Patent application number | Description | Published |
20110297975 | LIGHT-EMITTING UNIT ARRAY - A light-emitting unit array includes a plurality of light-emitting units arranged and integrated monolithically in an array, and each of the light-emitting units includes a first doped type layer, a second doped type layer, a light-emission layer, and a photonic crystal structure. The light emission layer is disposed between the first doped type layer and the second doped type layer, wherein the second doped type layer has a surface facing away from the light emission layer. The photonic crystal structure is disposed on the surface of the second doped type layer. | 12-08-2011 |
20110299044 | PROJECTION APPARATUS - A projection apparatus is provided. The projection apparatus includes a light-emitting unit array, an optical sensor, and a control unit. The light-emitting unit array is for emitting an image beam. The optical sensor is for detecting electromagnetic waves so as to generate a signal. The control unit is electrically coupled to the light-emitting unit array and the optical sensor for controlling emission of the light-emitting unit array according to the signal from the optical sensor. | 12-08-2011 |
20130026511 | TRANSFER-BONDING METHOD FOR THE LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE ARRAY - A transfer-bonding method for light emitting devices including following steps is provided. A plurality of light emitting devices is formed over a first substrate and is arranged in array, wherein each of the light emitting devices includes a device layer and a sacrificial pattern sandwiched between the device layer and the first substrate. A protective layer is formed over the first substrate to selectively cover parts of the light emitting devices, and other parts of the light emitting devices are uncovered by the protective layer. The device layers uncovered by the protective layer are bonded with a second substrate. The sacrificial patterns uncovered by the protective layer are removed, so that parts of the device layers uncovered by the protective layer are separated from the first substrate and are transfer-bonded to the second substrate. | 01-31-2013 |
20130135507 | PHOTOGRAPHY AND PROJECTION APPARATUS AND LIGHT EMITTING AND SENSING MODULE - A photography and projection apparatus including a light emitting and sensing module and a projection lens is provided. The light emitting and sensing module has a light emitting and sensing area, and includes a light emitting unit array and a light sensing unit array. The light emitting unit array includes a plurality of light emitting units arranged in an array. The light emitting units are distributed in the light emitting and sensing area. The light emitting unit array is adapted to provide an image beam. The light sensing unit array includes a plurality of light sensing units arranged in an array. The light sensing units are distributed in the light emitting and sensing area. The projection lens is disposed on a transmission path of the image beam. A light emitting and sensing module is also provided. | 05-30-2013 |
20130214302 | LIGHT EMITTING ELEMENT AND FABRICATING METHOD THEREOF - A fabricating method of light emitting element. A substrate is provided. A plurality of first concaves and a plurality of second concaves are formed on the substrate, wherein a volume of each first concave is different from a volume of each second concave. A plurality of first light emitting diode chips and a plurality of second light emitting diode chips are provided, wherein a volume of each first light emitting diode chip is corresponding to the volume of each first concave, and a volume of each second light emitting diode chip is corresponding to the volume of each second concave. The first light emitting diode chips are moved onto the substrate such that the first light emitting diode chips go into the first concaves, and the second light emitting diode chips are moved onto the substrate such that the second light emitting diode chips go into the first concaves. | 08-22-2013 |
20130236183 | VISIBLE LIGHT COMMUNICATION TRANSCEIVER AND SYSTEM - A visible light communication (VLC) transceiver and a VLC system are provided. The VLC transceiver includes a substrate, a lens module and a plurality of channel units. The channel units are disposed on the substrate in an array to provide different bidirectional communication channels. Wherein, each of the channel units respectively includes at least a visible light emitter and at least a visible light receiver. The channel units can enhance communication bandwidth by using modulation technology such as spatial multiplexing or time multiplexing. The lens module is disposed on an optical path of the channel units. The lens module actively tracks the receiving situation of the visible light receiver to improve the signal quality of high-speed multiplexing communication. | 09-12-2013 |
20130341659 | DISPLAY PANEL - A display panel including a substrate, a meshed shielding pattern, and a plurality of light-emitting devices is provided. The meshed shielding pattern is disposed on the substrate so as to define a plurality of pixel regions on the substrate. The light-emitting devices are disposed on the substrate. At least one light-emitting device of the light-emitting devices is disposed in each pixel region of the pixel regions, wherein an area of the pixel region is A1, an area of the light-emitting device is A2, and a ratio of A2 to A1 is below 50%. | 12-26-2013 |
20150063386 | SEMICONDUCTOR LASER STRUCTURE - A semiconductor laser structure is provided. The semiconductor laser comprises a central thermal shunt, a ring shaped silicon waveguide, a contiguous thermal shunt, an adhesive layer and a laser element. The central thermal shunt is located on a SOI substrate which has a buried oxide layer surrounding the central thermal shunt. The ring shaped silicon waveguide is located on the buried oxide layer and surrounds the central thermal shunt. The ring shaped silicon waveguide includes a P-N junction of a p-type material portion, an n-type material portion and a depletion region there between. The contiguous thermal shunt covers a portion of the buried oxide layer and surrounds the ring shaped silicon waveguide. The adhesive layer covers the ring shaped silicon waveguide and the buried oxide layer. The laser element covers the central thermal shunt, the adhesive layer and the contiguous thermal shunt. | 03-05-2015 |
20150063745 | OPTICAL COUPLING MODULE - An optical coupling module includes a silicon photonic substrate, and an optical waveguide module. The silicon photonic substrate has a first surface and a first grating on the first surface for diffracting the light which passes through the grating. The optical waveguide module is disposed on the silicon photonic substrate, wherein the optical waveguide module includes an optical waveguide having an end disposed in corresponding to the first grating of the silicon photonic substrate. Otherwise, the optical waveguide module has a reflective surface coupled to the end of the optical waveguide and adapted to reflect the light emerging from or incident into the grating to form an optical path between the silicon photonic substrate and the optical waveguide for transmitting the light. | 03-05-2015 |