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Chew, Singapore
Boon Fong Chew, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20120086802 | SYSTEM AND METHOD FOR MONITORING WATER QUALITY - A system and system for monitoring water quality. The system comprises a container for receiving a flow of water to be monitored, the container containing a plurality of fish and configured such that a substantially 3-dimensional group behaviour of the fish is accommodated; a first imaging device disposed above the container for obtaining top view video data of the fish; and means for identifying individual fish based on foreground object detection. | 04-12-2012 |
Chee Meng Chew, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20080200842 | Apparatus and Method For Measuring in Vivo Biomechanical Properties of Skin - An assembly for measuring in vivo biomechanical properties of skin, comprising a testing device, said testing device comprising; a first pad attachable to the skin a second pad attachable to the skin, at a known distance from the first pad; said attachability of the pads to the skin to prevent relative movement between the respective pad and the skin to which it is attached; a forcing means for applying a force to the first pad, whilst said pads are attached to the skin, along a first axis connecting the first and second pad, to induce a corresponding relative movement between the pads due to deformation of the skin between said pads; a force measurement device for measuring the applied force, and; a displacement measurement device for measuring the corresponding induced movement. | 08-21-2008 |
| 20110319792 | APPARATUS AND METHOD FOR MEASURING IN VIVO BIOMECHANICAL PROPERTIES OF SKIN - An assembly for measuring in vivo biomechanical properties of skin, comprising a testing device, said testing device comprising; a first pad attachable to the skin a second pad attachable to the skin, at a known distance from the first pad; said attachability of the pads to the skin to prevent relative movement between the respective pad and the skin to which it is attached; a forcing means for applying a force to the first pad, whilst said pads are attached to the skin, along a first axis connecting the first and second pad, to induce a corresponding relative movement between the pads due to deformation of the skin between said pads; a force measurement device for measuring the applied force, and; a displacement measurement device for measuring the corresponding induced movement. | 12-29-2011 |
Chong Lin Chew, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20090065961 | Fibre Reinforced Composite and Method of Forming the Same - A method for forming an orthodontic device having a fibre reinforced composite is provided. The fibre reinforced composite has a fibre material within a matrix phase material. The fibre material comprises braided fibre material having a braid angle in the range from about 3° to about 87°, and more particularly in the range from about 10° to about 45°. The fibre reinforced composite is formed from a method which includes the steps of impregnating the fibre material with a monomer resin, shaping the fibre that is impregnated with the resin into a defined cross sectional shape suitable for use in the orthodontic device, and polymerising the monomer resin in the impregnated fibre to form the fibre-reinforced composite. | 03-12-2009 |
David K. M. Chew, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20090309760 | APPARATUS AND METHOD FOR LOCATING, IDENTIFYING AND TRACKING VEHICLES IN A PARKING AREA - A method for use in the management of vehicle parking in a vehicle parking area having a plurality of vehicle parking spaces, the method comprising determining the locations of vacant vehicle parking spaces; and displaying the locations of vacant vehicle parking spaces to people seeking to park vehicles. | 12-17-2009 |
Guanhan Chew, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20100132483 | MICROFABRICATED TOOLS FOR MANIPULATION OF SMALL SAMPLES - Microfabricated tools useful for manipulating small, delicate samples are formed from thin plastic films. The films have a small thickness (preferably 5 to 50 micrometers and typically 10 micrometers) and small lateral dimensions (preferably 2 mm or less and typically 0.1 to 1 mm) so that they are reasonably flexible, but are preferably curved by being wrapped around a cylindrical or flat post to give them some rigidity. The softness and thinness of the plastic reduce risk of sample damage during incidental contact with the tool. Its thinness makes it optically and X-ray transparent, so that the samples can be clearly visualized during manipulations and so that the tools can be used to collect X-ray data from samples. As an option, an X-ray sensitive phosphor is incorporated in the film at low concentration. This allows the X-ray beam to be visually located on the mount or tool. The plastic can also be treated to obtain a desired hydrophobicity or hydrophilicity, mechanically embossed or abraded, or coated with films (for example, of polyethylene glycol via pegylation procedures or of PDMS) that promote or inhibit sample adhesion. | 06-03-2010 |
