| Patent application number | Description | Published |
|---|
| 20100243623 | METHOD OF CUTTING SUBSTRATE - A substrate cutting method includes the steps of aligning a panel including two or more substrates, along a cutting line, forming groove lines in the respective substrates of the panel along the cutting line, by oscillating respective ultraviolet UV laser beams along the cutting line, and cutting the panel along the groove lines, by applying force to the panel. | 09-30-2010 |
| 20100267307 | SEALING APPARATUS AND METHOD OF MANUFACTURING FLAT DISPLAY DEVICE USING THE SAME - A sealing apparatus and a method of manufacturing a flat display device using the sealing apparatus. The sealing apparatus to attach a first substrate and a second substrate to each other using an attachment member disposed between the first and second substrates, the sealing apparatus comprises a stage on which the first substrate is seated, a halogen lamp irradiating light, and a reflector reflecting light irradiated from the halogen lamp to the attachment member. | 10-21-2010 |
| 20100282724 | Laser irradiation apparatus and method of manufacturing display device using the same - A laser irradiation apparatus for bonding a first substrate and a second substrate of a display device by melting a plurality of bonding members disposed between the first and second substrates to define cells when the display device is manufactured, the display device including light emitting elements disposed on a surface of the first substrate such that the bonding members respectively encompass lateral regions of the light emitting elements, the laser irradiation apparatus including a stage on which the first substrate is mounted, a laser oscillation member configured to irradiate a laser beam that melts the bonding members disposed between the first substrate and the second substrate, and a scanner configured to irradiate the laser beam incident from the laser oscillation member onto the bonding members, the scanner being configured to sequentially irradiate the laser beam on portions of the bonding members. | 11-11-2010 |
| 20110049764 | Substrate cutting apparatus and method for cutting substrate using the same - A substrate cutting apparatus includes a stage configured to support a substrate, a first laser generator configured to emit a first laser beam toward the substrate, the first laser beam being a short-pulse laser beam, and a beam swing unit disposed on a beam path of the first laser beam, the beam swing unit being configured to swing the first laser beam in a predetermined light irradiating section on the substrate, the light irradiating section on the substrate including at least one of a curved line section and a straight line section. | 03-03-2011 |
| 20110121714 | Display device and method for manufacturing display device - A display device including a first substrate; a display unit on the first substrate, the display unit displaying an image; and a second substrate facing the first substrate with the display unit interposed therebetween, wherein the first substrate and the second substrate are optical contact bonded to each other. | 05-26-2011 |
| 20110129595 | Deposition source, deposition apparatus having the same, and method of forming thin film - A deposition source includes a first deposition source section, the first deposition source section being configured to store a deposition material, a second deposition source section, the second deposition source section being separate from the first deposition source section and being configured to store the deposition material, the first and second deposition source sections being configured to alternately supply the deposition material while heating or cooling the deposition material, a feed section configured to receive evaporated deposition material from the first and second deposition source sections, and a nozzle section configured to receive the deposition material from the feed section. | 06-02-2011 |
| 20110129779 | LASER INDUCED THERMAL IMAGING METHOD, METHOD OF PATTERNING ORGANIC LAYER USING THE SAME AND METHOD OF FABRICATING ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE USING THE SAME - A laser induced thermal imaging (LITI) method, a method of patterning an organic layer using the same and a method of manufacturing an organic light emitting diode (OLED) display device using the same. The LITI method includes preparing a substrate including a transfer layer, preparing a donor substrate including a base film and a light-to-heat conversion layer disposed on the base film, aligning the substrate with the donor substrate, and irradiating laser to the base layer of the donor substrate. Here, the laser is irradiated to the base layer in a region excluding a region corresponding to a pattern to be formed on the substrate. Thus, according to the method, regardless of the size of the pattern to be formed and the size of the laser beam, stitching mura can be prevented. | 06-02-2011 |
| 20110139365 | MASK FOR EVAPORATION, AND METHOD AND APPARATUS FOR MANUFACTURING THE SAME - Provided is a mask for an evaporation apparatus, which includes a first division mask and a second division mask. The first and second division masks are directly bonded to each other by welding, thereby forming welding portion between the first and the second division masks. A method and apparatus for manufacturing a mask for evaporation are also provided. The division masks according to the embodiment do not use subframes, and are directly bonded to one another by welding, so that a shadow effect does not occur. The apparatus for manufacturing a mask for evaporation includes a work stage, a clamp fixing a first division mask and a second division mask to the work stage, and a laser welding part welding the first division mask to the second division mask. The apparatus may further include a first roller leading the laser welding part and a second roller following the laser welding part. | 06-16-2011 |
| 20110146575 | EVAPORATION SOURCE AND DEPOSITION APPARATUS HAVING THE SAME - An evaporation source is disclosed. In one embodiment, the evaporation source includes: i) a crucible being open on one side thereof and configured to store a deposition material and ii) a nozzle section located on the open side of the crucible and comprising a plurality of nozzles, wherein each of the nozzles has a sidewall configured to spray the deposition material therethrough, wherein the side wall has an inclined portion. The evaporation source also includes i) a heater configured to heat the crucible and ii) a housing configured to accommodate the crucible, the nozzle section, and the heater, wherein the nozzle section has a maximum spray angle less than about 60°. | 06-23-2011 |
| 20110146579 | LINEAR EVAPORATION SOURCE AND DEPOSITION APPARATUS HAVING THE SAME - A linear evaporation source and a deposition apparatus having the same are disclosed. In one embodiment ,the linear evaporation source includes i) a crucible being open on one side thereof and configured to store a deposition material and ii) a plurality of partitions dividing an internal space of the crucible, wherein each of the partitions has at least one opening in a lower portion thereof. The source further includes i) a nozzle section located on the open side of the crucible and comprising a plurality of nozzles, ii) a heater configured to heat the crucible and iii) a housing configured to accommodate to the crucible, the nozzle section, and the heater. | 06-23-2011 |
| 20110155705 | Laser cutting method and method of manufacturing organic light-emitting device - A laser cutting method includes providing a multi-layered substrate, such that the multi-layered substrate includes a circuit pattern between stacked first and second substrates, and removing a part of the second substrate by irradiating a laser beam on the second substrate, the laser beam being irradiated at an oblique angle with respect to an upper surface of the second substrate. | 06-30-2011 |
| 20110163662 | Organic light-emitting display device and method of manufacturing the same - An organic light-emitting display device includes a first substrate including an organic light-emitting diode and a plurality of electrodes connected to the organic light-emitting diode, the plurality of electrodes extending on the first substrate along a first direction toward an edge of the first substrate, a second substrate connected to the first substrate, the second substrate being shorter than the first substrate and exposing a portion of the plurality of electrodes on the first substrate, a sealing material disposed between the first substrate and the second substrate to surround the organic light-emitting diode, and an electrode protecting layer partially covering the exposed portion of the plurality of electrodes on the first substrate, a first side of the electrode protecting layer being between the first substrate and the second substrate, and a second side of the electrode protecting layer protruding beyond the second substrate. | 07-07-2011 |
