAT HEAT PIPE WITH CAPILLLARY STRUCTURE - A flat heat pipe with a capillary structure includes a pipe body and a capillary tissue. The pipe body is substantially hollow and flat and includes a bottom wall and a top wall opposite to the bottom wall, and both walls are formed on the pipe body, and an appropriate quantity of working fluid is sealed inside the pipe body. The capillary tissue is covered onto an internal side of the bottom wall, and the capillary tissue includes a plurality of protrusions formed inside the pipe body and extended along the lengthwise direction of the pipe body, and a gap is reserved between the protrusions and the internal side of the top wall to form an air passage. The protrusions formed by the capillary tissue can provide sufficient capillary forces and also produce the gap to form the air passage. | 12-27-2012 |
20120325438 | HEAT PIPE WITH FLEXIBLE SUPPORT STRUCTURE - A heat pipe with a flexible support structure includes a pipe body and a support, and the support is installed in the pipe body and includes a first row of side plates and a second row of side plates extended along the lengthwise direction of the pipe body and a plurality of support elements coupled between the first and second rows of side plates, and each support element abuts the internal side of a capillary tissue of the pipe body. Plate elements of the first and second rows of side plates are arranged with an interval apart from each other and in sections along the lengthwise direction of the pipe body, and the plate elements of the first row of side plates and the plate elements of the second row of side plates are aligned alternately with each other. The support is flexible to facilitate users to bend the heat pipe. | 12-27-2012 |
20130168052 | HEAT PIPE AND COMPOSITION OF CAPILLARY WICK THEREOF - The present invention provides a heat pipe and a composition of a capillary wick thereof. The heat pipe includes a main body, a capillary wick and a working fluid. The main body has an inner wall surface. The capillary wick is combined on the inner wall surface. The capillary wick includes a first capillary powder of 30 weight percent and a second capillary powder of 70 weight percent. The size of particles of the first capillary powder is smaller than that of the second capillary powder. The working fluid is filled in the main body of the heat pipe. The first capillary powder and the second capillary powder are mixed to each other uniformly to be sintered on the inner wall surface of the heat pipe. By this arrangement, the heat pipe can achieve the maximum performance to remove the heat generated by an electronic element rapidly. | 07-04-2013 |
20130199757 | HEAT-DISSIPATING MODULE HAVING LOOP-TYPE VAPOR CHAMBER - A heat-dissipating module having a loop-type vapor chamber includes a heat-dissipating body, a loop-type vapor chamber, and a heat-conducting medium. The loop-type vapor chamber is completely covered by the heat-dissipating body. The loop-type vapor chamber includes a loop body, a wick structure and a supporting structure. The loop body includes a bottom plate and a cover plate. A vacuum chamber is formed between the bottom plate and the cover plate. The wick structure is arranged on inner surfaces of the cover plate and the bottom plate. The supporting structure abuts the wick structure toward the cover plate and the bottom plate. The loop-type vapor chamber is tightly connected to the heat-dissipating body via the heat-conducting medium. | 08-08-2013 |