Han-Gan Chew, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20110221009 | METHOD AND APPARATUS FOR REDUCING GATE RESISTANCE - An apparatus has a semiconductor device that includes: a semiconductor substrate having a channel region, a high-k dielectric layer disposed at least partly over the channel region, a gate electrode disposed over the dielectric layer and disposed at least partly over the channel region, wherein the gate electrode is made substantially of metal, and a gate contact engaging the gate electrode at a location over the channel region. A different aspect involves a method for making a semiconductor device that includes: providing a semiconductor substrate having a channel region, forming a high-k dielectric layer at least partly over the channel region, forming a gate electrode over the dielectric layer and at least partly over the channel region, the gate electrode being made substantially of metal, and forming a gate contact that engages the gate electrode at a location over the channel region. | 09-15-2011 |
Han Guan Chew, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20090291311 | METHOD OF FORMING A NANOSTRUCTURE - A method of forming a discrete nanostructured element at one or more predetermined locations on a substrate is presented. The method includes forming a mask member over the substrate. A window is formed in the mask member at each of one or more locations at which it is required to form the nanostructured element thereby to expose a portion of a surface of the substrate. A portion of the substrate exposed by the window at the one or more locations is removed to form one or more recesses in the substrate. The method further includes forming a layer of a nanostructure medium over a surface of the recess and annealing the structure thereby to form the nanostructured element in each of the one or more recesses. The nanostructured element includes a portion of the nanostructure medium and has an external dimension along at least two substantially orthogonal directions of less than substantially 100 nm. | 11-26-2009 |
| 20100096695 | HIGH STRESS FILM - A semiconductor device that includes a substrate having an active region prepared with a transistor is presented. The semiconductor device includes a stress structure adjacent to the substrate. The stress structure includes a dielectric layer having nanocrystals embedded therein. The nanocrystals induce a first or a second stress on a channel region of the transistor which improves carrier mobility of the transistor. | 04-22-2010 |
| 20100167505 | METHODS FOR REDUCING LOADING EFFECTS DURING FILM FORMATION - A method for fabricating a semiconductor device is provided. The method comprises selectively forming a first layer over a first and second exposed portions of a substrate. The first and second exposed portions are of different sizes and are located adjacent to a first and second active devices. During the first layer formation, a gas mixture comprising first and second source gases that function as growth components for forming the first layer and a reactant gas that functions as an etching component for controlling selectivity of the first layer growth is provided. The reactant gas is different from the first and second source gases and one of first and second source gases forms the first layer at a faster rate over the first exposed portion as compared to the second exposed portion and the other source gas exhibits an opposite behavior. | 07-01-2010 |
| 20110108928 | METHOD FOR FORMING HIGH-K METAL GATE DEVICE - The present disclosure provides a method of fabricating a semiconductor device that includes providing a semiconductor substrate, forming a metal gate on the substrate, the metal gate having a first gate resistance, removing a portion of the metal gate thereby forming a trench; and forming a conductive structure within the trench such that a second gate resistance of the conductive structure and remaining portion of the metal gate is lower than the first gate resistance. | 05-12-2011 |
| 20110193161 | METHOD AND APPARATUS OF FORMING A GATE - The present disclosure provides a semiconductor device having a transistor. The transistor includes a substrate and first and second wells that are disposed within the substrate. The first and second wells are doped with different types of dopants. The transistor includes a first gate that is disposed at least partially over the first well. The transistor further includes a second gate that is disposed over the second well. The transistor also includes source and drain regions. The source and drain regions are disposed in the first and second wells, respectively. The source and drain regions are doped with dopants of a same type. | 08-11-2011 |
| 20110201172 | METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE - The disclosure relates to integrated circuit fabrication, and more particularly to a method for fabricating a semiconductor device. An exemplary method for fabricating the semiconductor device comprises providing a substrate; forming pad oxide layers over a frontside and a backside of the substrate; forming hardmask layers over the pad oxide layers on the frontside and the backside of the substrate; and thinning the hardmask layer over the pad oxide layer on the frontside of the substrate. | 08-18-2011 |
