Patent application number | Description | Published |
20120138974 | LIGHT EMITTING DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF - There is provided a light emitting device package including: a substrate having a circuit pattern formed on at least one surface thereof and including an opening; a wavelength conversion layer formed by filling at least a portion of the opening with a wavelength conversion material; and at least one light emitting device disposed on a surface of the wavelength conversion layer and electrically connected to the circuit pattern. | 06-07-2012 |
20120138989 | LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME - A light emitting device package includes a plurality of lead frames separated from one another; at least one light emitting device provided with a wire bonding pad attached to a lower surface thereof opposite an upper light emission surface thereof, and mounted on the lead frames such that the wire bonding pad is positioned in a space between the lead frames; a bonding wire electrically connecting the wire bonding pad to the lead frame through the space between the lead frames; and a mold part encapsulating the lead frames, the light emitting device and the bonding wire, and having a reflection groove formed in an upper surface thereof to expose the light emission surface therethrough and a pad groove formed in a bottom surface thereof to expose a portion of the lead frame so as to form a solder pad thereon. | 06-07-2012 |
20120140210 | TRAY, TESTING APPARATUS AND TESTING METHOD USING THE SAME - A tray, a testing apparatus and a testing method using the same are disclosed. The testing apparatus includes a tray having a plurality of light sources received therein, the plurality of light sources outputting light when power is applied thereto; a plurality of optical receiver units arranged to correspond to the plurality of light sources and receiving the light outputted from each of the plurality of light sources; a plurality of probe units arranged to correspond to the plurality of light sources and applying power to each of the plurality of light sources; a power supply control unit selectively controlling power applied to the plurality of probe units; and an optical properties analyzing unit analyzing properties of optical signals from the light received by the optical receiver units. | 06-07-2012 |
20120161181 | LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME - Provided is a light emitting device package including: a plurality of lead frames disposed to be separated from one another; at least one light emitting device mounted on the lead frames and electrically connected to the lead frames through a bonding wire provided on a wire bonding pad, the wire bonding pad being disposed on the same surface as a light emission surface provided as an upper surface of the light emitting device; a body part formed to encapsulate and support the wire bonding pad, the bonding wire, the light emitting device and the lead frames, and having a reflective groove formed in an upper surface thereof to expose the light emission surface to the outside therethrough; and a lens part disposed on the body part, to cover the light emitting device. | 06-28-2012 |
20120205696 | LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THEREOF - There are provided a light emitting device package and a method of manufacturing thereof. The light emitting device package including a first lead frame including amounting area and a heat radiating area surrounding the mounting area, the mounting area being protruded upwardly so as to be located higher than the heat radiating area; a second lead frame disposed to be spaced apart from the first lead frame; at least one light emitting device disposed on the mounting area of the first lead frame; a molding part formed so as to fix the first and second lead frame leads thereto; and a lens part disposed over the at least one light emitting device and the molding part, and the method of manufacturing the light emitting device package are provided. | 08-16-2012 |
20120252145 | METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE AND MASK FOR APPLICATION OF PASTE USED THEREFOR - Provided are a mask for an application of paste and a method of manufacturing a semiconductor light emitting device by using the same. The method includes preparing a light emitting structure including first and second conductive semiconductor layers and an active layer disposed therebetween, which has at least one electrode formed on a surface of the light emitting structure; disposing a mask having an open part exposing a portion of the surface of the light emitting structure therethrough and a recess part corresponding the electrode in a region thereof on a surface of the light emitting structure; and applying wavelength conversion material-containing paste to the surface of the light emitting structure through the open part. | 10-04-2012 |
