Inventors list |
Assignees list |
Classification tree browser |
Top 100 Inventors |
Top 100 Assignees |
Cheng-Yi
Cheng-Yi Chang, Chung Ho City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090151899 | Cooling apparatus - A cooling apparatus includes a base, a plurality of first heat pipes, a plurality of second heat pipes, a plurality of first heat conducting columns and a plurality of second heat conducting columns. Each of the first heat pipes and the second heat pipes respectively has a heat-absorbing terminal. The heat-absorbing terminals of the first heat pipes are disposed on the base spaced at intervals. The heat-absorbing terminals of the second heat pipes are stacked above the heat-absorbing terminals of the first heat pipes spaced at intervals. Each of the first heat conducting columns is installed between the heat-absorbing terminals of the two adjacent first heat pipes. Each of the second heat conducting columns is installed between the heat-absorbing terminals of the two adjacent second heat pipes. Thereby, the heat conducting area is increased within the base, and the cooling efficiency of the cooling apparatus is enhanced. | 06-18-2009 |
| 20090173474 | HEAT DISSIPATING APPARATUS EXTENDED LATERALLY FROM HEAT PIPE - A heat dissipating apparatus includes a thermal conducting base and heat pipes connected to the thermal conducting base. Each heat pipe includes a heated section and a heat dissipating section. The portion connected to the thermal conducting base is the heated section, and the heat dissipating section is extended outward from the thermal conducting base. In the heat pipes, at least one heat dissipating section of the heat pipe is extended outward from a lateral side of the thermal conducting base, and the heat dissipating section of the heat pipe is situated at a position higher than the heated section, and fins are disposed on the heat dissipating section of the heat pipe. Therefore, the heat pipe guides the heat absorbed by thermal conducting base to a lateral side to dissipate heat from a nearby heat source. | 07-09-2009 |
Cheng-Yi Chang, New Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110266589 | Light Emitting Diode Package Structure and Manufacturing Method Therefor - A light emitting diode (LED) package and a manufacturing method therefor are disclosed. In one aspect, a manufacturing method of a light emitting diode package may: heat a first light transmission insulation material to cause the first light transmission insulation material to become a sticky member; connect a lead frame to the sticky member; perform a chip-bonding step that bonds at least one light-emitting diode chip on the sticky member using a light transmission glue; encapsulate the at least one light-emitting diode chip with a second light transmission insulation material; and perform a drying step that forms the sticky member and the second light transmission insulation material into shape. | 11-03-2011 |
Cheng-Yi Chang, Hsinchu City TW
| Patent application number | Description | Published |
|---|---|---|
| 20080314629 | MULTI-LAYER SUBSTRATE AND MANUFACTURING METHOD THEREOF - Disclosed are a multi-layer substrate and a manufacturing method of the multi-layer substrate. By employing a carrier to alternately form dielectric layers and metal structure layers thereon. Each dielectric layer adheres with the adjacent dielectric layer to embed the metal structure layers in the dielectric layers corresponding thereto. Comparing with prior arts, which have to use prepregs when hot pressing and adhering different layers of different materials, the present invention takes fewer processes, thus, fewer kinds of materials without using prepregs. Therefore, the present invention can promote the entire quality and yield of manufacturing the multi-layer substrate to satisfy mechanical characteristic matching of the multi-layer substrate and to reduce cost of the whole manufacturing process. Significantly, the multi-layer substrate having thin dielectric layers according to the present invention can satisfy the concern of impedance matching therefore, and can reduce crosstalk influence to keep good signal integrity therein. | 12-25-2008 |
| 20110198782 | MULTI-LAYER SUBSTRATE AND MANUFACTURING METHOD THEREOF - Disclosed are a multi-layer substrate and a manufacturing method of the multi-layer substrate. By employing a carrier to alternately form dielectric layers and metal structure layers thereon. Each dielectric layer adheres with the adjacent dielectric layer to embed the metal structure layers in the dielectric layers corresponding thereto. Comparing with prior arts, which have to use prepregs when hot pressing and adhering different layers of different materials, the present invention takes fewer processes, thus, fewer kinds of materials without using prepregs. Therefore, the present invention can promote the entire quality and yield of manufacturing the multi-layer substrate to satisfy mechanical characteristic matching of the multi-layer substrate and to reduce cost of the whole manufacturing process. Significantly, the multi-layer substrate having thin dielectric layers according to the present invention can satisfy the concern of impedance matching therefore, and can reduce crosstalk influence to keep good signal integrity therein. | 08-18-2011 |