| 20110230042 | METHOD FOR IMPROVING THERMAL STABILITY OF METAL GATE - The present disclosure provides a method of fabricating a semiconductor device that includes providing a semiconductor substrate, forming a gate structure on the substrate, the gate structure including a dummy gate, removing the dummy gate from the gate structure thereby forming a trench, forming a work function metal layer partially filling the trench, forming a fill metal layer filling a remainder of the trench, performing a chemical mechanical polishing (CMP) to remove portions of the metal layers outside the trench, and implanting Si, C, or Ge into a remaining portion of the fill metal layer. | 09-22-2011 |
| 20120012937 | INTERCONNECTION STRUCTURE FOR N/P METAL GATES - The disclosure relates to integrated circuit fabrication, and more particularly to an interconnection structure for N/P metal gates. An exemplary structure for an interconnection structure comprises a first gate electrode having a first portion of a first work-function metal layer under a first portion of a signal metal layer; and a second gate electrode having a second portion of the first work-function metal layer interposed between a second work-function metal layer and a second portion of the signal metal layer, wherein the second portion of the signal metal layer is over the second portion of the first work-function metal layer, wherein the second portion of the signal metal layer and the first portion of the signal metal layer are continuous, and wherein a maximum thickness of the second portion of the signal metal layer is less than a maximum thickness of the first portion of the signal metal layer. | 01-19-2012 |
| 20120074475 | METAL GATE STRUCTURE OF A SEMICONDUCTOR DEVICE - The applications discloses a semiconductor device comprising a substrate having a first active region, a second active region, and an isolation region having a first width interposed between the first and second active regions; a P-metal gate electrode over the first active region and extending over at least ⅔ of the first width of the isolation region; and an N-metal gate electrode over the second active region and extending over no more than ⅓ of the first width. The N-metal gate electrode is electrically connected to the P-metal gate electrode over the isolation region. | 03-29-2012 |
| 20120083095 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE BY THINNING HARDMASK LAYERS ON FRONTSIDE AND BACKSIDE OF SUBSTRATE - The disclosure relates to integrated circuit fabrication, and more particularly to a method for fabricating a semiconductor device. An exemplary method for fabricating the semiconductor device comprises providing a substrate; forming pad oxide layers over a frontside and a backside of the substrate; forming hardmask layers over the pad oxide layers on the frontside and the backside of the substrate; and thinning the hardmask layer over the pad oxide layer on the frontside of the substrate. | 04-05-2012 |
Hwee Hong Chew, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20110248019 | METHOD FOR TREATING HYDROCARBON FLUIDS USING PULSATING ELECTROMAGNETIC WAVE IN COMBINATION WITH INDUCTION HEATING - A method for treating hydrocarbon fluids using pulsating electromagnetic wave in combination with induction heating is provided, which comprise the steps of mounting an induction coil onto a conduit having a central axis from which the hydrocarbon fluid to be treated flows, the induction coil being coaxially disposed with the conduit and having an inner diameter which forms a predetermined gap with an outer periphery of the conduit; subjecting the hydrocarbon fluid through the conduit; and applying a time-varying frequency current to the induction coil to produce pulsating electromagnetic field and induction heating around the induction coil, such that the combined effect of the pulsating electromagnetic field and the induction heating is induced in the fluid to prevent and/or reduce build-up of or natural deposition of paraffin, asphaltene or the like contained in the fluid and reduce a viscosity of the fluid in production lines, flow transmission lines, pipelines and oil storage. | 10-13-2011 |
Hwee Seng Chew, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20080248610 | THERMAL BONDING PROCESS FOR CHIP PACKAGING - The present invention provides a thermal bonding process for chip packaging. In accordance with an aspect of the invention, there is provided an approach to solve the problems caused by the different CTEs between the die and the substrate. It discloses an improved thermal bonding process for forming pillar-shaped interconnection, which controls the thermal expansion of the semiconductor die and the substrate by applying differential heating temperature to the two, thereby minimizing the misalignment between the die and the substrate, overcoming the stresses imposed on the interconnection and allowing more reliable and accurate packaging. | 10-09-2008 |
