Chia-Hui
Chia Hui Lin, Tainan City TW
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20140240928 | THERMAL GREASE HAVING LOW THERMAL RESISTANCE - A thermally conductive grease includes a carrier oil, at least one dispersant, and thermally conductive particles. The thermally conductive particles have a D50 (Vol. Average) particle size of no greater than about 11 microns and the thermally conductive particles in the thermally conductive grease contain less than 3% by volume of particles having a particle size of 0.7 microns or less, based on the total volume of thermally conductive particles in the thermally conductive grease. | 08-28-2014 |
Chia Hui Peng, Taichung Hsien TW
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20090211408 | Spark plug socket wrench - A spark plug socket wrench includes a socket member having a non-circular chamber for receiving a nut member of a spark plug, and having an engaging hole for engaging with a driving tool, and having a compartment communicating with the chamber and the engaging hole of the socket member, a casing engaged into the compartment of the socket member and having a space for receiving an insulator of the spark plug, and a spring-biased projection attached to the casing and having a detent biased by a spring member for engaging with the spark plug and for retaining the spark plug to the socket member and for preventing the spark plug from being disengaged from the socket member inadvertently. | 08-27-2009 |
Chia Hui Shen, Gangshan Township TW
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20090177007 | PROCESS FOR PRODUCING CARBOXYLIC ACID ANHYDRIDES - The present invention relates to a process for producing carboxylic acid anhydrides, in which a carboxylic acid ester, derived from an alcohol and a carboxylic acid, and carbon monoxide containing a small amount of hydrogen are used as raw materials and subjected to a carbonylation reaction in a liquid reaction medium in the presence of a Group VIII B catalyst to produce a carboxylic acid anhydride. The reaction medium comprises the Group VIII B catalyst, an organic halide, the carboxylic acid ester, an alkali metal salt, at least one organic promoter, the carboxylic acid anhydride and the carboxylic acid, wherein the organic promoter is selected from at least one of the following structural forms (I), (II) and (III). According to the process of the present invention, the reaction rate of the carbonylation reaction is increased by the use of the specified organic promoters. | 07-09-2009 |
Chia Hui Shen, Hsinchu County TW
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20100261300 | METHOD FOR SEPARATING SUBSTRATE FROM SEMICONDUCTOR LAYER - A method for separating an epitaxial substrate from a semiconductor layer initially forms a patterned silicon dioxide layer between a substrate and a semiconductor layer, and then separates the substrate from the patterned silicon dioxide layer using two wet etching processes. | 10-14-2010 |
20110012155 | Semiconductor Optoelectronics Structure with Increased Light Extraction Efficiency and Fabrication Method Thereof - A semiconductor optoelectronic structure with increased light extraction efficiency and a fabrication method thereof are presented. The semiconductor optoelectronic structure includes continuous grooves formed under an active layer of the semiconductor optoelectronic structure to reflect light from the active layer and thereby direct more light through a light output surface so as to increase the light intensity from the semiconductor optoelectronic structure. | 01-20-2011 |
Chia Hui Shen, Kaohsiung County TW
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20100145098 | PROCESS FOR PRODUCING CARBOXYLIC ACID ANHYDRIDES - A process for producing carboxylic acid anhydrides by the carbonylation reaction of a carboxylic acid ester, derived from an alcohol and a carboxylic acid, with carbon monoxide containing a small amount of hydrogen in a liquid reaction medium in the presence of a Group VIII B catalyst to produce a carboxylic acid anhydride. The reaction medium comprises the Group VIII B catalyst, an organic halide, the carboxylic acid ester, an alkali metal salt, the carboxylic acid anhydride, the carboxylic acid, and at least one ionic liquid consisting of a cation and an anion where the cation of the ionic liquid has a nitrogen-containing heterocyclic structure. The ionic liquid has at least one of the following structural forms: | 06-10-2010 |
20110004020 | PROCESS FOR PRODUCING ORGANIC CARBOXYLIC ACID AMIDES - The present invention relates to a process for producing organic carboxylic acid amides by nitrile hydrolysis of a nitrile compound at certain temperature and pressure in the presence of a catalyst to produce an organic carboxylic acid amide. | 01-06-2011 |
Chia Hui Yu, Tainan TW
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20120002138 | Pattern forming ink composition, light guide plate, light emitting unit and liquid crystal display element having the light emitting unit - The present invention relates to a pattern forming ink composition, and more particularly, to a pattern forming ink composition having high yellowing resistance, wherein the pattern forming ink composition including an acrylate-based resin having a ring structure (A), a compound having at least one ethylenically unsaturated double bond (B) and a photoinitiator (C). The pattern forming ink is printed as a reflection pattern on a light guide plate to scatter and reflect the light incident to the reflection pattern towards a light emitting surface of the light guide plate. | 01-05-2012 |
Chia-Hui Chang, New Taipei City TW
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20160005046 | APPARATUS AND METHOD FOR DISPLAYING AMOUNT OF MONEY - An apparatus and a method for displaying amount of money are disclosed. The apparatus for displaying amount of money comprises a signal detection module, a position module, a storage device, a micro controller and a monitor. The signal detection module detects a radio frequency identification (RFID) signal outputted from a toll gantry. The position module provides a position information. The storage device stores a gantry information. After the RFID signal was detected, the micro controller calculates an original debit amount according to the position information and the gantry information, and generates a money information according to the original debit amount. The monitor shows the money information. | 01-07-2016 |
Chia-Hui Chen, Taipei City TW
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20140285447 | TOUCH APPARATUS AND OPERATING METHOD THEREOF - An operating method for dynamically adjusting a touch apparatus is disclosed herein. The touch apparatus includes a storage component and a touch component. The storage component is configured to store at least one application, and a plurality of weights of touch motion modes and touch motion modes corresponding to the application. The operating method includes determining whether execution of the application has started. When execution of the application has started, a plurality of touch motions corresponding to the executed application are received through the touch component. At least one of the weights of touch motion modes corresponding to the executed application is adjusted according to the touch motions. At least one of touch parameters is adjusted according to the weights of touch motion modes corresponding to the executed application. | 09-25-2014 |
Chia-Hui Chen, Taoyuan TW
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20120175478 | SLIDE COVER MOUNTING STRUCTURE - Used in an electronic device comprising a cover panel and a base member, a slide cover mounting structure includes two hinges bilaterally mounted on the top wall of the base member, two sliding rail holders respectively connected to the pivot shafts of the hinges, two sliding rails bilaterally mounted on the bottom surface of the cover panel and respectively slidably coupled to a sliding groove on each of the sliding rail holder, two gears pivotally connected between fixed rails on the sliding rail holders, and two gear racks respectively mounted on the cover panel and meshed with the gears. Thus, the cover panel is prohibited from biasing during sliding movement, and turnable about the pivot shafts of the hinges from a horizontal position to a tilted position relative to the base member. | 07-12-2012 |
20120314980 | DOUBLE SLIDING STABILITY SPACE-SAVING SLIDE COVER LIFTING STRUCTURE - A double sliding stability space-saving slide cover lifting structure used in an electronic device consisting of a base member and a cover panel is disclosed to include a pair hinges, a pair of sliding rail holders, a pair of bearing members, a pair of plastic slide guides, a pair of sliding rails, a pair of gears and a pair of gear racks is disclosed. The sliding rails are respectively slidably coupled to channel bars of the plastic slide guides in the bearing members, enhancing sliding stability. Further, the bearing members are prepared by a high load strength material and fixedly mounted on the sliding rail holders to support the plastic slide guides and the sliding rails, saving the space and enhancing the cover panel connection stability and preventing gear slippage and uneven bias of the cover panel. | 12-13-2012 |