20120268916 | LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME - There are provided a light emitting device package and a method of manufacturing the same. The light emitting device package includes a light emitting device including electrode pads; a body part supporting the light emitting device, including a reflective groove exposing an upper surface of the light emitting device in an upper surface thereof, and exposing a lower surface of the light emitting device through a lower surface thereof; and a lens part provided on the body part and covering the light emitting device. | 10-25-2012 |
20130049239 | LENS FABRICATION APPARATUS AND LENS FABRICATION METHOD USING THE SAME - A lens fabrication apparatus includes: a lens mold having a connection portion formed on one side thereof and disposed on a light emission surface of a light emitting unit; and a vacuum forming unit discharging air from within the lens mold to the outside through the connection portion or injecting a material into the lens mold through the connection portion. | 02-28-2013 |
20130051061 | ILLUMINATION DEVICE - An illumination device includes: a light source including a substrate and a light emitting device mounted on the substrate; a light guide unit mounted on the substrate to cover the light emitting device and guiding light from the light emitting device to an upper side of the substrate to allow the light to be emitted from the upper side; and a main body unit having the light source fastened thereto and including an external connection unit connected to an external power source to supply power to the light source. | 02-28-2013 |
20140045286 | LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME - Provided is a light emitting device package including: a plurality of lead frames disposed to be separated from one another; at least one light emitting device mounted on the lead frames and electrically connected to the lead frames through a bonding wire provided on a wire bonding pad, the wire bonding pad being disposed on the same surface as a light emission surface provided as an upper surface of the light emitting device; a body part formed to encapsulate and support the wire bonding pad, the bonding wire, the light emitting device and the lead frames, and having a reflective groove formed in an upper surface thereof to expose the light emission surface to the outside therethrough; and a lens part disposed on the body part, to cover the light emitting device. | 02-13-2014 |
20140291705 | PHOSPHOR FILM, METHOD OF MANUFACTURING THE SAME, COATING METHOD OF PHOSPHOR LAYER, METHOD OF MANUFACTURING LED PACKAGE AND LED PACKAGE MANUFACTURED THEREBY - There are provided a phosphor film, a method of manufacturing the same, and a method of coating an LED chip with a phosphor layer. The phosphor film includes: a base film; a phosphor layer formed on the base film and obtained by mixing phosphor particles in a partially cured resin material; and a cover film formed on the phosphor layer to protect the phosphor layer. | 10-02-2014 |
Patent application number | Description | Published |
20120241797 | LIGHT EMITTING DIODE, MANUFACTURING METHOD THEREOF, LIGHT EMITTING DIODE MODULE, AND MANUFACTURING METHOD THEREOF - A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips. | 09-27-2012 |
20130032843 | LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF - A light emitting diode (LED) package and a manufacturing method thereof are provided. The LED package includes a substrate including a circuit layer, an LED mounted on the substrate, and a plurality of protruded reflection units disposed in a region excluding an LED mounting region on the substrate and configured to reflect light generated from the LED. | 02-07-2013 |
20140106480 | METHOD AND APPARATUS FOR DEPOSITING PHOSPHOR ON SEMICONDUCTOR-LIGHT EMITTING DEVICE - A method and apparatus for depositing a phosphor using transfer molding. The method includes: forming a plurality of light-emitting devices on a wafer and rearranging the light-emitting devices on a carrier substrate according to luminance characteristics of the plurality of light-emitting devices by examining the luminance characteristics of the plurality of light-emitting devices; depositing the phosphor on the rearranged light-emitting devices using transfer molding; and separating the light-emitting devices on the carrier substrate. | 04-17-2014 |
20140299906 | LIGHT EMITTING DIODE, MANUFACTURING METHOD THEREOF, LIGHT EMITTING DIODE MODULE, AND MANUFACTURING METHOD THEREOF - A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips. | 10-09-2014 |
20140338593 | METHOD AND APPARATUS FOR MANUFACTURING WHITE LIGHT-EMITTING DEVICE - Methods and apparatus for manufacturing a semiconductor light-emitting device that emits white light by forming a phosphor layer on an emission surface of the semiconductor light-emitting device at a wafer-level. The method includes: forming a plurality of light-emitting devices on a wafer; thinning the wafer, on which the plurality of light-emitting devices are formed; disposing the thinned wafer on a carrier film; and forming a phosphor layer on an emission surface of the plurality of light-emitting devices on the wafer. | 11-20-2014 |