| 20110287560 | IN-SITU MELT AND REFLOW PROCESS FOR FORMING FLIP-CHIP INTERCONNECTIONS AND SYSTEMS THEREOF - A method for fabricating a flip-chip semiconductor package. The method comprises processing a semiconductor device, for example a semiconductor chip and processing a device carrier, for example a substrate. The semiconductor device comprises bump structures formed on a surface thereof. The substrate comprises bond pads formed on a surface thereof. Processing of the semiconductor chip results in heating of the semiconductor chip to a chip process temperature. The chip process temperature melts solder portions on the bump structures Processing of the substrate results in heating of the substrate to a substrate process temperature. The method comprises spatially aligning the semiconductor chip in relation to the substrate to correspondingly align the bump structures in relation to the bump pads. The semiconductor chip is then displaced towards the substrate for abutting the bump structures of the semiconductor chip with the bond pads of the substrate to thereby form bonds therebetween. A system for performing the above method is also disclosed. | 11-24-2011 |
Hwee-Seng Jimmy Chew, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20110267789 | ETCH-BACK TYPE SEMICONDUCTOR PACKAGE, SUBSTRATE AND MANUFACTURING METHOD THEREOF - A semiconductor package, a substrate and a manufacturing method thereof are provided. The substrate comprises a conductive carrier, a first metal layer and a second metal layer. The first metal layer is formed on the conductive carrier and comprises an lead pad having an upper surface. The second metal layer is formed on the first metal layer and comprises a bond pad. The bond pad overlaps and is in contact with the upper surface of the first metal layer. The upper surface of the lead pad is partially exposed. A part of the bond pad overhang outward from the edge of the lead pad. | 11-03-2011 |
| 20120058604 | MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE CARRIER AND MANUFACTURING METHOD FOR SEMICONDUCTOR PACKAGE USING THE SAME - A conductive carrier having a first surface and a second surface is provided. The conductive trace layer is formed on the second surface of the conductive carrier. A conductive stud layer is formed on the conductive trace layer. A dielectric layer is formed on the conductive layer to encapsulate the conductive trace layer and the conductive stud layer. The conductive stud layer is exposed. A plating conductive layer is formed to envelop the conductive carrier, the dielectric layer and the exposed end of the conductive stud layer. A cavity is formed on the conductive carrier, wherein the conductive trace layer and the dielectric layer are exposed in the cavity. A surface finishing is formed on at least an exposed portion of the conductive stud layer. The plating conductive layer is removed. | 03-08-2012 |
Johnny Kok Wai Chew, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20090167466 | TUNABLE HIGH QUALITY FACTOR INDUCTOR - An inductor circuit with high quality (Q) factor includes a primary inductor and a compensation sub-circuit. The compensation sub-circuit is electrically isolated from the primary inductor. The compensation sub-circuit is magnetically coupled with the primary inductor to compensate the loss in the primary inductor. | 07-02-2009 |
| 20100295153 | INTEGRATED CIRCUIT SYSTEM WITH HIERARCHICAL CAPACITOR AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit system includes: providing a substrate including front-end-of-line circuitry; forming a first group of metal layers including a first finger and a second finger over the substrate utilizing a first design rule, the first group of metal layers being formed without a finger via; forming a second group of metal layers including a first finger, a second finger, and a finger via over the first group of metal layers utilizing a second design rule that is larger than the first design rule; and interconnecting the first group of metal layers with the second group of metal layers to form a capacitor. | 11-25-2010 |
| 20120007214 | INTEGRATED CIRCUIT SYSTEM WITH HIERARCHICAL CAPACITOR AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit system includes: providing a substrate including front-end-of-line circuitry; forming a first group of metal layers including a first finger and a second finger over the substrate utilizing a first design rule, the first group of metal layers being formed without a finger via; forming a second group of metal layers including a first finger, a second finger, and a finger via over the first group of metal layers utilizing a second design rule that is larger than the first design rule; and interconnecting the first group of metal layers, including interconnecting a first cluster adjacent to a second cluster, to form a capacitor. | 01-12-2012 |