20120328222 | SLIDE COVER LIFTING STRUCTURE - A slide cover lifting structure used in an electronic device consisting of a base member and a cover panel is disclosed to include a pair hinges, a pair of sliding rail holders, a pair of bearing members, a pair of plastic slide guides, a pair of sliding rails, a transmission shaft, two gear sets and a pair of gear racks. The gear sets are provided between the sliding rail holders and the bearing members for transmission of applied force. The transmission shaft is mounted in the base member (system end), allowing free utilization of the internal circuit board space of the base member. | 12-27-2012 |
20150159413 | TRANSMISSION MECHANISM FOR DUAL-SHAFT HINGE - A transmission mechanism includes a first shaft connected to a first mounting plate; a second shaft connected to a second mounting plate; a first positioning plate through which the first shaft and the second shaft extend rotatably; a second positioning plate, through which the first shaft and the second shaft extend rotatably, spaced from the first positioning plate by a distance; a first gear mounted on the first shaft, disposed between the first positioning plate and the second positioning plate and having a first helical tooth portion; a second gear mounted on the second shaft, disposed between the first positioning plate and the second positioning plate and having a second helical tooth portion having the same tooth profile and helix angle with the first helical tooth portion ; and a middle gear disposed between the first gear and the second gear and having a transmitting helical tooth portion engaging the first helical tooth portion and the second helical tooth portion, wherein the middle gear rotates about an axis skewed with the first shaft and the second shaft. | 06-11-2015 |
Chia-Hui Chen, Hsin-Chu TW
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20090172024 | SYSTEMS AND METHODS FOR COLLECTING AND ANALYZING BUSINESS INTELLIGENCE DATA - A system includes a memory to store program code and a processor to execute the program code to perform a process for generating a business intelligence (BI) data presentation. The process includes collecting BI data from one or more data sources and verifying the collected BI data. The process further includes defining an output presentation format in a multidimensional BI database, loading the collected BI data into the multidimensional BI database, refreshing data tables in the multidimensional BI database based on the loaded set of BI data, and generating an output BI data presentation based on the loaded BI data and the output presentation format. | 07-02-2009 |
20150062761 | Electrostatic Discharge Protection for Level-Shifter Circuit - A circuit, a multiple power domain circuit, and a method are disclosed. An embodiment is a circuit including an input circuit having a first output and a second output, the input circuit being coupled to a first power supply voltage, and a level-shifting circuit having a first input coupled to the first output of the input circuit and a second input coupled to the second output of the input circuit, the level-shifting circuit being coupled to a second power supply voltage. The circuit further includes a first transistor coupled between a first node of the level-shifting circuit and the second power supply voltage, and a control circuit having an output coupled to a gate of the first transistor, the control circuit being coupled to the second power supply voltage. | 03-05-2015 |
Chia-Hui Chen, Taichung City TW
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20130069143 | TRENCH TYPE POWER TRANSISTOR DEVICE AND METHOD OF FABRICATING THE SAME - The present invention provides a trench type power transistor device including a semiconductor substrate, at least one transistor cell, a gate metal layer, a source metal layer, and a second gate conductive layer. The semiconductor substrate has at least one trench. The transistor cell includes a first gate conductive layer disposed in the trench. The gate metal layer and the source metal layer are disposed on the semiconductor substrate. The second gate conductive layer is disposed between the first gate conductive layer and the source metal layer. The second gate conductive layer electrically connects the first gate conductive layer to the gate metal layer, and the second gate conductive layer is electrically insulated from the source metal layer and the semiconductor substrate. | 03-21-2013 |
Chia-Hui Chen, Taichung TW
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20150131039 | Dual-Frequency Bistable Liquid Crystal Display And The Liquid Crystal Mixture Thereof - A dual-frequency bistable liquid crystal display and the liquid crystal mixture thereof includes liquid crystal cell filled with a liquid crystal mixture which contains dual-frequency liquid crystal, chiral compound, and nematic liquid crystal mixture. The liquid crystal mixture has the characteristics of both the dual-frequency liquid crystal and cholesteric liquid crystal. The dual-frequency bistable liquid crystal display is driven in a frequency modulation mode and can be switched between two optical states by taking advantage of the dielectric anisotropy of the liquid crystal, which results in a short switching time and sharp contrast between two optical states. Furthermore, the maintaining of the two optical states requires no voltage, which does not require the use of a high voltage to destabilize the helical structure of the cholesteric liquid crystal, and does not have to go through a metastable stage. Hence, power consumption and switching time are reduced. | 05-14-2015 |
Chia-Hui Chen, Kwei Shan Hsiang TW
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20100223756 | TWO-STAGE TYPE TORSION PIVOT HINGE - A two-stage type torsion pivot hinge mainly comprising: an axle which is connected with a base and has a shaft; the shaft is mounted thereon with a bush for a spring tube, the bush forms a first and a second protrusion sheet respectively extending out of its two ends; the spring tube is fixedly connected with a supporting member and is provided with two torsion sleeves respectively on the two ends of the bush; each torsion sleeve has an axial cut and has two contact sheets extending respectively toward the two ends of the bush; the contact sheets respectively interfere with the first and the second protrusion sheets. By the function between the torsion sleeve and the bush, the pivot hinge can provide different torsion forces for the stroke of rotating the screen from its closed position to a vertical angular position and for the stroke from the vertical position to its maximum opening angular position. | 09-09-2010 |
20110173775 | PIVOT HINGE WITH MUTUALLY REVERSELY ALLOCATED SPRING TUBES - A pivot hinge includes: a fixing seat having therein a round hole from which two grooves forming an inversed “V” shape are extended downwards, the grooves include two bevel groove segments extending laterally and obliquely form the central bottom of the round hole to two different directions at the opening of the round hole, and include two vertical groove segments formed on the ends of the bevel groove segments respectively; a shaft of a rotation axle extends into the round hole; and includes: at least two mutually reversely allocated “9” shaped spring tubes each having a slipping over portion over the shaft surface, the portion is formed on its periphery a slit, a lower area of each slipping over portion has a positioning sheet extending downwards obliquely but not radially, each positioning sheet has a bottom vertical portion; the positioning sheets and the vertical portions are slipped respectively in the bevel and the vertical groove segments, an area at an upper area of each positioning sheet contacting with an upper area of a corresponding bevel groove segment forms a surface contacting fulcrum. | 07-21-2011 |
20120217855 | LIFTABLE SLIDE COVER MOUNTING STRUCTURE USING A SHEET METAL BRACKET MECHANISM - A liftable slide cover mounting structure consisting of two hinges, two metal sheet bracket mechanism, two sliding rails, two gears, two gear racks and two supplementary support mechanisms. Subject to the use of the sheet plate bracket mechanisms to hold the sliding rails instead of zinc alloy sliding rail holders, the weight of the liftable slide cover mounting structure is minimized. Further, when the cover panel is opened from the base member, the sheet plate bracket mechanisms are forced into engagement with the supplementary support mechanisms to support the cover panel in position for enabling the user to operate the display screen of the cover panel positively. | 08-30-2012 |
Chia-Hui Chen, Hsinchu City TW
