Chester E.

Chester E. Balut, Atkinson, NH US

Patent application number	Description	Published
20100112820	METHOD FOR MEMBRANE PROTECTION DURING REACTIVE ION/PLASMA ETCHING PROCESSING FOR VIA OR CAVITY FORMATION IN SEMICONDUCTOR MANUFACTURE - A method for protecting a chuck membrane in a reactive ion etcher during plasma processing is described. The method utilizes a photoresist as a protective layer. Suitable photoresists can be used in this invention to not only image a semiconductor substrate to protect areas where vias and/or cavities are not desired during plasma processing but also to protect the chuck membrane(s) of the reactive ion etcher from being damaged and/or contaminated during plasma processing. Both negative-working and positive-working photoresists can be used.	05-06-2010

Patent application number	Description	Published
20110202678	Delegated Resource Use in a Content Based Routing Environment - A router or router process directs computer network traffic by, upon receipt of an access request to a network resource, determining that the request contains at least one routing cookie; determining a cookie scope of the routing cookie; responsive to the cookie scope being unequivalent to a root value, designating the at least one routing cookie as a delegate cookie; adding a path value associated the delegate cookie to a session lookup table entry for a user associated with the network traffic; and subsequently, using the lookup table entry to determine a destination address for redirecting computer network traffic for the user having the delegate cookie to a delegated resource located in the network at the path.	08-18-2011

Patent application number	Description	Published
20110180521	DEPTH AND BREAKTHROUGH DETECTION FOR LASER MACHINING - A system comprises a working laser beam, a sensing laser beam, first and second optical elements, an optical sensor, an aperture and a controller. The first optical element generates a coaxial beam from the working laser beam and the sensing laser beam. The second optical element focuses the coaxial beam onto a workpiece, such that the working laser beam machines the workpiece and the sensing laser beam reflects from the workpiece. The optical sensor senses an intensity of the reflected sensing beam. The aperture determines a focus position by translating along the reflected sensing beam, such that the reflected intensity is maximized. The controller determining a machining parameter of the working laser beam, based on the focus position.	07-28-2011