| Patent application number | Description | Published |
|---|
| 20090065238 | PRINTED CIRCUIT BOARD - An exemplary PCB includes a first reference layer, a first signal layer, a second signal layer, and a third signal layer in that order, a first differential pair is arranged in the first signal layer in edge-coupled structure and references the first reference layer, a distance between the first signal layer and the second signal layer is greater than a distance between the first reference layer and the first signal layer, a second differential pair is arranged in the second signal layer and the third signal layer in broad-coupled structure. The PCB has a high density layout of transmission lines. | 03-12-2009 |
| 20090260859 | FLEXIBLE PRINTED CIRCUIT BOARD - A flexible printed circuit board (FPCB) includes a signal layer comprising a differential pair, a ground layer comprising a grounded sheet made of conductive material, and a dielectric layer located between the signal layer and the ground layer. A void is located on the two opposite sides of the grounded sheet in the ground layer. The differential pair comprises two transmission lines and each transmission line is capable of transmitting a differential signal. The distances between the middle line of the grounded sheet and the middle line of each of the two transmission lines are equal. | 10-22-2009 |
| 20100258337 | FLEXIBLE PRINTED CIRCUIT BOARD - A flexible printed circuit board (FPCB) includes a signal layer, upper and lower ground layers, and two dielectric layers. The signal layer includes a differential pair comprising two transmission lines to transmit a pair of differential signals. The dielectric layers are located on and under the signal layer to sandwich the signal layer. The upper ground layer is attached to the dielectric layer on the signal layer, opposite to the signal layer. The lower ground layer is attached to the dielectric layer under the signal layer, opposite to the signal layer. Each ground layer includes a grounded sheet made of conductive material. Two voids are defined in each ground layer and located at opposite sides of the corresponding grounded sheet. Distances between the middle line of the grounded sheet of each ground layer and middle lines of the two transmission lines are equal. | 10-14-2010 |
| 20100276192 | METHOD FOR REMOVING A STUB OF A VIA HOLE AND A PRINTED CIRCUIT BOARD DESIGNED BASED ON THE METHOD - A method for removing a stub of a via hole includes copperizing a wall of a via hole in a top layer of a printed circuit board (PCB) if signal lines are located on the top layer of the PCB, and a wall of the via hole in a bottom layer of the PCB is not copperized. The method further includes connecting the top layer and the bottom layer of the PCB using a connection layer. | 11-04-2010 |
| 20100277882 | MOTHERBOARD AND MOTHERBOARD LAYOUT METHOD - A motherboard layout method includes positioning two electronic elements on a top layer of a motherboard, and positioning another two electronic elements on a bottom layer of the motherboard, connecting one end of a first electronic element on the top layer to the same end of a first electronic element on the bottom layer with a first via hole, and connecting the same end of a second electronic element on the top layer to the same end of a second electronic element on the bottom layer with a second via hole. The method further includes connecting the other ends of the two electronic elements on the top layer to a first part, and connecting the other ends of the two electronic elements on the bottom layer to a second part. | 11-04-2010 |
| 20110055796 | SYSTEM AND METHOD FOR REMOVING T-POINT ELEMENTS WITH UNUSED STUBS FROM A PCB LAYOUT DESIGN - A system and method for removing T-point elements with unused stubs from a printed circuit board (PCB) layout design obtains each signal line including one or more T-point elements in the PCB layout design, divides the obtained signal line into a plurality of lines according to the one or more T-point elements with unused stubs, and obtains properties of each of the plurality of lines. The system and method further deletes the original layout of the signal line and reconnects the plurality of lines according to the properties of each of the plurality of lines to generate a reconnected signal line, and outputs the reconnected signal line on a display device. | 03-03-2011 |
| 20110094782 | PRINTED CIRCUIT BOARD - A printed circuit board includes a signal plane and a reference plane. The signal plane includes a pad, a passive element mounted on the pad, and a signal transmission line electrically connected to the passive element via the pad. The reference plane provides a return path for a signal transmitted through the passive element and the signal transmission line. A void is defined in the reference plane corresponding to the passive element, to increase a length of the return path. A length of a first axis, perpendicular to the signal transmission line, of the void satisfies a following equation: | 04-28-2011 |
| 20110094783 | PRINTED CIRCUIT BOARD - A printed circuit board (PCB) includes a signal plane and a reference plane. The signal plane includes a pad, a passive element mounted on the pad, and a signal transmission line electrically connected to the passive element via the pad. The reference plane provides a return path for a signal transmitted through the passive element and the transmission line. A void is defined in the reference plane corresponding to the passive element, to increase a length of the return path. | 04-28-2011 |