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20090058517 | High Voltage Tolerant Input Buffer - An input buffer protection circuit is disclosed which comprises a NMOS transistor with a source, drain and gate coupled to an input terminal of the input buffer, a pad and a chip peripheral positive power supply voltage (VDDP), respectively, and a PMOS transistor with a source, drain and gate coupled to the pad, the input terminal of the input buffer and a first terminal of a biasing circuit, respectively, wherein the biasing circuit has a second terminal coupled to the pad and generates at the first terminal a voltage lower than the pad's input signal voltage (VPAD) to turn on the PMOS transistor when the VPAD is lower than or equal to the VDDP, or a voltage substantial equals to the VPAD to turn off the PMOS transistor when the VPAD is higher than the VDDP. | 03-05-2009 |
20110102070 | VOLTAGE PUMPING CIRCUIT - In a first pair of stacked PMOS devices comprising a first PMOS device and a second PMOS device, the first pumping circuit is coupled between a gate of the first PMOS device and a P pre-driver signal. In a second pair of stacked NMOS devices comprising a first NMOS device and a second NMOS device, the second pumping circuit is coupled between a gate of the first NMOS device and an N pre-driver signal. The pumping circuits recognizing the transition from the pre-driver signals provide a voltage to the gate of the first PMOS device and of the first NMOS device so that the first PMOS and NMOS devices are turned on better. As a result, their voltage Vds peaks are suppressed to a safe level; the devices avoid hot-carrier degradations; and their lifetimes are prolonged. | 05-05-2011 |
20130063843 | ESD PROTECTION FOR 2.5D/3D INTEGRATED CIRCUIT SYSTEMS - An integrated circuit structure includes first and second integrated circuit devices disposed on a interposer. Each integrated circuit device has electrostatic discharge (ESD) protection circuitry therein connected to an internal ESD bus. The first and second integrated circuit devices communicate with one another through the interposer. The interposer includes an ESD bus electrically connected to the ESD busses of the first and second integrated circuit devices for providing cross-device ESD protection for the integrated circuit devices. | 03-14-2013 |
20150077886 | Electrostatic Discharge Protection Circuit and Related Method - A device includes a first power transistor, a second power transistor electrically connected in series with the first power transistor, a first electrostatic discharge (ESD) detection circuit, and a first control circuit electrically connected to the first ESD detection circuit and the first power transistor. | 03-19-2015 |
20150097597 | COMMON WELL BIAS DESIGN FOR A DRIVING CIRCUIT AND METHOD OF USING SAME - A driving circuit includes a common well. The driving circuit further includes a first output buffer having a bulk connected to the common well, the first output buffer having a first terminal configured to receive a first signal, and having a second terminal connected to the common well. The driving circuit further includes a second output buffer having a bulk connected to the common well, the second output buffer having a first terminal configured to receive the first signal, wherein a second terminal of the second output buffer is disconnected from the common well. | 04-09-2015 |
20150214211 | THREE-DIMENSIONAL INTEGRATED CIRCUIT HAVING ESD PROTECTION CIRCUIT - An integrated circuit includes two or more substrates stacked one over another and a first set of electrical components on one or more of the two or more substrates. The two or more substrates include a first substrate having a first predetermined doping type and a second substrate having the first predetermined doping type. The first set of electrical components is configured to form a first circuit. The integrated circuit further includes a first ground reference rail electrically connected to the first circuit, a first common ground reference rail, and a first ESD conduction element electrically connected between the first ground reference rail and the first common ground reference rail. The first ESD conduction element includes a first diode on the first substrate and a second diode on the second substrate. The first diode and the second diode are electrically connected in parallel and have opposite polarities. | 07-30-2015 |
20150221636 | SEMICONDUCTOR ARRANGEMENT WITH ELECTROSTATIC DISCHARGE (ESD) PROTECTION - One or more semiconductor arrangements having a stacked configuration and electrostatic discharge (ESD) protection are provided. The semiconductor arrangements include a first substrate, a second substrate, an ESD pad, an ESD device and a first interlayer via connecting the first substrate and the second substrate. The first substrate includes a first PMOS device and a first device and the second substrate includes a first NMOS device and a second device. Alternatively, the first substrate includes a first PMOS device and a first NMOS device and the second substrate includes a first device and a second device. | 08-06-2015 |
20160093606 | ESD PROTECTION FOR 2.5D/3D INTEGRATED CIRCUIT SYSTEMS - An integrated circuit structure includes first and second integrated circuit devices disposed on a interposer. Each integrated circuit device has electrostatic discharge (ESD) protection circuitry therein connected to an internal ESD bus. The first and second integrated circuit devices communicate with one another through the interposer. The interposer includes an ESD bus electrically connected to the ESD busses of the first and second integrated circuit devices for providing cross-device ESD protection for the integrated circuit devices. | 03-31-2016 |
Chia-Hui Cheng, Rende Township TW
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20110312023 | Integrated Technology of Algae Bio-Diesel and Algae Ferment Reuse - An integrated technology of algae bio-diesel and algae ferment reuse includes providing algae, placing the algae into an optical reactor to grow the algae into rich algae, abstracting the rich algae to form abstracted algae and fat, placing the abstracted algae into a ferment tank so that the abstracted algae are decomposed and fermented to form a fermented substance and a fermented liquid, and making the fermented substance and the fermented liquid into a by-product. Thus, the algae produce carbon dioxide during the fermenting process, so that the carbon dioxide produced by the abstracted algae in the ferment tank is supplied to the algae in the optical reactor to form a breathing cycle between the optical reactor and the ferment tank so as to promote the growth of the algae simultaneously. | 12-22-2011 |
20120009655 | Method for Breaking the Cell Walls of Microalgae - A method for breaking the cell walls of microalgae includes cultivating microbes in a cultivating liquid, adding microalgae into the cultivating liquid to mix with the microbes, releasing a hydrolysis ferment from the microbes, hydrolyzing cell walls of the microalgae by the hydrolysis ferment of the microbes to decompose the cell walls of the microalgae into saccharide, and removing the microalgae from the cultivating liquid. Thus, the microbes release the hydrolysis ferment after the microalgae touch the microbes so as to hydrolyze and decompose the cell walls of the microalgae in a moderate manner without breaking the contents of the microalgae so that the contents of the microalgae can be released, absorbed and used completely. | 01-12-2012 |
Chia-Hui Cheng, Kaohsiung City TW
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20160071963 | HIGH VOLTAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME - A high voltage (HV) device and method for manufacturing the same are provided, at least comprising a substrate, an insulation formed on the substrate, a deep well formed in the insulation, an air layer formed in the insulation and disposed adjacent to the bottom surface of the deep well. A bottom surface of the deep well is spaced apart from the substrate. Also, the air layer, interposed between the deep well and the substrate, is spaced apart from the substrate. In one embodiment, an air layer further communicates with an atmosphere outside the HV device, which facilitates heat dissipation. | 03-10-2016 |
Chia-Hui Feng, Taipei Hsien TW
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20130145286 | ELECTRONIC DEVICE, SOCIAL TILE DISPLAYING METHOD, AND TILE CONNECTION METHOD - Social tile displaying method is provided. A first dynamic tile group is displayed on a display screen. In response to a pin instruction for designating a first contact person, a social tile corresponding to the first contact person is generated along with the first dynamic tile group on the display screen. Automatic notification message corresponding to the first contact person is shown on each of the tiles within the first dynamic tile group. Tile connection method is also provided. First and second tiles are displayed. In response to a connection command, the first and second tiles are connected according to the connection command. Preset processes are performed on the first and second tiles according to characteristics of the first and second tiles. | 06-06-2013 |
Chia-Hui Feng, New Taipei City TW