Khien Meow David Chew, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20090251541 | Intelligent Vehicle Access Control System - An apparatus for the automatic inspection of a motor vehicle has an identification and psychological profiling zone, an automatic inspection zone and a manual inspection zone. A biometric and heart rate detection station and an attached console are located in zone one. Undercarriage scanning equipment and an explosives detection portal are located in zone two. The apparatus also has one or more fixed cameras, an alarm or other alerting mechanisms and a physical barrier. A vehicle detection mechanism detects the entry of a vehicle into zone two and captures an image of the vehicle number plate. When the captured biometric data and number plate data indicate that the driver is authorized to drive the particular vehicle into the secured zone, and if no abnormalities or foreign objects in the undercarriage image are detected, the driver is allowed to proceed. | 10-08-2009 |
| 20110063445 | RUNWAY SURVEILLANCE SYSTEM AND METHOD - A surveillance system and method for detecting a foreign object, debris, or damage (FOD) on a runway. The system comprises one or more cameras for capturing images of the runway; and an image processing system for detecting the FOD on the runway based on adaptive image processing of the images captured by the cameras; wherein the surveillance system is adaptively operable for FOD detection under both day and night ambient light conditions without assisted illumination such as infrared or laser illuminators. | 03-17-2011 |
Kok Wai Chew, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20080284552 | INTEGRATED TRANSFORMER AND METHOD OF FABRICATION THEREOF - An integrated transformer structure includes a first coil element associated with a transverse axis, the first coil element having at least one turn. The first coil element includes a first portion provided on a first lateral level, and a second portion provided on a second lateral level. The first and second lateral levels being mutually spaced apart along said transverse axis. The first and second portions being displaced laterally from said axis by different respective distances. At least one crossover portion of the first coil element, in which the first coil element being configured to provide a conducting path through at least a portion of the first portion of the first coil element to the crossover portion, through the crossover portion and subsequently through at least a portion of the second portion of the first coil element, in which any change of flow direction along said path is less than 90° in a lateral direction. | 11-20-2008 |
| 20080284553 | TRANSFORMER WITH EFFECTIVE HIGH TURN RATIO - Embodiments of the invention provide a transformer comprising: a first coil element having a transverse axis along a transverse direction, the first coil element having p turns where p is greater than or equal to 1; and a second coil element having a transverse axis generally parallel to the transverse axis of the first coil element, the second coil element having n turns, where n is greater than or equal to 5 p; wherein the first and second coil elements are arranged to provide electromagnetic coupling between the coil elements along a portion of a length of the second coil element in both a transverse direction parallel to the transverse axes and a lateral direction, wherein the lateral direction is a direction normal to the transverse axes. | 11-20-2008 |
| 20100120244 | INTEGRATED CIRCUIT SHIELD STRUCTURE AND METHOD OF FABRICATION THEREOF - A method of forming an integrated circuit is disclosed. The method includes providing a substrate and forming on the substrate a shield structure comprising a shield member and a ground strap. The shield member comprises a non-metallic portion, and the ground strap comprises a metallic portion. | 05-13-2010 |
Lay Leng Chew, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20110184340 | FLOW SYSTEM OF A DIALYSIS DEVICE AND A PORTABLE DIALYSIS DEVICE - There is provided a flow system of a dialysis device including a dialysate conduit which is capable of being in fluid communication with the peritoneal cavity of a patient's body and of being in fluid communication with a flow path, the flow path allowing dialysate to flow from a patient's body to a sorbent capable of removing contaminants within the dialysate in an outflow mode and in an inflow mode returning the dialysate substantially free of contaminants to the patient's body. The device also includes a pump for moving the dialysate along the flow path in both the outflow mode and inflow mode and a plurality of valves disposed along the flow path. There is also provided a portable dialysis device. | 07-28-2011 |
Lea-Li Chew, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20110108857 | HOUSING FOR HIGH-POWER LEDS - The present invention relates to a housing for radiation-emitting or radiation-receiving optoelectronic components, such as LEDs, and to a method for producing said housing. The housing comprises a composite assembly comprising a base pan ( | 05-12-2011 |
