Chi-Chih
Chi-Chih Chen, Hsinchu TW
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20110079846 | HIGH VOLTAGE DEVICES, SYSTEMS, AND METHODS FOR FORMING THE HIGH VOLTAGE DEVICES - A high voltage (HV) device includes a gate dielectric structure over a substrate. The gate dielectric structure has a first portion and a second portion. The first portion has a first thickness and is over a first well region of a first dopant type in the substrate. The second portion has a second thickness and is over a second well region of a second dopant type. The first thickness is larger than the second thickness. A gate electrode is disposed over the gate dielectric structure. A metallic layer is over and coupled with the gate electrode. The metallic layer extends along a direction of a channel under the gate dielectric structure. At least one source/drain (S/D) region is disposed within the first well region of the first dopant type. | 04-07-2011 |
20120273883 | HIGH VOLTAGE DEVICES AND METHODS FOR FORMING THE SAME - A high voltage (HV) device includes a gate dielectric structure over a substrate. The gate dielectric structure has a first portion and a second portion. The first portion has a first thickness and is disposed over a first well region of a first dopant type in the substrate. The second portion has a second thickness and is disposed over a second well region of a second dopant type. The first thickness is larger than the second thickness. An isolation structure is disposed between the gate dielectric structure and a drain region disposed within the first well region. A gate electrode is disposed over the gate dielectric structure. | 11-01-2012 |
Chi-Chih Chen, Hsinchu City TW
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20080237703 | HIGH VOLTAGE SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATING THE SAME - An exemplary embodiment of a semiconductor device capable of high-voltage operation includes a substrate with a well region therein. A gate stack with a first side and a second side opposite thereto, overlies the well region. Within the well region, a doped body region includes a channel region extending under a portion of the gate stack and a drift region is adjacent to the channel region. A drain region is within the drift region and spaced apart by a distance from the first side thereof and a source region is within the doped body region near the second side thereof. There is no P-N junction between the doped body region and the well region. | 10-02-2008 |
Chi-Chih Chen, Hsin-Chu TW
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20130181285 | Lateral DMOS Device with Dummy Gate - An LDMOS transistor with a dummy gate comprises an extended drift region formed over a substrate, a drain region formed in the extended drift region, a channel region formed in the extended drift region, a source region formed in the channel region and a dielectric layer formed over the extended drift region. The LDMOS transistor with a dummy gate further comprises an active gate formed over the channel region and a dummy gate formed over the extended drift region. The dummy gate helps to reduce the gate charge of the LDMOS transistor while maintaining the breakdown voltage of the LDMOS transistor. | 07-18-2013 |
Chi-Chih Chou, New Taipei City TW
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20160097662 | ELECTROMAGNETIC FLOWMETER WITH VOLTAGE-AMPLITUDE CONDUCTIVITY-SENSING FUNCTION FOR A LIQUID IN A TUBE - An electromagnetic flowmeter with voltage-amplitude conductivity-sensing function for a liquid in a tube includes a first microprocessor, a transducer, flow-sensing device, an exciting-current generating device, a voltage-amplitude conductivity-sensing device, and a switch. The transducer includes coils and sensing electrodes. The switch is electrically connected to the first microprocessor and the sensing electrode. The switch is selectively connected to the flow-sensing device or the voltage-amplitude conductivity-sensing device according to the signals sent from the microprocessor. The microprocessor makes the exciting-current generating device to generate an exciting current when the switch is connected to the flow-sensing device. The microprocessor makes the exciting-current generating device to stop generating exciting current and computing conductivity of liquid when the switch is electrically connected to the voltage-amplitude conductivity-sensing device. | 04-07-2016 |
Chi-Chih Chou, Kaohsiung Hsien TW
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20120201484 | SLIDE ASSEMBLY WITH BUFFERING MEMBER FOR REDUCING IMPACT AND NOISE - A slide assembly includes a first rail, a second rail movable connected to the first rail, a restriction member on the second rail, and a support base movably connected to an open end of the first rail. The second rail is pulled from the open end. The first rail includes an installation hole and a stop at the open end. The support base includes a buffering member contacting the stop of the first rail. When the second rail is completely pulled from the first rail, the restriction member contacts the support base which is moved and compresses the buffering member to reduce the impact force and the noise. | 08-09-2012 |
Chi-Chih Chu, Kao-Hsiung City TW
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20140312496 | SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE - The present invention relates to a semiconductor package and a semiconductor device and a method of making the same. The method of making the semiconductor package comprises: providing a substrate; attaching a chip to a surface of the substrate; forming a plurality of connecting elements for electrically connecting the chip and the substrate; forming a plurality of first conductive bodies on the surface of the substrate; forming a molding compound for encapsulating the surface of the substrate, the chip, the connecting elements and the first conductive bodies; and removing a part of a border portion of the molding compound, so that the molding compound has two heights and one end of each first conductive bodies is exposed. Thereby, the molding compound covers the entire surface of the substrate, so that the bonding pads on the surface of the substrate will not be polluted. | 10-23-2014 |