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20130061172 | ELECTRONIC DEVICE AND METHOD FOR OPERATING APPLICATION PROGRAMS - An electronic device and a method for operating application programs are provided. In the method, an application program listing frame is displayed on a touch screen of the electronic device, wherein the application program listing frame comprises a first icon corresponding to a first application program. When a first touch operation applied to the first icon is detected by the touch screen, the first application program is launched. However, when a second touch operation applied to the first icon is detected by the touch screen, a first simple frame related to the first application program is popped out from the application program listing frame while the first application program is not running. A size of the first simple frame is smaller than the application program listing frame, and the first touch operation is different from the second touch operation. | 03-07-2013 |
20130239059 | TOUCH SCREEN FOLDER CONTROL - Techniques are provided for manipulating folder and file icons on a screen of an electronic device. A folder icon representing a folder is displayed on a screen, in a first mode, at a first location on the screen. The folder may contain a plurality of individual files and the folder icon is configured to indicate the plurality of individual files. An activation event is detected comprising a movement from the first location on the screen to a second location on the screen. In response to detecting the activation event, the folder icon is displayed on the screen along with icons representing the individual files on the screen. The screen may display the icons of the individual files as fanning out from the folder icon and/or may display the icons of the individual files entirely outside of the folder icon. | 09-12-2013 |
20140191985 | METHOD AND DEVICE FOR CONTROLLING ELECTRONIC DEVICE - A method and a device for controlling an electronic device having a touch screen are provided. The present method includes displaying a plurality of first type sub-images on the touch screen at an original angle when the electronic device is in a first state, where the first type sub-images constitute a first operation screen of the first state. The present method also includes detecting a sliding operation performed on the touch screen and flipping at least one of the first type sub-images according to the sliding operation. The present method further includes when the sliding operation corresponds to a specific gesture, flipping all the first type sub-images to a maximum angle to display a second operation screen of a second state of the electronic device and switching the electronic device from the first state to the second state. | 07-10-2014 |
Chia-Hui Huang US
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20120155854 | CAMERA MODULE AND METHOD FOR FABRICATING THE SAME - The invention provides a camera module and a method for fabricating the same. A camera module includes an image sensor device chip having a plurality of solder balls on a bottom surface thereof. An optical lens is disposed on the image sensor device chip. A metal plate has a part that extending over the bottom surface of the image sensor device. A metal coating layer surrounds vertical surfaces of the optical lens and a top surface of the part of the metal plate. A first light shielding layer covers vertical surfaces of the metal coating layer. | 06-21-2012 |
Chia-Hui Huang, Hsinchu City TW
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20110298073 | IMAGE SENSOR DEVICES AND METHODS FOR MANUFACTURING THE SAME - Disclosed is a method for forming an image sensor device. First, a lens is provided, and a first sacrificial element is then formed on the lens. Subsequently, an electromagnetic interference layer is formed on the lens and the first sacrificial element, and the first sacrificial element and the electromagnetic interference layer thereon are removed to form an electromagnetic interference pattern having an opening exposing a selected portion of the lens. A second sacrificial element is formed in the opening to cover a center region of the selected portion of the lens, while a peripheral region of the selected portion of the lens remains exposed. Next, a light-shielding layer is formed on the electromagnetic interference pattern, the second sacrificial element, and the peripheral region of the selected portion of the lens. Thereafter, the second sacrificial element and the light-shielding pattern thereon are removed to expose the center region of the selected portion of the lens as a light transmitting region. | 12-08-2011 |
20140001590 | IMAGE SENSOR DEVICES AND METHODS FOR MANUFACTURING THE SAME | 01-02-2014 |
Chia-Hui Lai, Chiayi County TW
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20130328653 | CHOKE - A choke includes a single-piece core made of a same material, the single-piece core having a first board, a second board, and a pillar located between the first and second boards, a winding space located among the first board, the second board and the pillar, wherein the pillar has a non-circular and non-rectangular cross section having a first axis and a second axis substantially perpendicularly intersecting with each other at a center of the cross section of the pillar, and wherein a circumference of the cross section of the pillar includes two arc edges, four first substantially straight edges substantially parallel to the first axis, and two second substantially straight edges substantially parallel to the second axis, each of the first substantially straight edges being a joint of and in direct contact with one of the arc edges and one of the second substantially straight edges. | 12-12-2013 |
20150310975 | Choke - A choke includes a single-piece core made of a same material, the single-piece core having a first board, a second board, and a pillar located between the first and second boards, a winding space located among the first board, the second board and the pillar, wherein the pillar has a non-circular and non-rectangular cross section having a first axis and a second axis substantially perpendicularly intersecting with each other at a center of the cross section of the pillar, and wherein a circumference of the cross section of the pillar includes two arc edges, four first substantially straight edges substantially parallel to the first axis, and two second substantially straight edges substantially parallel to the second axis, each of the first substantially straight edges being a joint of and in direct contact with one of the arc edges and one of the second substantially straight edges. | 10-29-2015 |
Chia-Hui Lee, Tu-Chen City TW
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20110110020 | Water-Based Electrolyte for Electric Double Layer Capacitor and Electric Double Layer Capacitor having the Same - Disclosed herein is a water-based electrolyte for an electric double layer capacitor. The water-based electrolyte includes a solution having a first salt and a second salt. The cation of the first salt may be Li | 05-12-2011 |
Chia-Hui Lee, New Taipei City TW
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20130122379 | LITHIUM-ION BATTERY AND METHOD FOR FABRICATING THE SAME - A lithium-ion battery and a method for fabricating the same are provided. The lithium-ion battery includes an anode, a cathode, a separator, and an electrolyte solution. The cathode is disposed opposite to the anode. The separator is disposed between the anode and the cathode, where an accommodating region is defined by the anode, the cathode and the separator. The electrolyte solution disposed within the accommodating region includes an organic solvent, a lithium salt and an additive. The additive includes a sulfonyl-containing species, and the content thereof is 0.1 to 5 wt % based on the total weight of the electrolyte solution. The whole-cell potential of the lithium-ion battery is 4.5 V or above. In the lithium-ion battery and the method for fabricating the same of the invention, the sulfonyl-containing species serves as the additive, so that the battery is capable of being operated under a condition of high-voltage charge and discharge. | 05-16-2013 |
Chia-Hui Lin, Dajia Township TW
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20150048475 | Semiconductor Structures With Shallow Trench Isolations - A method is disclosed that includes the operations outlined below. An insulating material is disposed within a plurality of trenches on a semiconductor substrate and over the semiconductor substrate. The first layer is formed over the insulating material. The first layer and the insulating material are removed. | 02-19-2015 |
Chia-Hui Lin, Shaoxing City CN
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20160051986 | MICROFLUIDIC DEVICE AND METHOD FOR OPERATING THEREOF - The present invention provides a microfluidic device which comprises a drive module and a microfluidic platform. The drive module further comprises a rotary unit and a vibration unit for driving the microfluidic platform, and the microfluidic platform further comprises multiple microfluidic elements for performing tests. The present invention also provides a method for operating a microfluidic device. The method comprises steps using the rotary unit and steps using the vibration unit to distribute sample in a microfluidic structure. | 02-25-2016 |
