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Chi-Chih
Chi-Chih Chen, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20110079846 | HIGH VOLTAGE DEVICES, SYSTEMS, AND METHODS FOR FORMING THE HIGH VOLTAGE DEVICES - A high voltage (HV) device includes a gate dielectric structure over a substrate. The gate dielectric structure has a first portion and a second portion. The first portion has a first thickness and is over a first well region of a first dopant type in the substrate. The second portion has a second thickness and is over a second well region of a second dopant type. The first thickness is larger than the second thickness. A gate electrode is disposed over the gate dielectric structure. A metallic layer is over and coupled with the gate electrode. The metallic layer extends along a direction of a channel under the gate dielectric structure. At least one source/drain (S/D) region is disposed within the first well region of the first dopant type. | 04-07-2011 |
Chi-Chih Chen, Hsinchu City TW
| Patent application number | Description | Published |
|---|---|---|
| 20080237703 | HIGH VOLTAGE SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATING THE SAME - An exemplary embodiment of a semiconductor device capable of high-voltage operation includes a substrate with a well region therein. A gate stack with a first side and a second side opposite thereto, overlies the well region. Within the well region, a doped body region includes a channel region extending under a portion of the gate stack and a drift region is adjacent to the channel region. A drain region is within the drift region and spaced apart by a distance from the first side thereof and a source region is within the doped body region near the second side thereof. There is no P-N junction between the doped body region and the well region. | 10-02-2008 |
Chi-Chih Chu, Shiaugang Chiu TW
| Patent application number | Description | Published |
|---|---|---|
| 20100171205 | Stackable Semiconductor Device Packages - In one embodiment, a semiconductor device package includes: (1) a substrate unit; (2) connecting elements disposed adjacent to a periphery of the substrate unit and extending upwardly from an upper surface of the substrate unit; (3) a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit; and (4) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit. The package body defines openings that at least partially expose respective ones of the connecting elements. At least one of the connecting elements has a width W | 07-08-2010 |
| 20100171206 | Package-on-Package Device, Semiconductor Package, and Method for Manufacturing The Same - A semiconductor package includes: (1) a substrate including an upper surface and a lower surface opposite to the upper surface; (2) a chip mounted and electrically connected to the upper surface of the substrate; (3) an interposer mounted on the chip and electrically connected to the upper surface of the substrate, the interposer including an upper surface and a lower surface that is opposite to the upper surface and facing the chip, the interposer including a plurality of electrical contacts located on the upper surface of the interposer; and (4) a molding compound sealing the substrate, the interposer, and the chip, and exposing the lower surface of the substrate, the molding compound defining a plurality of holes that enclose and expose respective ones of the electrical contacts. | 07-08-2010 |
Chi-Chih Chu, Hsin-Chu City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090290381 | BACKLIGHT MODULE HAVING REPLACEABLE LIGHT APPARATUS - The present invention discloses a backlight module having replaceable light apparatus. The backlight module includes the replaceable light apparatus, a back plate and a frame body. The replaceable light apparatus includes a light control circuit, a securing device and conducting wires. The light control circuit is adapted to a frame body and a back plate of the backlight module. Additionally, the light control circuit has a plurality of light sources, a first end portion and a second end portion. The securing device has a supporting housing which has a position protrusion and a clamping portion for supporting the first end portion of the light control circuit along a first direction (X) and a third direction (Z). The clamping portion clamps the first end portion of the light control circuit along a second direction (Y) and the third direction (Z). | 11-26-2009 |
Chi-Chih Chu, Fengshan City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100237490 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A package structure and a manufacturing method thereof are provided. The package structure includes a packaging substrate, a chip, an interposer substrate, a wire and an adhesive layer. The packaging substrate has an upper packaging surface. The chip is disposed on the upper packaging surface. The wire connects the packaging substrate and the interposer substrate. The adhesive layer is disposed between the packaging substrate and the interposer substrate, and covers the entire chip and part of the upper packaging surface. The adhesive layer includes a first adhesive part and a second adhesive part. The first adhesive part adheres the interposer substrate and the chip. The second adhesive part surrounds the first adhesive part, adheres the interposer substrate and the packaging substrate, and supports a periphery of the interposer substrate. | 09-23-2010 |
Chi-Chih Huang, Tao-Yuan Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20090215216 | Packaging method of image sensing device - A packaging method for an image sensing device is disclosed. The packaging method includes the steps of a) mounting an image sensing module, having a light-receiving region exposed, on a substrate; b) connecting the image sensing module and the substrate via a plurality of bonding wires; c) forming a protecting layer on the light-receiving region of the image sensing module; d) forming a molding layer to seal the plurality of bonding wires; e) flattening the protecting layer and the molding layer; f) removing the protecting layer to expose the light-receiving region of the image sensing module; and g) forming a transparent lid. | 08-27-2009 |
| 20100025795 | Image sensing device and packaging method thereof - An image sensing device and packaging method thereof is disclosed. The packaging method includes the steps of a) providing an image sensing module, having a light-receiving region exposed, on a first substrate; b) forming a plurality of first contacts around the light-receiving region on the image sensing module; c) providing a second substrate, having a plurality of second contacts corresponding to the plurality of first contacts and an opening for allowing the light-receiving region to be exposed while the second substrate is placed over the image sensing module, the plurality of second contacts being disposed around the opening; d) connecting the plurality of first contacts and the plurality of second contacts; and e) disposing a transparent lid above the light-receiving region, on a side of the second substrate which is opposite to the plurality of second contacts. | 02-04-2010 |