Chi-Chih Chu, Shiaugang Chiu TW
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20100171205 | Stackable Semiconductor Device Packages - In one embodiment, a semiconductor device package includes: (1) a substrate unit; (2) connecting elements disposed adjacent to a periphery of the substrate unit and extending upwardly from an upper surface of the substrate unit; (3) a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit; and (4) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit. The package body defines openings that at least partially expose respective ones of the connecting elements. At least one of the connecting elements has a width W | 07-08-2010 |
20100171206 | Package-on-Package Device, Semiconductor Package, and Method for Manufacturing The Same - A semiconductor package includes: (1) a substrate including an upper surface and a lower surface opposite to the upper surface; (2) a chip mounted and electrically connected to the upper surface of the substrate; (3) an interposer mounted on the chip and electrically connected to the upper surface of the substrate, the interposer including an upper surface and a lower surface that is opposite to the upper surface and facing the chip, the interposer including a plurality of electrical contacts located on the upper surface of the interposer; and (4) a molding compound sealing the substrate, the interposer, and the chip, and exposing the lower surface of the substrate, the molding compound defining a plurality of holes that enclose and expose respective ones of the electrical contacts. | 07-08-2010 |
Chi-Chih Chu, Fengshan City TW
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20100237490 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A package structure and a manufacturing method thereof are provided. The package structure includes a packaging substrate, a chip, an interposer substrate, a wire and an adhesive layer. The packaging substrate has an upper packaging surface. The chip is disposed on the upper packaging surface. The wire connects the packaging substrate and the interposer substrate. The adhesive layer is disposed between the packaging substrate and the interposer substrate, and covers the entire chip and part of the upper packaging surface. The adhesive layer includes a first adhesive part and a second adhesive part. The first adhesive part adheres the interposer substrate and the chip. The second adhesive part surrounds the first adhesive part, adheres the interposer substrate and the packaging substrate, and supports a periphery of the interposer substrate. | 09-23-2010 |
Chi-Chih Chu, Hsin-Chu City TW
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20090290381 | BACKLIGHT MODULE HAVING REPLACEABLE LIGHT APPARATUS - The present invention discloses a backlight module having replaceable light apparatus. The backlight module includes the replaceable light apparatus, a back plate and a frame body. The replaceable light apparatus includes a light control circuit, a securing device and conducting wires. The light control circuit is adapted to a frame body and a back plate of the backlight module. Additionally, the light control circuit has a plurality of light sources, a first end portion and a second end portion. The securing device has a supporting housing which has a position protrusion and a clamping portion for supporting the first end portion of the light control circuit along a first direction (X) and a third direction (Z). The clamping portion clamps the first end portion of the light control circuit along a second direction (Y) and the third direction (Z). | 11-26-2009 |
Chi-Chih Huang, Hsinchu City TW
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20160141280 | Device-Embedded Image Sensor, And Wafer-Level Method For Fabricating Same - A device-embedded image sensor includes an image sensor formed in a first semiconductor substrate; a top conductive pad formed on a top surface of the first semiconductor substrate; and a semiconductor device formed in a second semiconductor substrate bonded to a bottom surface of the first semiconductor substrate, the semiconductor device electrically connected to the top conductive pad. A method for fabricating a device-embedded image sensor from a CMOS image sensor wafer assembly that includes an image sensor and a conductive pad. The method includes exposing the conductive pad; forming an isolation layer; exposing a surface of each conductive pad; forming a patterned redistribution layer (RDL) having a plurality of RDL elements on the isolation layer; electrically isolating adjacent RDL elements; and laminating the CMOS image sensor wafer assembly and a semiconductor device wafer to form undiced device-embedded image sensors. | 05-19-2016 |
Chi-Chih Huang, Tao-Yuan Hsien TW
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20090215216 | Packaging method of image sensing device - A packaging method for an image sensing device is disclosed. The packaging method includes the steps of a) mounting an image sensing module, having a light-receiving region exposed, on a substrate; b) connecting the image sensing module and the substrate via a plurality of bonding wires; c) forming a protecting layer on the light-receiving region of the image sensing module; d) forming a molding layer to seal the plurality of bonding wires; e) flattening the protecting layer and the molding layer; f) removing the protecting layer to expose the light-receiving region of the image sensing module; and g) forming a transparent lid. | 08-27-2009 |