20160121330 | CENTRIFUGE/MAGNET-BASED ANALYZERS AND METHOD OF OPERATING THEREOF - The present invention provides centrifuge/magnet-based analyzers and methods of operating thereof. The analyzer comprises three discs sandwiched together, in which each disc has difference functions. The top disc comprises magnetic units configured in patterns, whereas the bottom disc comprises tracks and magnetic units free to move in the tracks. The magnetic field co-generated by the top disc and the bottom disc attracts the magnetic beads in the intermediate disc to move and thus facilitates the reactions in the intermediate disc. | 05-05-2016 |
Chia-Hui Liu, Taichung City TW
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20160143140 | PRINTED CIRCUIT BOARD HAVING POWER/GROUND BALL PAD ARRAY - A printed circuit board includes a laminated core including at least an internal conductive layer, and a build-up layer on the laminated core. The build-up layer includes a top conductive layer. A plurality of microvias is disposed in the build-up layer to electrically connect the top conductive layer with the internal conductive layer. A power/ground ball pad array is disposed in the top conductive layer. The power/ground ball pad array includes power ball pads and ground ball pads arranged in an array with a fixed ball pad pitch P. The power/ground ball pad array includes a 4-ball pad unit area that is comprised of only one ground ball pad and three power ball pads, or comprised of only one power ball pad and three ground ball pads. The 4-ball pad unit area has a rectangular shape and a dimension of about 2P×2P. | 05-19-2016 |
Chia-Hui Shen, Hukou Shiang TW
Patent application number | Description | Published |
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20110101408 | LED DIE HAVING HEAT DISSIPATION LAYERS - An LED die includes a multi-layer semiconductor with a first surface, a second surface opposite to the first surface, an inclined plane connecting to the first surface and the second surface, a first electrode and a second electrode respectively positioned on the first surface and the second surface, a first heat dissipation layer made of electrically-insulating and thermally conductive material being coated on the first surface and the inclined plane with a first opening exposing the first electrode, and a second heat dissipation layer made of electrically and thermally conductive material being coated on the first heat dissipation layer and contacting and electrically connecting with the first electrode. | 05-05-2011 |
20110233564 | LIGHT EMITTING DIODE CHIP AND METHOD FOR MANUFACTURING THE SAME - An LED chip includes a transparent substrate and a number of lighting structure units each including a p-type semiconductor and an n-type semiconductor and a recess extending from the p-type semiconductor to the n-type semiconductor. The recess is filled with metal material which covers the surface of the lighting structure units. By filling the recess with metal material, the heat generated by the lighting structure units can rapidly transfer to the metal material. A method for manufacturing the light emitting diode chip is also provided. | 09-29-2011 |
20110266586 | LED PACKAGE AND MANUFACTURING METHOD THEREOF - An LED package includes a base, an LED chip, and an encapsulant. The LED chip is mounted on the base, and is enclosed by the encapsulant. The base includes a substrate and a blocking wall integrally formed with the substrate. The blocking wall divides a surface of the substrate into a first bonding area and a second bonding area. An electrically conductive layer and a solder are formed on the bonding area in sequence. The blocking wall can block the first and second solder to overflow outside the first and second bonding area at soldering respectively. A method for manufacturing the LED package is also provided. | 11-03-2011 |
20110272666 | LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME - A light-emitting diode comprises a light-emitting diode chip having a first semiconductor layer, a first electrode, an active layer formed on the first semiconductor layer, a second semiconductor layer formed on the active layer and a second electrode formed on the second semiconductor layer. The first semiconductor layer, the active layer, the second semiconductor layer and the second electrode sequentially compose a stacked multilayer. A blind hole penetrates the second electrode, the second semiconductor layer, the active layer and inside the first semiconductor layer. The first electrode is disposed on the first semiconductor layer inside the blind hole. A first supporting layer and a second supporting layer are respectively disposed on the first electrode and the second electrode, wherein the first supporting layer and the second supporting layer are separated from each other. A method for manufacturing the light-emitting diode is also provided in the disclosure. | 11-10-2011 |
20110278631 | LIGHT EMITTING DIODE CHIP - A light emitting diode (LED) chip includes a first electrode and a second electrode. Each of the first and second electrodes includes several trunks with at least one branch extending from at least one of the trunk, and at least one conductive pad serially connecting the trunks. A distance between a distal end of the branch of the first electrode and the conductive pad of the second electrode is less than that between any of other portions of the branch of the first electrode and the conductive pad of the second electrode, to thereby avoid crowded electric current formed at the first electrode and the conductive pad of the second electrode to save power accordingly. | 11-17-2011 |
20110291136 | LIGHT-EMITTING ELEMENT AND FABRICATION METHOD THEREOF - A light-emitting element includes a substrate, a light-emitting module and at least two electrodes. The light-emitting module is formed on the substrate. The at least two electrodes are formed on the light-emitting module. Exterior surfaces of the light-emitting module are separated into a first part and a second part. The first part is defined between the at least two electrodes and the light-emitting module. The second part includes exterior surfaces not contacting the at least two electrodes. The first part is smooth. At least a part of the second part is rough. | 12-01-2011 |
20120012872 | LED PACKAGE STRUCTURE - An LED package structure includes a transparent substrate having a supporting face and a light-emergent face opposite to the supporting face, a housing disposed on the supporting face, two electrodes disposed on the housing, an LED chip disposed on the supporting face and electrically connected to the two electrodes, a reflecting layer covering the LED chip to reflect light emitted by the LED chip toward the transparent substrate, and a phosphor layer formed on the light-emergent face of the substrate. The phosphor layer includes a plurality of layers each having a specific light wavelength conversion range to generate a light with a predetermined color. | 01-19-2012 |
20120021545 | METHOD OF MANUFACTURING VERTICAL LIGHT EMITTING DIODE - A method of manufacturing a vertical light emitting diode includes: providing a first substrate; forming a lapping stop layer on the first substrate, the lapping stop layer being harder than the first substrate; depositing an epitaxial layer on the lapping stop layer; bonding a second substrate on the epitaxial layer; and removing the first substrate from the lapping stop layer. | 01-26-2012 |
20120056233 | LED PACKAGE - An LED package includes a base, an LED chip and an encapsulation. The LED chip is mounted on the base. The encapsulation encapsulates the LED chip. A heat dissipating plate is sandwiched between the LED chip and the base. The heat dissipating plate includes a first surface and a second surface. The LED chip is mounted on the first surface of the heat dissipating plate and has an interface engaging with the first surface of the heat dissipating plate. The first surface of the heat dissipating plate has an area greater than that of the interface. The second surface of the heat dissipating plate is attached to the base. | 03-08-2012 |
20120077295 | METHOD FOR DICING LED WAFER INTO MULTIPLE LED CHIPS - A method for dicing an LED (light emitting diode) wafer into multiple LED chips includes steps: providing an LED wafer, the LED wafer comprising a substrate, a first semiconductor layer, a light-emitting layer, a second semiconductor layer, and a transparent, electrically conductive film; forming a first channel in the LED wafer extending downwardly through the transparent, electrically conductive film, the second semiconductor layer and the light-emitting layer to the first semiconductor layer, thereby exposing the first semiconductor layer; forming a second channel within the first channel, the second channel extending downwardly through the first semiconductor layer to the substrate, thereby exposing a top face of the substrate; forming a groove in the top face of the substrate within the second channel by means of laser cutting; and dicing the LED wafer along the groove. | 03-29-2012 |
