Inventors list |
Assignees list |
Classification tree browser |
Top 100 Inventors |
Top 100 Assignees |
Chia-Hsiung
Chia-Hsiung Chen, Hsinchu City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090175706 | METHOD AND APPARATUS FOR DETECTING A WAFER POD - A detection method of a wafer pod includes performing an airtight test to the bolt hole on the cam of the wafer pod and determining the cam is abnormal when a result of the airtight test reveals that the bolt hole has an air-leak defect, wherein the bolt hole is positioned in back of the bolt of the cam. | 07-09-2009 |
Chia-Hsiung Hsieh, Yanshui Township TW
| Patent application number | Description | Published |
|---|---|---|
| 20100320610 | SEMICONDUCTOR PACKAGE WITH SUBSTRATE HAVING SINGLE METAL LAYER AND MANUFACTURING METHODS THEREOF - A semiconductor package includes a substrate, a die, and a package body. The substrate includes: (a) a core including a resin reinforced with fibers; (b) a plurality of openings extending through the core; (c) a dielectric layer; and (d) a single conductive layer disposed between the dielectric layer and the core. Portions of a lower surface of the single conductive layer cover the plurality of openings to form a plurality of first contact pads for electrical connection external to the semiconductor package. Exposed portions of an upper surface of the single conductive layer form a plurality of second contact pads. The die is electrically connected to the plurality of second contact pads, and the package body encapsulates the die. | 12-23-2010 |
| 20110084370 | SEMICONDUCTOR PACKAGE AND PROCESS FOR FABRICATING SAME - A package carrier includes: (a) a dielectric layer defining a plurality of openings; (b) patterned electrically conductive layer, embedded in the dielectric layer and disposed adjacent to a first surface of the dielectric layer; a plurality of electrically conductive posts, disposed in respective ones of the openings, wherein the openings extend between a second surface of the dielectric layer to the patterned electrically conductive layer, the electrically conductive posts a connected to the patterned electrically conductive layer, and an end of each of the electrically conductive posts has a curved profile and is faced away from the patterned electrically conductive layer; and (d) a patterned solder resist layer, disposed adjacent to the first surface of the dielectric layer and exposing portions of the patterned electrically conductive layer corresponding to contact pads. A semiconductor package includes the package carrier, a chip, and an encapsulant covering the chip and the package carrier. | 04-14-2011 |
Chia-Hsiung Peng, Taoyuan City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090128497 | Portable Electronic Device and its Key structure - A key structure of a portable electronic device is provided. The portable electronic device has a first operation mode and a second operation mode. The key structure comprises a key, a first light source, and a second light source. The first light source emits a first colored light in the first operation mode so that the key can display a first input symbol. The second light source emits a second colored light in the first operation mode so that the key can display a second input symbol. As a result, users who operate portable electronic devices with the aforementioned key structure can easily recognize the different kinds of input symbols corresponding to different input methods in different operation modes. | 05-21-2009 |
Chia-Hsiung Wu, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20090263114 | AUTOMOTIVE WATER HEATER - An automotive water heater having application to a windshield of an automobile, which is able to produce hot water that can be sprinkled on the windshield to melt accumulated snow and frost, in which a water heater is mainly structured from a laminated assembled heating unit side joined to a heat conducting surface of an exchange bed. Heat quantity produced by the heating unit forms a heat balance function, which transfers the heat to the exchange bed, and water flow paths are defined interior of the exchange bed. The face joining of the laminated heating units is used to facilitate maintenance of component members and allow changing of the number of heating units assembled to the exchange bed, thereby providing choice to accommodate different power requirements. | 10-22-2009 |
| 20110056927 | Binding process for an air heater and structure thereof - A binding process for an air heater and structure thereof, in particular a heater having application in air, in which various modularized prefabricated units are used to assemble and enable subsequent binding and rapid production of the heater. An electric conduction test is simultaneously implemented during the binding process, which enables accelerating the speed of solidification of a binding material and avoids a baking energy load. The present invention is able to withstand a relatively large assembly clamping pressure during the binding process, and achieves a substantially large secure mechanical force fit between the components after completing assembly that provides good conducting physical properties. | 03-10-2011 |
| 20110062137 | Vehicular fluid heater - A vehicular fluid heater is used to heat fluid for defrosting or cleaning a windshield, a head lamp, etc., and viscous fluid such as hydraulic oil, lubrication oil, etc. to reduce viscosity and improve performance, particularly during a cold condition. The heater is constructed by a plurality of laminated heating composites joined to heat conduction surfaces of a heat exchange vessel, which facilitates ease of production, maintenance, and heating power selection. A fluid field is defined by fluid pathways formed by a structural design that assembles the heat exchange vessel, and a front and a back seal panels disposed on the heat exchanger. | 03-17-2011 |