20100025795 | Image sensing device and packaging method thereof - An image sensing device and packaging method thereof is disclosed. The packaging method includes the steps of a) providing an image sensing module, having a light-receiving region exposed, on a first substrate; b) forming a plurality of first contacts around the light-receiving region on the image sensing module; c) providing a second substrate, having a plurality of second contacts corresponding to the plurality of first contacts and an opening for allowing the light-receiving region to be exposed while the second substrate is placed over the image sensing module, the plurality of second contacts being disposed around the opening; d) connecting the plurality of first contacts and the plurality of second contacts; and e) disposing a transparent lid above the light-receiving region, on a side of the second substrate which is opposite to the plurality of second contacts. | 02-04-2010 |
20100295099 | IMAGE SENSING DEVICE AND PACKAGING METHOD THEREOF - An image sensing device and packaging method thereof is disclosed. The packaging method includes the steps of a) providing an image sensing module, having a light-receiving region exposed, on a first substrate; b) forming a plurality of first contacts around the light-receiving region on the image sensing module; c) providing a second substrate, having a plurality of second contacts corresponding to the plurality of first contacts and an opening for allowing the light-receiving region to be exposed while the second substrate is placed over the image sensing module, the plurality of second contacts being disposed around the opening; d) connecting the plurality of first contacts and the plurality of second contacts; and e) disposing a transparent lid above the light-receiving region, on a side of the second substrate which is opposite to the plurality of second contacts. | 11-25-2010 |
Chi-Chih Huang, Taipei Hsien TW
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20090289857 | PORTABLE ELECTRONIC DEVICE WITH A REPLACEABLE ANTENNA MODULE - A portable electronic device includes a main body including a housing and a wireless communication module installed inside the housing for processing wireless signals. The portable electronic device further includes an antenna module connected to the housing at one end in a rotatable manner. The antenna module includes an antenna body for receiving and radiating wireless signals. At least one sunken part is formed on the antenna body. The antenna module further includes at least one elastic structure fixed inside the housing and wedged in the sunken part on the antenna body in an elastic deformation manner so as to fix the antenna body and the housing. | 11-26-2009 |
Chi-Chih Hung, Feng-Shan City TW
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20080312005 | Handle of a golf club - A golf club handle includes a body, and an ornamental ring; the body has two adjacent different-color sections, and a color-mixing section at a joint between the two adjacent different-color sections; the handle body is formed with an annular recess on the joint between the two adjacent different-color sections; the ornamental ring is received in the annular recesses so as to cover the color-mixing section of the handle body. | 12-18-2008 |
20090163286 | Connecting structure of a shaft and a grip member of a golf club - A golf club includes a shaft, a grip member positioned around a tail portion of the shaft, an expanding component positioned in the tail portion of the shaft, and a fastening component; the grip member has a holding room to receive the tail portion of shaft; the expanding component is made of rubber, and has an axial central hole, and a rugged. outer side; the fastening component has a head part, which has a greater diameter than the central hole of the expanding component; the fastening component has threads thereon; the fastening component is inserted in the axial hole of the expanding component, with the head part being pressed against the grip member so that the rugged outer side of the expanding component is tightly pressed against the inner side of the tail portion of the shaft, and the grip member and the shaft are fastened together. | 06-25-2009 |
20090275422 | Connecting structure of a shaft and a grip member of a golf club - A golf club includes a shaft, a grip member, and two constricting and fastening mechanisms to fasten the grip member and the shaft together; the shaft is held in the grip member at a tail portion; the grip member has locating holes, and consists of first and second half shell parts, which are secured together; each constricting and fastening mechanism includes a fastening base secured in the grip member, and fastening member facing the fastening base; the fastening base has through holes, which face the locating holes respectively; the fastening member has threaded holes, which face the through holes respectively; threaded elements are passed through the locating holes and the through holes, and joined in the threaded holes of the fastening member; thus, the shaft will be tightly sandwiched between the fastening base and the fastening member when the threaded elements are turned tight. | 11-05-2009 |
Chi-Chih Kang, Berkeley, CA US
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20150316547 | Electrophoretic Separation Devices and Methods for Using the Same - Electrophoretic separation devices and methods for using the same are provided. Aspects of the devices include a polymeric separation medium that includes a plurality of microwells. Also provided are methods, systems and kits in which the subject devices find use. The devices and methods find use in a variety of different electrophoretic separation applications. | 11-05-2015 |