20120080691 | LIGHT EMITTING DIODE AND MAKING METHOD THEREOF - An LED includes a substrate, a first P-type semiconductor layer formed on the substrate and a plurality of LED dies arranged on the first P-type semiconductor layer. The LED dies are electrically connected to each other in series. The present invention also relates to a method for making such an LED. | 04-05-2012 |
20120104407 | LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME - An LED includes a substrate, a first n-type GaN layer, a connecting layer, a second n-type GaN layer, a light emitting layer, and a p-type GaN layer. The first n-type GaN layer is formed on the substrate, the first n-type GaN layer has a first surface facing away from the substrate, and the first surface includes a first area and a second area. The connecting layer, the second n-type GaN layer, the light emitting layer, and the p-type GaN layer are formed on the first area in sequence. The connecting layer is etchable by alkaline solution; a bottom surface of the second n-type GaN layer facing towards the connecting layer has a roughened exposed portion; the GaN on the bottom surface of the second n-type GaN layer is N-face GaN. | 05-03-2012 |
Chia-Hui Shen, Hukou TW
Patent application number | Description | Published |
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20120223324 | LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME - An LED includes a substrate, a first n-type GaN layer, a connecting layer, a second n-type GaN layer, a light emitting layer, and a p-type GaN layer. The first n-type GaN layer, the connecting layer, and the second n-type GaN layer are formed on the substrate in sequence. The connecting layer is etchable by alkaline solution, and a bottom surface of the second n-type GaN layer facing towards the connecting layer has a roughed exposed portion. The GaN on the bottom surface of the second n-type GaN layer is N-face GaN. A top surface of the second n-type GaN layer facing away from the connecting layer includes a first area and a second area. The light emitting layer and the p-type GaN layer are formed on the first area of the top surface of the second n-type GaN layer in sequence. | 09-06-2012 |
20120235157 | LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME - An LED includes a substrate, a first n-type GaN layer, a connecting layer, a second n-type GaN layer, a light emitting layer, and a p-type GaN layer formed on the substrate in sequence, the connecting layer being etchable by alkaline solution, a bottom surface of the second n-type GaN layer facing towards the connecting layer having a roughened exposed portion, the GaN on the bottom surface of the second n-type GaN layer having an N-face polarity, a blind hole extending through the p-type GaN layer, the light emitting layer and the second n-type GaN layer to expose the connecting layer, and an annular rough portion formed on the bottom surface of the second n-type GaN layer and surrounding each blind hole. | 09-20-2012 |
20120273757 | LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME - A light emitting diode and a light emitting diode (LED) manufacturing method are disclosed. The LED comprises a substrate; a first n-type GaN layer; a second n-type GaN layer; an active layer; and a p-type GaN layer formed on the substrate in sequence; the second n-type GaN layers has a bottom surface interfacing with the first n-type GaN layer, a rim of the bottom surface has a roughened exposed portion, and Ga—N bonds on the bottom surface has an N-face polarity. | 11-01-2012 |
20120292633 | LIGHT EMITTING DIODE ARRAY AND METHOD FOR MANUFACTURING THE SAME - An LED array includes a substrate and a plurality of LEDs formed on the substrate. The LEDs are electrically connected with each other. Each of the LEDs includes a connecting layer, an n-type GaN layer, an active layer, and a p-type GaN layer formed on the substrate in sequence. The connecting layer is etchable by alkaline solution. A bottom surface of the n-type GaN layer which connects the connecting layer has a roughened exposed portion. The bottom surface of the n-type GaN layer has an N-face polarity. A method for manufacturing the LED array is also provided. | 11-22-2012 |
20120322183 | METHOD FOR FABRICATING LIGHT EMITTING DIODE - A method for fabricating a light emitting diode includes steps of: forming a light emitting structure of the light emitting diode on a substrate; arranging a photoresist layer on a first semiconductor layer of the light emitting structure; depositing a plurality of dielectric material structures on the first semiconductor layer through a plurality of voids of the photoresist layer; removing the photoresist layer to form a plurality of voids between the plurality of dielectric material structures; forming a plurality of metal material structures in the plurality of voids; and forming a reflective layer on the plurality of dielectric material structures and the plurality of metal material structures. | 12-20-2012 |
20120326200 | FLIP-CHIP LIGHT EMITTING DIODE AND METHOD FOR MAKING THE SAME - A flip-chip light emitting diode comprising: a substrate; a circuit layer formed on the substrate, the circuit layer comprising a first electrode and a second electrode separated and electrically insulated from the first electrode; an LED chip arranged on the circuit layer, the LED chip comprising a positive electrode and a negative electrode, the positive electrode and the negative electrode which are located at a bottom face of the LED chip being in electrical connection to the first electrode and the second electrode of the circuit layer by solder, respectively; and a blocking structure located between the positive electrode and the negative electrode, the blocking structure being made of elastic and electrically insulating, colloidal material. | 12-27-2012 |
20130032815 | LIGHT EMITTING DIODE ARRAY AND METHOD FOR MANUFACTURING THE SAME - An LED array includes a substrate, protrusions formed on a top surface of the substrate, and LEDs formed on the top surface of the substrate and located at a top of the protrusions. The LEDs are electrically connected with each other. Each LED includes a connecting layer, an n-type GaN layer, an active layer, and a p-type GaN layer formed on a top of the protrusions in sequence. A bottom surface of the n-type GaN layer connecting the connecting layer has a roughened exposed portion. The bottom surface of the n-type GaN layer has an N-face polarity. | 02-07-2013 |
20130032839 | LIGHT EMITTING DIODE AND MANUFACTURING METHOD THEREOF - A manufacturing method for an LED with roughened lateral surfaces comprises following steps: providing an LED wafer with an electrically conductive layer disposed thereon; providing a photoresist layer on the electrically conductive layer; roughening a lateral surface of the electrically conductive layer by wet etching; forming a depression in the LED wafer by dry etching and roughening a sidewall of the LED wafer defining the depression; and disposing two pads respectively in the depression and the conducting layer. The disclosure also provides an LED with roughened lateral surfaces. A roughness of the roughened lateral surfaces is measurable in micrometers. | 02-07-2013 |
20130146837 | LIGHT EMITTING DIODE WITH MULTIPLE TRANSPARENT CONDUCTIVE LAYERS AND METHOD FOR MANUFACTURING THE SAME - An LED includes a first semiconductor layer, a second semiconductor layer, an active layer, a first transparent conductive layer, and a second transparent conductive layer. The first transparent conductive layer is formed on the second semiconductor layer. The second transparent conductive layer is formed on the first transparent conductive layer. The thickness of the first transparent conductive layer is less than that of the second transparent conductive layer. The density of the first transparent conductive layer is larger than that of the second transparent conductive layer. The disclosure further includes a method for manufacturing the LED. | 06-13-2013 |
20130292692 | LIGHT EMITTING DIODE - An LED includes a substrate, a first n-type GaN layer, a connecting layer, a second n-type GaN layer, a light emitting layer, and a p-type GaN layer. The first n-type GaN layer, the connecting layer, and the second n-type GaN layer are formed on the substrate in sequence. The connecting layer is etchable by alkaline solution, and a bottom surface of the second n-type GaN layer facing towards the connecting layer has a roughed exposed portion. The GaN on the bottom surface of the second n-type GaN layer is N-face GaN. A top surface of the second n-type GaN layer facing away from the connecting layer includes a first area and a second area. The light emitting layer and the p-type GaN layer are formed on the first area of the top surface of the second n-type GaN layer in sequence. | 11-07-2013 |
20130292693 | LIGHT EMITTING DIODE - An LED includes a substrate, a first n-type GaN layer, a connecting layer, a second n-type GaN layer, a light emitting layer, and a p-type GaN layer formed on the substrate in sequence. The connecting layer is etchable by alkaline solution. A bottom surface of the second n-type GaN layer faces towards the connecting layer and has a roughened exposed portion. The GaN on the bottom surface of the second n-type GaN layer has an N-face polarity. A blind hole extends through the p-type GaN layer, the light emitting layer and the second n-type GaN layer to expose the connecting layer. An annular rough portion is formed on the bottom surface of the second n-type GaN layer and surrounds each blind hole. | 11-07-2013 |
