| Patent application number | Description | Published |
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| 20090289343 | Semiconductor package having an antenna - The present invention relates to a semiconductor package having an antenna. The semiconductor package includes a substrate, a chip, a molding compound and an antenna. The substrate has a first surface and a second surface. The chip is disposed on the first surface of the substrate, and electrically connected to the substrate. The molding compound encapsulates the whole or a part of the chip. The antenna is disposed on the molding compound, and electrically connected to the chip. The antenna is disposed on the molding compound that has a relatively large area, so that the antenna will not occupy the space for the substrate. | 11-26-2009 |
| 20100071939 | Substrate of window ball grid array package - The present invention relates to a substrate of a window ball grid array package. The substrate includes at least one window, a first conductive layer, a second conductive layer, a dielectric layer, a plurality of first vias and a plurality of second vias. The window penetrates the substrate. The first conductive layer has a plurality of fingers and at least one first power/ground plane, and the fingers are disposed at the periphery of the window. The second conductive layer has at least one second power/ground plane. The dielectric layer is disposed between the first conductive layer and the second conductive layer. The first vias electrically connect the first power/ground plane to the second power/ground plane. The second vias are disposed between the fingers and the window, and electrically connect some of the fingers to the second power/ground plane. Thus, the substrate can control the characteristic impedance and increase the signal integrity. | 03-25-2010 |
| 20110068437 | Semiconductor Element Having a Conductive Via and Method for Making the Same and Package Having a Semiconductor Element with a Conductive Via - The present invention relates to a semiconductor element having a conductive via and a method for making the same and a package having a semiconductor element with a conductive via. The semiconductor element includes a silicon chip and at least one conductive via. The silicon chip includes a silicon substrate and an active circuit layer. The active circuit layer is disposed on a second surface of the silicon substrate, and has at least one metal layer. The conductive via penetrates the silicon substrate, and includes a conductive metal. The conductive metal electrically connects to the metal layer of the active circuit layer, and a surface of the conductive metal is exposed to the outside of a first surface of the silicon substrate. Therefore, a chip is able to be directly stacked on the semiconductor element without forming a passivation layer and a redistribution layer on the first surface of the silicon substrate, and the process is simplified and the manufacturing cost is decreased. | 03-24-2011 |
| Patent application number | Description | Published |
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| 20090194851 | SEMICONDUCTOR DEVICE PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHIELDING - Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit including a grounding element disposed adjacent to a periphery of the substrate unit; (2) a semiconductor device disposed adjacent to an upper surface of the substrate unit; (3) a package body disposed adjacent to the upper surface and covering the semiconductor device; and (4) an EMI shield disposed adjacent to exterior surfaces of the package body and electrically connected to a connection surface of the grounding element. A lateral surface of tile package body is substantially aligned with a lateral surface of the substrate unit, and the connection surface of the grounding element is electrically exposed adjacent to the lateral surface of the substrate unit. The grounding element corresponds to a remnant of a grounding via, and provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield. | 08-06-2009 |
| 20090194852 | SEMICONDUCTOR DEVICE PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHIELDING - Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit; (2) a grounding element disposed adjacent to a periphery of the substrate unit and extending upwardly from an upper surface of the substrate unit; (3) a semiconductor device disposed adjacent to the upper surface; (4) a package body disposed adjacent to the upper surface and covering the semiconductor device and the grounding element; and (5) an EMI shield disposed adjacent to exterior surfaces of the package body and electrically connected to a lateral surface of the grounding element. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit. The grounding element corresponds to a remnant of a conductive bump, and provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield. | 08-06-2009 |
| 20090256244 | SEMICONDUCTOR DEVICE PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHIELDING - Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit including a grounding element; (2) a semiconductor device disposed adjacent to an upper surface of the substrate unit; (3) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device; and (4) an EMI shield disposed adjacent to exterior surfaces of the package body and electrically connected to a connection surface of the grounding element. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit, and the connection surface of the grounding element is electrically exposed adjacent to the lateral surface of the substrate unit. The grounding element corresponds to a remnant of an internal grounding via, and provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield. | 10-15-2009 |
| 20100207259 | SEMICONDUCTOR DEVICE PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHIELDING - Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes a grounding element disposed adjacent to a periphery of a substrate unit and at least partially extending between an upper surface and a lower surface of the substrate unit. The grounding element includes an indented portion that is disposed adjacent to a lateral surface of the substrate unit. The semiconductor device package also includes an EMI shield that is electrically connected to the grounding element and is inwardly recessed adjacent to the indented portion of the grounding element. | 08-19-2010 |
| 20100265009 | STACKED LC RESONATOR AND BANDPASS FILTER OF USING THE SAME - A stacked LC resonator includes a parallel-plate capacitor, a dielectric layer and a spiral inductor. The parallel-plate capacitor has a first metal layer, a second metal layer opposed to the first metal layer and a middle dielectric layer formed between the first and second metal layers. The dielectric layer is formed on the second metal layer of the parallel-plate capacitor. The spiral inductor is formed on the dielectric layer and electrically connected with the first and second metal layers of the parallel-plate capacitor. | 10-21-2010 |
| 20110115060 | Wafer-Level Semiconductor Device Packages with Electromagnetic Interference Shielding - Described herein are wafer-level semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a semiconductor device; (2) a package body covering lateral surfaces of the semiconductor device, a lower surface of the package body and a lower surface of the semiconductor device defining a front surface; (3) a set of redistribution layers disposed adjacent to the front surface, the set of redistribution layers including a grounding element that includes a connection surface electrically exposed adjacent to at least one lateral surface of the set of redistribution layers; and (4) an EMI shield disposed adjacent to the package body and electrically connected to the connection surface of the grounding element. The grounding element provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield. | 05-19-2011 |