Lee Huang Chew, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20110121295 | Structure for Bumped Wafer Test - A semiconductor device includes a substrate having a first conductive layer disposed on a top surface of the substrate. A first insulation layer is formed over the substrate and contacts a sidewall of the first conductive layer. A second conductive layer is formed over the first insulation layer. The second conductive layer includes a first portion disposed over the first conductive layer and a second portion that extends beyond an end of the first conductive layer. A second insulation layer is formed over the second conductive layer. A first opening in the second insulation layer exposes the first portion of the second conductive layer. A second opening in the second insulation layer away from the first opening exposes the second portion of the second conductive layer. The second insulation layer is maintained around the first opening. A conductive bump is formed over the first portion of the second conductive layer. | 05-26-2011 |
Leep Foong Chew, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20090201652 | CIRCUIT WITH AN INTEGRATED SHIELD AND HEARING AID - A flexible printed circuit board having an integrated shield, a circuit based thereon, and a hearing aid having the circuit, are provided. The flexible printed circuit board includes a mount layer, a metallization layer and a shielding layer for shielding against electromagnetic interference influences. It can be bent about a respective bending axis in at least two different bending areas, in which the two bending axes are at an angle of at least 45 degrees to one another. The shielding layer extends at least over the two bending areas. A circuit based on the printed circuit board can be fitted with electronic components in at least one circuit area and can be bent in the bending areas in such a way that the circuit area is shielded by the shielding layer against electromagnetic interference influences in at least three spatial directions which are substantially at right angles to one another. | 08-13-2009 |
| 20090257608 | HEARING AID WITH A DROP SAFEGUARD - A hearing aid with a drop safeguard has an accelerometer, an electrical circuit, and a memory. The accelerometer generates an electrical signal in dependence on an acceleration of the hearing aid. The signal is transmitted to the electrical circuit which uses this to determine a jerky acceleration of the hearing aid. The electrical circuit saves the respectively current settings of the hearing aid to the memory in the case of a jerky acceleration of the hearing aid. After the hearing aid is dropped, the settings can be reconstructed from the memory so that as a result this prevents the settings of the hearing aid from being changed. | 10-15-2009 |
| 20100054514 | Electrical Circuit, Electrical Small Appliance, in Particular a Hearing Aid, Having the Electrical Circuit, and Use of the Electrical Circuit for Producing the Electrical Small Appliance - An electrical circuit has a printed circuit board which is lengthened at the side in the form of at least one longitudinal contact projection having at least one electrical conductor track and a solder point disposed at the end of the conductor track. Because of its mechanical flexibility, the contact projection allows flexible contact to be made with other electronic components, with little effort. An electrical circuit such as this is particularly highly suitable for electrical small appliances, in particular for a hearing aid. | 03-04-2010 |
| 20100098279 | Hearing apparatus comprising a membrane on the battery compartment interior - A hearing apparatus with a housing including a housing interior is provided. Signal processing components are accommodated in the housing interior. The hearing apparatus includes a battery compartment fastened in or on the housing, which has a battery compartment interior into which a battery is inserted for supplying power to the hearing apparatus. Further, a membrane is provided, which separates the housing interior from the battery compartment interior. The membrane is fastened to the housing or to the battery compartment. | 04-22-2010 |
| 20100202646 | HEARING DEVICE WITH SUPPORTING HOOK RECOGNITION - The fitting of hearing aids and other hearing devices is intended to be made more comfortable. For this, provision is made for a hearing device with a housing which contains a signal processing unit and has a sound outlet. A supporting hook for attaching the hearing device to an ear or a head can be fixed on the sound outlet of the housing such that sound emanating from the sound outlet is guided through the supporting hook. A sensor for detecting the type of supporting hook is arranged in or on the housing. The sensor controls the signal processing unit as a function of the detected type of supporting hook. Thus, the user can for example use different types of supporting hooks without having to decide on a type of supporting hook during the first fitting. Moreover, the degree of mass production of the hearing aid can be further increased by the automatic recognition of the type of supporting hook. | 08-12-2010 |