20130320362 | HIGH VOLTAGE LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACUTING THE SAME - A high voltage LED package includes a substrate and LED chips formed on a top surface of the substrate. A periphery of each LED chip is roughened. The LED chips are electrically connected in series. | 12-05-2013 |
20140001494 | LIGHT EMITTING DIODE | 01-02-2014 |
20140001495 | LIGHT EMITTING DIODE LAMP | 01-02-2014 |
20140027806 | SEMICONDUCTOR OPTOELECTRONIC STRUCTURE WITH INCREASED LIGHT EXTRACTION EFFICIENCY - A semiconductor optoelectronic structure with increased light extraction efficiency, includes a substrate; a buffer layer is formed on the substrate and includes a pattern having plural grooves formed adjacent to the substrate; a semiconductor layer is formed on the buffer layer and includes an n-type conductive layer formed on the buffer layer, an active layer formed on the n-type conductive layer, and a p-type conductive layer formed on the active layer; a transparent electrically conductive layer is formed on the semiconductor layer; a p-type electrode is formed on the transparent electrically conductive layer; and an n-type electrode is formed on the n-type conductive layer. | 01-30-2014 |
20140124808 | LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME - A light emitting diode (LED) includes a base, an LED die grown on the base, a transparent electrically conductive layer formed on a side of the LED die, a protecting layer covering the transparent electrically conductive layer, and a phosphor layer formed on the protecting layer. Through holes extend through the phosphor layer and the protecting layer to make part of light emitted from the LED die directly traveling out from the through holes to illuminate. A method for manufacturing the LED is also provided. | 05-08-2014 |
20140312299 | LIGHT EMITTING DIODE CHIP - A light emitting diode (LED) includes a substrate, a semiconductor structure formed on the substrate, and two electrodes formed on the semiconductor structure. The semiconductor structure includes a bearing surface via which light generated by the semiconductor structure radiates out of the LED. A plurality of microstructures is formed on the bearing surface. A cross section of each microstructure is rectangular triangular having a vertical side surface. Each microstructure includes a top surface. The top surface is inclined relative to the bearing surface. | 10-23-2014 |
20140346540 | LIGHT EMITTING DIODE DIE - A light emitting diode (LED) die includes a first semiconductor layer, a second semiconductor layer, an active layer interposed between the first and second semiconductor layers, a transparent electrically conductive layer formed on the second semiconductor layer, and a passivation layer formed on the transparent electrically conductive layer. A first electrode is electrically connected with the first semiconductor layer, and a second electrode is is electrically connected with the second semiconductor layer. The transparent electrically conductive layer is made of tin doped indium oxide. The passivation layer is made of silicon nitride having a refractive index close to that of the transparent electrically conductive layer. | 11-27-2014 |
20140361245 | LED CHIP AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing an LED chip includes: providing a laminated structure with a nanoimprinted material coated thereon; providing an imprinted mold with a patterned structure for pressing and curing the nanoimprinted material, removing the imprinted mold, etching the nanoimprinted material and the laminated structure; and forming electrodes on the etched laminated structure. An LED chip is also provided. | 12-11-2014 |
20150048305 | LED DIE AND METHOD OF MANUFACTURING THE SAME - An LED die includes a substrate, a light emitting structure, electrodes, a first transparent protecting layer, a reflection layer, and a second transparent protecting layer. The light emitting structure includes a first semiconductor layer, an active layer, a second semiconductor layer successively formed on the substrate. A part of first semiconductor layer being exposed. A first electrode is formed the first semiconductor layer. A second electrode is formed on the second semiconductor layer. The first transparent protecting layer, the reflection layer, and the second transparent protecting layer successively formed on the first electrode. The present disclosure also provides a method of manufacturing the LED die. | 02-19-2015 |
Chia-Hui Tang, Taichung City TW
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20120294688 | SPINDLE CONTROL SYSTEM FOR A MILLING MACHINE - A spindle control system for a milling machine is provided. The milling machine includes a column, an overarm, a spindle for mounting a cutter, a first motor mounted on the column for driving movement of the overarm, and a second motor mounted on the overarm for driving rotation of the spindle. The spindle control system includes a distance sensor and a temperature sensor, each to be mounted on the overarm and to be disposed proximate to the end portion of the spindle. The spindle control system further includes a central control unit for determining a compensation parameter based on the displacement sensed by the distance sensor and the temperature sensed by the temperature sensor, and for controlling movement of the overarm by the first motor through a compensation distance based on the compensation parameter to compensate for at least one of the cutter deformation and the spindle deformation. | 11-22-2012 |
20120306420 | CONTROL SYSTEM OF MILLING MACHINE - A control system of a milling machine is disclosed. The milling machine has an overarm, a spindle connected to a cutter, a spindle motor, and an X-axis motor, a Y-axis motor and a Z-axis motor. The control system includes a vibration sensor for detecting a vibration level of the spindle. The control system also includes a central control unit configured to adjust a rotation speed of at least one of the X-axis motor, the Y-axis motor, and the Z-axis motor to bring a load current of at least one of the motors to be within a corresponding current range, and configured to adjust a rotation speed of the spindle motor to bring the vibration level to be within a vibration range. | 12-06-2012 |
20120321406 | DEFLECTION CORRECTION SYSTEM FOR A MILLING MACHINE - A milling machine has a carriage, a main spindle seat extending along an axis, and a motor operable to drive displacement of the main spindle seat relative to the carriage along the axis. A deflection correction system includes a control unit, a displacement sensor, at least one pressure cylinder, and a pressure sensor. The pressure cylinder includes a cylinder body, and a control rod extended retractably into the cylinder body. The control unit is configured to determine a pressure range as a function of displacement detected by the displacement sensor, and to maintain fluid pressure in the pressure cylinder within a pressure range, thereby controlling the control rod via the cylinder body to position the second end portion of the main spindle seat relative to the axis. | 12-20-2012 |
20130004256 | THERMAL COMPENSATION SYSTEM FOR A MILLING MACHINE - A milling machine has a base, a work platform mounted movably on the base, and a ruler mounted on the work platform. The work platform is movable relative to a base axis. The thermal compensation system includes a sensor and a control unit. The sensor is configured to be mounted on the base for sensing a position of each of the work platform and the ruler relative to the base axis. The control unit is coupled to the sensor, and determines a work platform displacement and a ruler displacement according to the positions sensed by the sensor. The control unit further calculates a compensation value based on the work platform displacement and the ruler displacement. The control unit is configured to correct the position of the work platform relative to the base axis according to the compensation value. | 01-03-2013 |
20130265411 | SYSTEM AND METHOD FOR INSPECTING SCRAPED SURFACE OF A WORKPIECE - A system for inspecting a scraped surface of a workpiece performs steps of: a) capturing an image of the scraped surface to obtain a original image section; b) removing high point regions whose areas are outside of a predetermined area range to obtain a base image; c) processing pixels of the base image using a first imaging mask to generate a judgment image; d) determining whether uniformity of the high point regions in the base image conforms a standard; e) determining whether a number of the high point regions in the base image falls within a predetermined number range; and f) evaluating whether or not a portion of the scraped surface conforms with the standard based on results of determinations made in steps d) and e). | 10-10-2013 |
Chia-Hui Wu, Taoyuan Shien TW
