Patent application number | Description | Published |
20090189170 | Light emitting diode - A light emitting diode includes a casing, comprising a concave accommodation space; a lead frame, disposed in the casing, wherein the lead frame has at least two individual leads which extend into the accommodation space; a light emitting chip, disposed in the accommodation space and electrically connected to the leads; and an encapsulating material, inside the accommodation space. The light emitting diode emits light along an optical axis. The ratio of a first tilt angle between the first reflecting wall and the optical axis, and a second tilt angle to a second tilt angle between the second reflecting wall and the optical axis is no more than 4. | 07-30-2009 |
20090315051 | PHOTOELECTRIC SEMICONDUCTOR DEVICE CAPABLE OF GENERATING UNIFORM COMPOUND LIGHTS - A transparent layer and a phosphor layer are covered on the LED chip for increasing light emission efficiency and evenness of the LED. Based on angle-dependent emission strength of the LED chip, the phosphor layer is designed with different thickness or contains different phosphor powder concentration in different section. The lights emitted with different strength from different angle of the LED chip are transformed into uniform compound lights after passing through the phosphor layer that has different thickness or phosphor powder concentration. Micro structures capable of destroying the full reflection occurred on the incident lights are further configured on both the inner and outer surfaces of the phosphor layer to increase the light emission efficiency. | 12-24-2009 |
20100200879 | PHOTOELECTRIC SEMICONDUCTOR DEVICE - A photoelectric semiconductor device has a metal wiring layer packed or embedded into a housing for enhancing package stability and electric connectivity. The housing has a cavity structure, and at least one LED chip and an encapsulating material are configured inside the cavity structure. The metal wiring layer locates inside the housing, or in other words, between the top surface and the bottom surface of the housing, and extends to the bottom of the cavity structure to electrically connect the LED chip. With fully wrapping around, the metal wiring layer has higher stability and more reliability from being harmed by outside changes in humidity and temperature. | 08-12-2010 |
20100237360 | LIGHT EMITTING DIODE AND BACK LIGHT MODULE THEREOF - A light emitting diode (LED) includes an LED chip, a substrate structure, a fluorescence layer, and a lens. The substrate structure includes a cavity. The fluorescence layer covers on the LED chip and is configured in the cavity and covering the LED chip. The lens is installed on the substrate structure. The lens includes a curved lateral wall, a plane at the top, and a conical concave portion at the top center. | 09-23-2010 |
20100276713 | LED DEVICE AND PACKAGING METHOD THEREOF - A LED device includes a base structure having a receiving space, a light-emitting chip, an encapsulating structure, and a phosphor layer. The receiving space is defined by an inner bottom surface of the base structure and an inner side wall surrounding the inner bottom surface. The light-emitting chip is mounted on the bottom of the receiving space. The encapsulating structure is filled into the receiving space to cover the light-emitting chip. The phosphor layer is formed on the encapsulating structure. The dimension of the phosphor layer is more than the dimension of the receiving space and less than 1.5 times that of the receiving space, so as to mount on the top surface of the base structure. | 11-04-2010 |
20100301361 | LIGHT EMITTING DIODE - A light emitting diode of the present invention comprises a support frame, a shell, a light emitting diode chip and an encapsulating body. The shell is used to accommodate the support frame. The shell has a bowl-shaped structure and the bowl-shaped structure has two opposite first walls and two opposite second walls. The upper edge of the second wall is a concave-convex structure. The encapsulating body is used to package the bowl-shaped structure and the encapsulating body has a concave-convex structure similar to the concave-convex structure of the bowl-shaped structure. The concave-convex structure comprises a concave portion and a convex portion. The structure of the light emitting diode is simplified. The luminous intensity and the light extraction efficiency of the light emitting diode are enhanced and the thickness of the light emitting diode is not increased. | 12-02-2010 |
20100301370 | PHOTOELECTRIC SEMICONDUCTOR DEVICE CAPABLE OF GENERATING UNIFORM COMPOUND LIGHTS - A transparent layer and a phosphor layer are covered on the LED chip for increasing light emission efficiency and evenness of the LED. Based on angle-dependent emission strength of the LED chip, the phosphor layer is designed with different thickness or contains different phosphor powder concentration in different section. The lights emitted with different strength from different angle of the LED chip are transformed into uniform compound lights after passing through the phosphor layer that has different thickness or phosphor powder concentration. Micro structures capable of destroying the full reflection occurred on the incident lights are further configured on both the inner and outer surfaces of the phosphor layer to increase the light emission efficiency. | 12-02-2010 |
20100308346 | LIGHT-EMITTING DIODE AND MODULE THEREOF - A light-emitting diode module includes a transparent base, a support and a plurality of light-emitting chips. The base has a plurality of cavities separated from each other by a predetermined distance in order to respectively receive the light-emitting chips to form light-exiting areas. The base has a reflecting portion opposite to the cavities. The reflecting portion is at least one inclined plane for reflecting light that have projected outside walls of the cavities to the peripheral area of the light-emitting areas in order to increase the uniformity of the light source. In addition, the light-emitting chips are arranged to form a line or surface light source of any sizes by adjusting the numbers of the cavity and the light-emitting chips. | 12-09-2010 |