Chi-Chih Kuo, Bau-Shan Hsiang TW
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20080240064 | METHOD FOR TRANSMITTING FRAMES IN A WIRELESS LOCAL AREA NETWORK - On the case of receiving data frame from a station, the method of the present invention instructs the repeater to replace the content of the receiver address field by the address of the bridge when receiving the frame transmitted from the station, and then forwards the frames to the bridge. On the case of receiving a data frame transmitted from the bridge, the repeater can replace the content of transmitter address field by the address of the repeater itself, and then forwards the data frame to the station. | 10-02-2008 |
20150023340 | Method for Transmitting Frames in a Wireless Local Area Network - On the case of receiving data frame from a station, the method of the present invention instructs the repeater to replace the content of the receiver address field by the address of the bridge when receiving the frame transmitted from the station, and then forwards the frames to the bridge. On the case of receiving a data frame transmitted from the bridge, the repeater can replace the content of transmitter address field by the address of the repeater itself, and then forwards the data frame to the station. | 01-22-2015 |
Chi-Chih Shen, Kaohslung City TW
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20100219524 | CHIP SCALE PACKAGE AND METHOD OF FABRICATING THE SAME - A chip scale package (CSP) package and method of fabricating the same are provided. The fabricating method includes the following steps. First, a substrate is provided. Next, a chip is disposed on the front surface of the substrate and electrically connected to the substrate. Then, a thermal conductive paste is formed on the surface of the chip. Afterwards, a molding compound for enclosing the chip is formed. Lastly, a milling process is applied to the molding compound so that the height of the molding compound is aligned with that of the thermal conductive paste. The chip can be disposed on the substrate by way of wire bonding or flip-chip bonding. The thermal conductive paste is disposed on the surface of the chip either before or after the milling process is completed. | 09-02-2010 |
Chi-Chih Shen, Hsin-Chu City TW
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20140014824 | NON-LENS PACKAGE STRUCTURE FOR AN OPTICAL DEVICE - A packaged optical device includes a package frame having a compartment and an opening, a sensor chip bonded in the compartment, and a non-lens transparency layer embedded in the package frame at the opening and sealing up the opening. This package structure could prevent the sensor chip from adhesion of suspended particles or other contaminations, and simply the assembly process, thereby improving reliability and reducing cost of the packaged optical device. | 01-16-2014 |
Chi-Chih Shen, Hsinchu County TW
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20130044380 | LENS MODULE AND METHOD FOR MANUFACTURING THE SAME - A lens module is suitable for a wafer level process and works in collaboration with an image sensor. The lens module includes a substrate, a lens and a spacer. The lens is disposed on a surface of the substrate for concentrating a light. The spacer is disposed on the substrate and surrounds the lens to block the light from penetrating the substrate through a circumference of the lens. The substrate and the lens are made of a light transmissive material and the spacer is made of an opaque material for shielding a stray light coming from outside, thereby improving a sensing performance of the image sensor. | 02-21-2013 |
Chi-Chih Wu, Taipei County TW
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20100134230 | TRANSFORMER WITH HIGH LEAKAGE INDUCTANCE - The present invention provides a high leakage inductance transformer for solving the problem of insufficient leakage inductance in the conventional transformer. The transformer of the present invention includes a primary winding portion, two secondary winding portions mounted at two ends of the primary winding portion, and an iron core set having inner iron cores for penetrating the primary winding portion and the secondary winding portions and outer iron cores exposed out of the primary winding portion and the secondary winding portions and connected with the inner iron cores, so as to form a magnetic loop, wherein the primary winding portion has an intensifying winding portion for being penetrated by the outer iron cores, so as to increase the leakage inductance. | 06-03-2010 |
Chi-Chih Yang, Taoyuan County TW
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20140020150 | VENTILATING RAINCOAT WITH BAY WINDOWS - A ventilating raincoat with bay windows, comprising: a raincoat having a plurality of vent units arranged at a predetermined position thereof; and a plurality of bay windows arranged at an external surface of each vent unit, and having a top edge, two side edges extended downward from both sides of the top edge and a cover surface arranged between the top edge and the two side edges to form a hollow cover body with a downward opening between the raincoat and the bay window. Moreover, the top edge and the two side edges of the bay window form an inverted U-shaped structure made of a flexible and elastic material for the cover surface to have a support strength; such that the cover surface does not deform, remaining a ventilating path between an inner edge of the hollow cover body and the surface of the raincoat. | 01-23-2014 |