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20140118929 | PORTABLE ELECTRICAL DEVICE - A portable electrical device includes a tablet PC, a bottom plate, a support arm and a pivot portion. The tablet PC includes a breach and a first magnetic inducing member arranged inside the breach. One end of the support arm is pivoted to the bottom plate, and the other end of the support arm is pivoted to the pivot portion, and the other end of the pivot portion is with a second magnetic inducing member. When the second magnetic inducing member is moved into the breach to magnetize the first magnetic inducing member, the tablet PC is securely coupled with the pivot portion so that the tablet PC can be rotated; on the contrary, when the second magnetic inducing member is removed from the breach, the tablet PC can be totally independent to the support arm and the bottom plate. | 05-01-2014 |
Chia-Hui Wu, Tainan City TW
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20130087906 | CIRCUIT BOARD, FABRICATING METHOD THEREOF AND PACKAGE STRUCTURE - The present invention provides a circuit board including a substrate, at least one lead, at least one bump, and a solder layer. The lead is disposed on the substrate, and the bump is disposed on the lead. The solder layer covers the lead and the bump. | 04-11-2013 |
Chia-Hui Wu, Lunbei Township TW
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20140138519 | IMAGE-SENSING APPARATUS - An image-sensing apparatus is provided. The image-sensing apparatus includes: an optical filter array including a two-band passing filter and an infrared filter; an RGB pixel array placed below the two-band passing filter; and a TOF pixel array adjacent to the RGB pixel array and placed below the two-band passing filter and the infrared filter, wherein a combination of the two-band passing filter and the infrared passing filter permits only the incident light in the infrared region to pass to the ToF pixel array. | 05-22-2014 |
20140183334 | IMAGE SENSOR FOR LIGHT FIELD DEVICE AND MANUFACTURING METHOD THEREOF - An image sensor for light field devices includes a plurality of sub-microlenses, a space layer, and a plurality of main microlenses. The space layer is disposed on the sub-microlenses, and the main microlenses are disposed on the space layer. The diameter of each of the main microlenses exceeds that of each of the sub-microlenses. | 07-03-2014 |
Chia-Hui Wu, Dalin Township TW
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20100310302 | Computer-contained binder - A computer-contained binder provided in the disclosure has a document binder and a computer device. The document binder having at least one cover plate and plural parallel folder rings piercing through an edge of the cover plate. The computer device has a main body, a column-shaped battery portion pierced through by all of the parallel folder rings, and a movable arm. The movable arm has two opposite ends, in which one end thereof is fixed on one of the opposite ends of the column-shaped battery portion, and the other end thereof is movably disposed on one side of the main body. | 12-09-2010 |
20100310303 | Computer-contained binder - A computer-contained binder provided in the disclosure has a document binder and a computer device. The document binder having at least one cover and plural parallel folder rings piercing through an edge of the cover. The computer device has a main body, a column-shaped battery portion pierced through by all of the parallel folder rings, and two shafts. Each shaft respectively pivots the column-shaped battery portion and the main body at two opposite end of the shaft. | 12-09-2010 |
20130118676 | METHOD FOR FABRICATING A PROXIMITY SENSING MODULE - The steps of a method for fabricating a proximity sensing module that is adapted to be attached to a mobile device, include: (a) patterning an upper conductive film to form a patterned conductive film which includes an upper connective pad that is adapted to be electrically connected to a respective contact on a circuit board of the mobile device, and an induced circuit pattern that is electrically connected to the upper connective pad; (b) adhering an adhesive sheet to the patterned conductive film; and (c) forming a through hole in the adhesive sheet such that the upper connective pad is exposed from the through hole. | 05-16-2013 |
Chia-Hui Wu, Chiai County TW
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20100309612 | ELECTRONIC DEVICE AND SLIDING ASSEMBLY THEREOF - An electronic device includes an upper cover and a main body. A sliding assembly is disposed between the upper cover and the main body and includes a sliding portion, a spring, and a track with a first positioning portion disposed at the center of a side of the track and two second positionings portion disposed on two ends of the side of the track. The spring including an engaging portion and two ends, and the sliding portion are fixed on the cover. The engaging portion and the ends form an included angle. The sliding portion is movably connected to the track and slides thereon. When the sliding portion slides on the track, the engaging portion is engaged with one of the first positioning portion and the second positioning portions. | 12-09-2010 |
Chia-Hui Wu, Hsinhua TW
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20090101513 | METHOD OF MANUFACTURING A FILM PRINTED CIRCUIT BOARD - A method of manufacturing a film printed circuit board is provided. A film substrate consisting of a polyimide substrate, an alloy layer and a first copper layer is provided. A first lithographic and etching process is performed to pattern the copper layer and the alloy layer and a plurality of conductive line structures is formed on the polyimide substrate. A second copper layer is formed over the polyimide substrate and the conductive line structures. A second lithographic and etching process is performed to pattern the second copper layer. | 04-23-2009 |
Chia-Hui Yu, Chiayi County TW
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20130012669 | THERMOSETTING RESIN COMPOSITION AND APPLICATION THEREOF - A thermosetting resin composition includes an epoxy resin, a polyetheramine curing agent, and an epoxy silane coupling agent. The polyetheramine curing agent is in an amount less than or equal to 10 parts by weight and the epoxy silane coupling agent is in an amount more than or equal to 10 parts by weight based on 100 parts by weight of the epoxy resin. | 01-10-2013 |
20140016063 | LIGHT GUIDE PLATE, LIGHT-EMITTING UNIT AND LIQUID CRYSTAL DISPLAY DEVICE HAVING THE SAME - The present invention relates to a light guide plate, a light-emitting unit having the light guide plate and a liquid crystal display (LCD) device having the light-emitting unit. The light guide plate includes a pattern-forming ink composition that is coated and dried on a bottom surface of the light guide plate, so as to form dot patterns as a light guide layer. The pattern-forming ink composition includes an acrylate-based resin (A), a yellow pigment (B), a filling material (C) and a solvent (D). A LCD device including the aforementioned light guide plate can achieve the requirements of high brightness and low color temperature. | 01-16-2014 |
20140049728 | LIGHT GUIDE PLATE, LIGHT-EMITTING UNIT AND LIQUID CRYSTAL DISPLAY DEVICE HAVING THE SAME - The present invention relates to a light guide plate, a light-emitting unit having the light guide plate and a liquid crystal display device having the light-emitting unit. The light guide plate includes a light guide layer that has dot patterns. The dot patterns are formed by coating and drying a pattern-forming ink composition on a bottom surface. The pattern-forming ink composition includes an acrylate-based resin having a saturated alicyclic group (A) and a solvent (B). By utilizing the aforementioned light guide plate, the liquid crystal display device with low color difference can be fabricated. | 02-20-2014 |
Chia-Hui Yu, Puzih City TW
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20130021543 | PHOTOSENSITIVE RESIN COMPOSITION AND APPLICATION THEREOF - A photosensitive resin composition includes: a copolymer obtained by subjecting a conjugated diene polymer having a (meth)acryloyl group, a conjugated diene monomer, and a (meth)acrylic acid monomer to copolymerization; a compound having at least one ethylenically unsaturated group; and a photoinitiator. The copolymer contains 60 wt % to 99 wt % of a copolymer fraction having a molecular weight ranging from 30,000 to 900,000, and 1 wt % to 22 wt % of a copolymer fraction having a molecular weight ranging from 1,000 to 10,000 when calculated from an integral molecular weight distribution curve obtained by plotting cumulative weight percentage versus molecular weight falling within a range between 1,000 and 1,000,000 measured by gel permeation chromatography. | 01-24-2013 |
20130335645 | PHOTOSENSITIVE RESIN COMPOSITION AND APPLICATION OF THE SAME - A photosensitive resin composition includes (A) a conjugated diene polymer having a (meth)acryloyl group, (B) a compound having at least one ethylenically unsaturated group, (C) a photo-initiator, and (D) a compound represented by formula (I): | 12-19-2013 |