20110019397 | LIGHT EMITTING DIODE, BACKLIGHT MODULE, AND LIGHT TUBE - A light emitting diode includes: a base with a concave portion; a light emitting chip disposed in the concave portion; an encapsulating layer filled in the concave portion; and an optical adjusting element disposed on the light emitting chip. Herein, the light emitting diode has a batwing distribution in a horizontal view angle, and the light emitting diode has a Lambertian distribution in a vertical view angle thereof. | 01-27-2011 |
20120033404 | ILLUMINATION DEVICE - An illumination device includes a base, a light-emitting module, a first layer, and a second layer. The light-emitting module is disposed on the base for generating a progressive-type light-emitting intensity. The first layer encapsulates the light-emitting module. The second layer encloses the first layer. The second layer has a progressive-type thickness corresponding to the progressive-type light-emitting intensity, and both the progressive-type light-emitting intensity and the progressive-type thickness are decreased or increased gradually, thus the progressive-type light-emitting intensity can be transformed into the same light-emitting intensity through the progressive-type thickness of the second layer. | 02-09-2012 |
20120194067 | LED DEVICE - A LED device includes a base structure having a receiving space, a light-emitting chip, an encapsulating structure, and a phosphor layer. The receiving space is defined by an inner bottom surface of the base structure and an inner side wall surrounding the inner bottom surface. The light-emitting chip is mounted on the bottom of the receiving space. The encapsulating structure is filled into the receiving space to cover the light-emitting chip. The phosphor layer is formed on the encapsulating structure. The dimension of the phosphor layer is more than the dimension of the receiving space and less than 1.5 times that of the receiving space, so as to mount on the top surface of the base structure. | 08-02-2012 |
20130087816 | ILLUMINATION DEVICE - An illumination device includes a base, a light-emitting module, a first layer, and a second layer. The light-emitting module is disposed on the base for generating a progressive-type light-emitting intensity. The first layer encapsulates the light-emitting module. The second layer encloses the first layer. The second layer has a progressive-type thickness corresponding to the progressive-type light-emitting intensity, and both the progressive-type light-emitting intensity and the progressive-type thickness are decreased or increased gradually, thus the progressive-type light-emitting intensity can be transformed into the same light-emitting intensity through the progressive-type thickness of the second layer. | 04-11-2013 |
20130201465 | POSITIONING SYSTEM - A positioning system includes a first working platform, a second working platform spaced apart from the first working platform, and a carrier. The carrier is fixed on the first working platform or the second working platform. The carrier has at least one fixing member for fixing the substrate onto the carrier and fixing the mask onto the substrate. The substrate has at least one fixing hole formed thereon for receiving the fixing member, and the mask has at least one positioning hole formed thereon in alignment with the fixing hole. The fixing member is capable of inserting sequentially through the fixing hole of the substrate and the positioning hole of the mask. | 08-08-2013 |
20130234177 | LED PACKAGE STRUCTURE - The present invention relates to a package structure for light-emitting diodes (LEDs). The package structure includes a substrate, a heat-dissipating structure disposed on the substrate, and a plurality of LED chips uniformly disposed on the heat-dissipating structure. The heat-dissipating structure has a central portion and at least one peripheral portion surrounding thereof. The central portion is capable of dissipating more heat than the peripheral portion. Thus, the temperature difference between the LED chips disposed on the central portion and the LED chips disposed on the peripheral portion can be reduced. | 09-12-2013 |
20140299894 | LIGHT EMITTING DIODE PACKAGE - A light emitting diode (LED) package including a substrate unit, a light emitting unit and an encapsulant. The substrate unit includes a metal substrate and a circuit board. The metal substrate has a first carrier portion and a second carrier portion. The second carrier portion is projected from the first carrier portion. The first carrier portion has a first carrier face. The second carrier portion has a second carrier face located higher than the first carrier face. The circuit board is disposed on the first carrier face, and the second carrier portion passes through the circuit board. The light emitting unit includes at least one LED chip disposed on the second carrier face of the second carrier portion, and the LED chip electrically connected to the circuit board. The encapsulant encapsulates the LED chip. | 10-09-2014 |
20150084499 | ILLUMINATION DEVICE - An illumination device includes a base, a light-emitting module, a first layer, and a second layer. The light-emitting module is disposed on the base for generating a progressive-type light-emitting intensity. The first layer encapsulates the light-emitting module. The second layer encloses the first layer. The second layer has a progressive-type thickness corresponding to the progressive-type light-emitting intensity, and both the progressive-type light-emitting intensity and the progressive-type thickness are decreased or increased gradually, thus the progressive-type light-emitting intensity can be transformed into the same light-emitting intensity through the progressive-type thickness of the second layer. | 03-26-2015 |