Pamela Chew, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20080263920 | Connecting devices displaying indicia - Various embodiments are directed to connecting devices that display indicia. | 10-30-2008 |
Paul T.k. Chew, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20100076419 | Contact Probe for the Delivery of Laser Energy - Systems, devices, and methods for treating a glaucomatous eye are provided. An amount of pulsed laser energy is delivered to the pars plana of the eye by a hand-holdable device which comprises a hand-holdable elongate member and a contact member disposed on an end of the elongate member. A contact surface of the contact member is placed in direct contact with the eye so that a reference edge of the contact member aligns with the limbus and a treatment axis defined by the elongate member is angularly offset from the optical axis of the eye. The amount of pulsed laser energy delivered is insufficient to effect therapeutic photocoagulation but is sufficient to increase uveoscleral outflow so as to maintain a reduction from pre-laser treatment intraocular pressure. Amounts of pulsed laser energy will be transmitted to a circumferential series of tissue regions of the eye. | 03-25-2010 |
Seow Ting Chew, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20090236888 | Portable,Inflatable and Self-Adjusting Cushion for Upper and Lower Back Support - This present invention relates to not only providing the conventional support for upper and lower back under normal circumstances of a proper sitting position, it even provides a self-adjusting experience and improved degree of lumbar support whenever a relaxed lean-backward seating posture is taken. This Self-Adjusting Cushion has executed without any compromise of losing the expected level of contoured support for the spine to be in proper alignment. Thus relieving and alleviating any possible fatigue or pain due to improper sitting position. | 09-24-2009 |
Shu Wen Chew, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20120134873 | METHOD FOR FABRICATING A GOLD NANOPARTICLE - The present invention is directed to a method for fabricating a gold nanoparticle, the method comprising the steps of contacting a gold ion with a protein, wherein the protein has an inner cavity that can accommodate the gold ion, separating the protein with the encapsulated gold ion(s) from non-encapsulated gold ions, contacting the protein-encapsulated gold ion with a first reductant to reduce the gold ion and form a gold nanocluster seed in the inner cavity of the protein, wherein the first reductant is a strong reductant, and contacting the gold nanocluster seed in the inner cavity of the protein with a second reductant to mineralize and grow the gold nanoparticle. | 05-31-2012 |
Sing-Yian Chew, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20100055154 | COAXIAL ELECTROSPUN FIBERS AND STRUCTURES AND METHODS OF FORMING THE SAME - Nanofibers and microfibers having a core and a polymer shell surrounding the core are provided. The shell includes a plurality of channels that extend from an outer shell surface to the core, and one or more agents, such as pharmacological materials, proteins, viruses, plasmid DNA, bacterial cells, drug-loaded nanoparticles, are encapsulated within the core. The one or more agents discharge from the core through the channels at a controlled rate. The channels are formed by porogen material within the polymer shell. | 03-04-2010 |
Sok Hwang Chew, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20110310173 | PRINTER BACKBONE WITH INTEGRATED CARRIAGE ROD - A backbone for a printer is formed from a single piece of material. The single piece of material includes an integrated carriage rod. When a carriage assembly is mounted on the integrated carriage rod, the carriage assembly is enabled to slide across the integrated carriage rod into position for printing. | 12-22-2011 |
Tham Heang Chew, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20090310322 | Semiconductor Package - A substrate includes a number of protruding contact elements. An electrical circuit with electrical contact elements is provided on the substrate. A layer of substrate adhesive is provided on the substrate, the substrate adhesive being in contact with the substrate, with the electrical circuit and with the protruding contact elements. Wiring elements are connected between the protruding contact elements and the electrical contact elements. | 12-17-2009 |
Wei Seng Chew, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20120022821 | INTEGRATED CIRCUIT THAT TRANSFERS MISSION MODE SIGNAL IN DEBUG MODE - A system including an integrated circuit configured to transfer a mission mode signal between a mission mode circuit on the integrated circuit and a first input/output pin on the integrated circuit in mission mode and to transfer a development mode signal between a development mode circuit on the integrated circuit and the first input/output pin in debug mode. The integrated circuit is configured to transfer the mission mode signal between the mission mode circuit and a second input/output pin on the integrated circuit in debug mode. | 01-26-2012 |