| 20100295099 | IMAGE SENSING DEVICE AND PACKAGING METHOD THEREOF - An image sensing device and packaging method thereof is disclosed. The packaging method includes the steps of a) providing an image sensing module, having a light-receiving region exposed, on a first substrate; b) forming a plurality of first contacts around the light-receiving region on the image sensing module; c) providing a second substrate, having a plurality of second contacts corresponding to the plurality of first contacts and an opening for allowing the light-receiving region to be exposed while the second substrate is placed over the image sensing module, the plurality of second contacts being disposed around the opening; d) connecting the plurality of first contacts and the plurality of second contacts; and e) disposing a transparent lid above the light-receiving region, on a side of the second substrate which is opposite to the plurality of second contacts. | 11-25-2010 |
Chi-Chih Huang, Taipei Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20090289857 | PORTABLE ELECTRONIC DEVICE WITH A REPLACEABLE ANTENNA MODULE - A portable electronic device includes a main body including a housing and a wireless communication module installed inside the housing for processing wireless signals. The portable electronic device further includes an antenna module connected to the housing at one end in a rotatable manner. The antenna module includes an antenna body for receiving and radiating wireless signals. At least one sunken part is formed on the antenna body. The antenna module further includes at least one elastic structure fixed inside the housing and wedged in the sunken part on the antenna body in an elastic deformation manner so as to fix the antenna body and the housing. | 11-26-2009 |
Chi-Chih Hung, Feng-Shan City TW
| Patent application number | Description | Published |
|---|---|---|
| 20080312005 | Handle of a golf club - A golf club handle includes a body, and an ornamental ring; the body has two adjacent different-color sections, and a color-mixing section at a joint between the two adjacent different-color sections; the handle body is formed with an annular recess on the joint between the two adjacent different-color sections; the ornamental ring is received in the annular recesses so as to cover the color-mixing section of the handle body. | 12-18-2008 |
| 20090163286 | Connecting structure of a shaft and a grip member of a golf club - A golf club includes a shaft, a grip member positioned around a tail portion of the shaft, an expanding component positioned in the tail portion of the shaft, and a fastening component; the grip member has a holding room to receive the tail portion of shaft; the expanding component is made of rubber, and has an axial central hole, and a rugged. outer side; the fastening component has a head part, which has a greater diameter than the central hole of the expanding component; the fastening component has threads thereon; the fastening component is inserted in the axial hole of the expanding component, with the head part being pressed against the grip member so that the rugged outer side of the expanding component is tightly pressed against the inner side of the tail portion of the shaft, and the grip member and the shaft are fastened together. | 06-25-2009 |
| 20090275422 | Connecting structure of a shaft and a grip member of a golf club - A golf club includes a shaft, a grip member, and two constricting and fastening mechanisms to fasten the grip member and the shaft together; the shaft is held in the grip member at a tail portion; the grip member has locating holes, and consists of first and second half shell parts, which are secured together; each constricting and fastening mechanism includes a fastening base secured in the grip member, and fastening member facing the fastening base; the fastening base has through holes, which face the locating holes respectively; the fastening member has threaded holes, which face the through holes respectively; threaded elements are passed through the locating holes and the through holes, and joined in the threaded holes of the fastening member; thus, the shaft will be tightly sandwiched between the fastening base and the fastening member when the threaded elements are turned tight. | 11-05-2009 |
Chi-Chih Kuo, Bau-Shan Hsiang TW
| Patent application number | Description | Published |
|---|---|---|
| 20080240064 | METHOD FOR TRANSMITTING FRAMES IN A WIRELESS LOCAL AREA NETWORK - On the case of receiving data frame from a station, the method of the present invention instructs the repeater to replace the content of the receiver address field by the address of the bridge when receiving the frame transmitted from the station, and then forwards the frames to the bridge. On the case of receiving a data frame transmitted from the bridge, the repeater can replace the content of transmitter address field by the address of the repeater itself, and then forwards the data frame to the station. | 10-02-2008 |
Chi-Chih Shen, Kaohslung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100219524 | CHIP SCALE PACKAGE AND METHOD OF FABRICATING THE SAME - A chip scale package (CSP) package and method of fabricating the same are provided. The fabricating method includes the following steps. First, a substrate is provided. Next, a chip is disposed on the front surface of the substrate and electrically connected to the substrate. Then, a thermal conductive paste is formed on the surface of the chip. Afterwards, a molding compound for enclosing the chip is formed. Lastly, a milling process is applied to the molding compound so that the height of the molding compound is aligned with that of the thermal conductive paste. The chip can be disposed on the substrate by way of wire bonding or flip-chip bonding. The thermal conductive paste is disposed on the surface of the chip either before or after the milling process is completed. | 09-02-2010 |
Chi-Chih Wu, Taipei County TW
| Patent application number | Description | Published |
|---|---|---|
| 20100134230 | TRANSFORMER WITH HIGH LEAKAGE INDUCTANCE - The present invention provides a high leakage inductance transformer for solving the problem of insufficient leakage inductance in the conventional transformer. The transformer of the present invention includes a primary winding portion, two secondary winding portions mounted at two ends of the primary winding portion, and an iron core set having inner iron cores for penetrating the primary winding portion and the secondary winding portions and outer iron cores exposed out of the primary winding portion and the secondary winding portions and connected with the inner iron cores, so as to form a magnetic loop, wherein the primary winding portion has an intensifying winding portion for being penetrated by the outer iron cores, so as to increase the leakage inductance. | 06-03-2010 |