Inventors list

Assignees list

Classification tree browser

Top 100 Inventors

Top 100 Assignees


Chiang, Taoyuan

Chih-Hung Chiang, Taoyuan TW

Patent application numberDescriptionPublished
20090097211CIRCUIT MODULE AND CIRCUIT BOARD ASSEMBLY HAVING SIP CONNECTOR - A circuit module to be mounted on a system board having multiple through holes is disclosed. The circuit module includes a circuit board, multiple SIP connectors and multiple sheathing elements. Each of the SIP connectors includes a connecting part disposed at a first end thereof and fixed on the circuit board and an insertion part disposed at a second end thereof. Each of the sheathing elements includes a plurality of clamping arms and a receiving portion. The receiving portion is defined by the clamping arms for receiving the insertion part of a corresponding SIP connector. The insertion part is clamped by the clamping arms such that the sheathing element is fixed on the SIP connector. The sheathing element is sustained against a surface of the system board after the insertion part is inserted into a corresponding through hole of the system board, so that the support area between the SIP connector and the system board is increased.04-16-2009

Ching-Liang Chiang, Taoyuan TW

Patent application numberDescriptionPublished
20100081419COMMUNICATION METHOD AND COMMUNICATION DEVICE THEREOF - A communication method and a communication device thereof are provided. The communication method includes the steps of: displaying a calling window when a telephone connection between a calling party of the communication device and a called party is established; displaying a contact list window showing at least one contact item corresponding to at least one contact; dragging and dropping one of the at least one contact item from the contact list window to the calling window; performing a communication function relating to the called party and the dragged and dropped contact item.04-01-2010

Ching-Yueh Chiang, Taoyuan TW

Patent application numberDescriptionPublished
20080252629Display apparatus and brightness correction method thereof - A display apparatus and a brightness correction method thereof are provided. The display apparatus includes a body and a light sensing device. The body includes a screen and a control module and the control module is coupled to the screen for controlling brightness of the screen. The light sensing device, coupled to the body through a cable, is used for sensing brightness so as to generate a detected brightness value accordingly, wherein the control module receives the detected brightness value through the cable.10-16-2008

Chi-Pang Chiang, Taoyuan TW

Patent application numberDescriptionPublished
20080288681Devices with multiple functions, and methods for switching functions thereof - Devices with multiple functions and methods for switching functions thereof are provided. The device comprises a plurality of hardware components, a plurality of functional modules, an input device, and a processing module. Each functional module corresponds to one of the functional connecting configurations for the hardware components. The processing module executes one of the functional modules and drives the hardware components according to the functional connecting configuration corresponding to the executed functional module. The processing module determines whether to generate a switch command according to an input command received by the input device. When the switch command is generated, the processing module directly terminates the functional module being currently executed and adjusts to execute another functional module, and drives the hardware components according to the functional connecting configuration corresponding to the functional module to be executed.11-20-2008

Chung-I Chiang, Taoyuan TW

Patent application numberDescriptionPublished
20110068356Method of manufacturing light emitting diode packaging lens and light emmiting diode package - A method of manufacturing light emitting diode packaging lens and packages made by using the method are disclosed in the present invention. By using electrophoretic deposition, one or more layers of phosphors are coated onto one surface of a cup which has a curved portion. The cup is used for the packaging lens. Thickness of phosphor layer can be controlled and distribution of phosphor particles is uniform. Therefore, light emitting diode packages with the lens can be a uniform light source.03-24-2011
20110080108Color tunable light emitting diode - A color tunable light emitting diode is disclosed in the present invention. At least two light emitting chip groups each has a number of light emitting chips mixed with at least one phosphor to produce light with a specific correlated color temperature. By supplying tunable currents to the light emitting chip groups, properly arranging the light emitting chips and providing a suitable substrate, the color tunable light emitting diode can be achieved. The present invention provides a simple and workable method to manufacture tunable light emitting diodes which fulfill the requirement of compact design of modern electronic products.04-07-2011
20110163679AC LIGHT EMITTING DIODE DEVICE HAVING INTEGRATED PASSIVE DEVICE - A light emitting diode device is disclosed in the present invention. The device includes a substrate, an integrated passive device, at least four rectifying diodes and several light emitting diodes. The rectifying diodes form a bridge rectifier to rectify an external alternating current (AC) inputted into a direct current so that the light emitting diodes can lighten. Furthermore, the light emitting diode device has a Zener diode, formed on the substrate and connected with the integrated passive device for regulating the direct current. It can also have a varistor, connected with the Zener diode in parallel, for protecting the light emitting diode device from surges.07-07-2011
20110164223MICROMINIATURIZED PROJECTION MODULE FOR PROJECTING IMAGE ONTO OBJECT - A microminiaturized projection module for projecting an image onto an object is disclosed in the present invention. The module includes a number of light units each for providing red, green, and blue beams; an image processing unit for receiving the image, dividing the image into n×m image signals, and transforming each of the image signals into a modulating signal and a direction signal, where n and in are integrals not less than 2, respectively; a number of modulation units for modulating the beams from one light unit according to the modulating signal received from the image processing unit and sending out the modulated beams simultaneously; and an array of n×m mirrors for projecting the modulated beams to form the image onto the object according to the direction signal received from the image processing unit. The invention has advantages that can reduce modulation speed, undergo slight shock and be free from raster pinch effect.07-07-2011

Kuo-Chun Chiang, Taoyuan TW

Patent application numberDescriptionPublished
20080315398PACKAGING SUBSTRATE WITH EMBEDDED CHIP AND BURIED HEATSINK - An embedded chip package includes a substrate having a dielectric interposer, a first metal foil on a first surface and a second metal foil on a second surface of the substrate, wherein the substrate has a cavity recessed into the first surface; a metal heatsink embedded within the cavity; a semiconductor die mounted on a flat bottom of the metal heatsink; a dielectric layer covering the first surface of the substrate; at least one built-up circuit trace layer on the dielectric layer; a solder resist layer on the built-up circuit trace layer and on the dielectric layer; a heat-dissipating metal layer on the second metal foil; and heat-dissipating plugs connecting the flat bottom of the metal heatsink and the heat-dissipating metal layer.12-25-2008

Ya-Hui Chiang, Taoyuan TW

Patent application numberDescriptionPublished
20100097795ILLUMINATION SYSTEM - An illumination system is provided, including a plurality of first illumination units, a plurality of second illumination units, a projecting adjusting module and a focus adjusting module. The projecting adjusting module is connected to the first illumination units to adjust the projection pattern. The focus adjusting module is connected to the first and second illumination units to adjust the focus position of the illumination units.04-22-2010
20100135013ILLUMINATION SYSTEM - An illumination system includes at least one illumination module and a mechanism. The illumination module includes a light source generating a light beam, a first reflector, in which the light source is positioned, including a first reflective surface to reflect the light beam to form a first beam, and a second reflector including a second reflective surface reflecting the light beam and the first beam to form a second beam and a third beam, wherein the second and third beams combine to generate a projection pattern. The mechanism adjusts the position of the second reflector relative to the light source to change the projection pattern.06-03-2010