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| 20080296342 | Nail Gun for Rapidly Detaching Magazine Assembly - A nail gun includes a handle, a magazine assembly, and a fastener. The handle includes a pin joint base for receiving a position pin, with a head portion. One end of the magazine assembly couples with a gun body of the nail gun. The magazine assembly includes a coupling base, which includes a slotted pin aperture. The slotted pin aperture has an end portion and a slotted block portion intercommunicated with each other, the head portion of the position pin passing through the end portion and being embedded at the slotted block portion. The fastener is disposed between the magazine assembly and the coupling base, which has an external stopper and an inner stopper. The fastener can swing to the slotted block portion, which drives the external and the inner stoppers to block the head portion of the position pin, and drives the external stopper to be disposed between the end portion and the slotted block portion. | 12-04-2008 |
| 20090108046 | Trigger Switch Mechanism for Nail Gun - A trigger switch mechanism for a nail gun includes a trigger valve formed on the nail gun for trigger nail shooting, a safety slidable rod configured to push against a workpiece and indirectly drive the trigger valve, a main trigger arranged between the safety slidable rod and the trigger valve, and an inner trigger disposed in the main trigger for touching the trigger valve to switch on the trigger valve. The main trigger drives the inner trigger to extend to or to leave a touchable position of the safety slidable rod, and thereby the nail gun performs in a sequential actuation mode. An outer trigger is arranged on an outer side of the main trigger for driving the inner trigger to hold the inner trigger at a position where the safety slidable rod can touch the inner trigger, and thereby the nail gun performs in a contact actuation mode. | 04-30-2009 |
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| 20100330741 | FABRICATION METHOD FOR SYSTEM-ON-CHIP (SOC) MODULE - A fabrication method for a system-on-chip (SoC) module is provided. The fabrication method includes the steps of providing at least two SoC sub-modules and connecting the SoC sub-modules. The SoC sub-modules are electrically connected with each other by connection interfaces of the SoC sub-modules so as to form the SoC module. As the SoC sub-modules have been verified in advance, the time required for verifying the resulting SoC module can be significantly reduced. As for application-specific SoC modules, they are fabricated by connecting with application-specific SoC sub-modules via the appropriate connection interfaces. Thus, the time and costs for developing SoC modules can both be minimized. | 12-30-2010 |
| 20110096506 | MULTI-LAYER SOC MODULE STRUCTURE - A multi-layer system-on-chip (SoC) module structure is provided. The multi-layer SoC module structure includes at least two circuit board module layers and at least one connector module layer. Each connector module layer is sandwiched between and thus electrically connects two circuit board module layers such that the SoC module structure is formed by stacking. Each circuit board module layer is composed of at least one circuit board module while each connector module layer is composed of at least one connector module. Hence, the SoC module structure can be manufactured as a three-dimensional structure, thus allowing highly flexible connections within the SoC module structure. | 04-28-2011 |
| 20110138248 | METHOD FOR ARRANGING MEMORIES OF LOW-COMPLEXITY LDPC DECODER AND LOW-COMPLEXITY LDPC DECODER USING THE SAME - A method for arranging memories of a low-complexity low-density parity-check (LDPC) decoder and a low-complexity LDPC decoder using the same method are provided. The main idea of the method for arranging memories of a low-complexity LDPC decoder is to merge at least one or two small-capacity memory blocks into one memory group, so that the memory area can be reduced and the power consumption in reading or writing data is lowered. Besides, as the merged memory group shares the same address line in reading or writing data, at least one delay unit is used to adjust the reading or writing order and thereby ensure data validity. A low-complexity LDPC decoder using the disclosed method can meet the demands of high processing rate and low power consumption. | 06-09-2011 |
| 20110181245 | UNITIZED CHARGING AND DISCHARGING BATTERY MANAGEMENT SYSTEM AND PROGRAMMABLE BATTERY MANAGEMENT MODULE THEREOF - The present invention discloses a unitized charging and discharging battery management system and a programmable battery management module thereof The unitized charging and discharging battery management system includes a smart battery module and a programmable battery management module, which has a universal loop and a control unit. The smart battery module has at least two smart batteries which are electrically connected by a plurality of switches and circuits of the universal loop to form a charging/discharging loop in series/parallel. The control unit monitors the charging and discharging status of the smart batteries to turn on or off the switches accordingly, so as to manage the smart batteries, thereby enhancing the overall power efficacy of the smart battery module. Besides, the service life of the smart battery module is also prolonged due to the simultaneous charging and discharging capability. | 07-28-2011 |
| 20110188210 | THREE-DIMENSIONAL SOC STRUCTURE FORMED BY STACKING MULTIPLE CHIP MODULES - A three-dimensional SoC structure formed by stacking multiple chip modules is provided. The three-dimensional SoC structure includes at least two vertical SoC modules and at least one connector module, wherein each connector module electrically connects two vertical SoC modules. Each vertical SoC module is constructed by stacking at least two chip modules vertically. Each chip module includes a module circuit board and at least one preset element. A recess is formed in each module circuit board and provided with a first connecting interface for electrically connecting with the corresponding at least one preset element. The at least two vertical SoC modules are connected by the connector module to form a three-dimensional SoC structure with multiple functions. Besides, the recesses formed in the module circuit boards provide effective heat dissipation paths for the preset elements. | 08-04-2011 |
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| 20100052914 | Portable body temperature continuous monitoring system - A portable body temperature continuous monitoring system includes a wearable thermal detecting device, a recording device, a displaying device and an alarming device. The recording device records and stores a human body temperature detected by the wearable thermal detecting device, and then transmits a temperature signal to the displaying device and the alarming device through a wireless method. Thereby, remote and continuous monitoring of a patient's body temperature through the displaying device is possible. Besides, since the system is capable of communicating outward through the alarming device, the patient's abnormal body temperature can be reported to others so that proper treatment can be conducted timely. | 03-04-2010 |
| 20100054300 | Temperature-sensing undergarment - A temperature-sensing undergarment is provided. The temperature-sensing undergarment primarily includes a garment body, at least one temperature-sensing device and a processing device. The garment body is provided with a receiving pocket, from which at least one conductor is extended to two armpit portions of the garment body. When the garment body is worn on a human body, the temperature-sensing devices disposed at the two armpit portions of the garment body will sense the body temperature and transmit a temperature-sensing signal to the processing device via the conductor. Thus, variation of the body temperature can be detected continuously. | 03-04-2010 |
| 20100283602 | System and method for monitoring relative position of moving object - Disclosed are a system and a method for monitoring a relative position of a moving object. The system essentially includes at least one positioning and transmitting device and a signal receiving and processing device, each equipped with a radio frequency identification (RFID) signal transceiver. The RFID signal transceiver of the signal receiving and processing device receives radio signals transmitted by the RFID signal transceiver of each of the positioning and transmitting devices, thus enabling the signal receiving and processing device to track one or more moving objects each carrying one such positioning and transmitting device and determine the position or positions of the one or more moving objects relative to the signal receiving and processing device. | 11-11-2010 |