Cheng-Yi Chang, Taipei Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20100123157 | CIRCUIT BOARD FOR LED - An LED is bonded to a circuit board. The circuit board comprises a chip mounting area, a bonding pad, and a connecting portion. The LED is mounted on the chip mounting area with an adhesive, and the bonding pad is connected with an electrode of the LED. Moreover, the connecting portion is positioned between the chip mounting area and the bonding pad. One side of the connecting portion is connected with the chip mounting area and another side is connected with the bonding pad. With a hollow portion of the connecting portion, the adhesive will be prevented from flowing to the bonding pad. | 05-20-2010 |
| 20110175135 | Circuit Board For LED - A submount comprising a chip mounting area, a first bonding pad and a connecting portion is provided. An LED chip is mounted on the chip mounting area. The first bonding pad is electrically connected to an electrode of the LED chip. The connecting portion has a first hollow portion and is disposed between the chip mounting area and the first bonding pad. The first hollow portion is located between the chip mounting area and the first bonding pad. The first hollow portion is located in a central region of the connecting portion. | 07-21-2011 |
Cheng-Yi Cheng, Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090100287 | Monitoring Apparatus and a Monitoring Method Thereof - A monitoring apparatus and a monitoring method thereof are disclosed. The monitoring apparatus is used to monitor a computer. The monitoring apparatus comprises a control unit, and a first non-volatile memory unit. If the computer has an abnormal operation before loading an operating system, the control unit is used to store an error code according to the abnormal operation in the first non-volatile memory unit and execute a recovery process according to the error code. | 04-16-2009 |
Cheng-Yi Chou, Yunlin County TW
| Patent application number | Description | Published |
|---|---|---|
| 20100277453 | METHOD OF DRIVING ELECTRONIC PAPER - A method of driving an electronic paper solving an image sticking problem is provided. First, a frame writing process is executed, wherein a turn-on voltage is supplied to scan lines to enable transistors, and a frame data voltage is supplied to display units through data lines to write a frame. Then, a frame holding process is executed, wherein a turn-off voltage and an auxiliary data voltage are respectively supplied to the scan lines and the data lines to disable the transistors, and a first common voltage is provided by a common electrode layer. During the frame holding process, the first common voltage and the frame data voltage are applied to hold the frame, the turn-off voltage, the auxiliary data voltage, and the first common voltage are fixed voltages, and the auxiliary data voltage is substantially equal to the first common voltage and greater than the turn-off voltage. | 11-04-2010 |
Cheng-Yi Chou, Yun Lin County TW
| Patent application number | Description | Published |
|---|---|---|
| 20090211819 | TOUCH PANEL - A touch panel includes a first and a second transparent substrates, a first and a second signal lines, a first polymeric conductive film, and a first and a second non-polymeric conductive films. The first signal line is formed on the first transparent substrate, the first polymeric conductive film is formed on the first transparent substrate, and the first non-polymeric conductive film is formed on the first polymeric conductive film. The second signal line is provided on the second transparent substrate, and the second non-polymeric conductive film is provided on the second transparent substrate. | 08-27-2009 |
Cheng-Yi Lee, Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100140318 | STAPLER - A stapler includes a main body, a light-emitting module, and an optical module. The main body has a stapling portion. The light-emitting module is disposed in the main body. The optical module faces the light-emitting module. Light emitted from the light-emitting module is converted into a light spot with a linear shape by the optical module to mark a stapling position of the stapling portion. | 06-10-2010 |
| 20110100726 | LUGGAGE CASE ACCESSORY - This invention provides a luggage case accessory for measuring weight of a luggage case. In the invention, the luggage case accessory includes a main body, a weight sensing unit, a control unit, and an output unit. The main body has an embedding structure for being detachably embedded with a handle. The weight sensing unit is disposed in the main body for sensing weight borne by the handle to output a weight signal. The control unit is coupled with the weight sensing unit for receiving the weight signal and outputting a control signal according to the weight signal. The output unit is coupled with the control unit for receiving the control signal and outputting a weight state of the luggage case according to the control signal. | 05-05-2011 |
Cheng-Yi Li, Chupei TW
| Patent application number | Description | Published |
|---|---|---|
| 20120078551 | Battery Detector for Portable Electronic Device and Method Thereof - Various embodiments of a battery detector are provided. In one aspect, a battery detector of a portable electronic device is applied to a battery module without an identification (ID) terminal. When the portable electronic device receives a direct current (DC) voltage provided by an external transformer to conduct a startup procedure, the battery detector detects whether the battery module is connected to the portable electronic device or not, and prevents the portable electronic device from conducting erroneous operations. | 03-29-2012 |
Cheng-Yi Lin, Taichung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100297569 | Dental Brace with Brackets Having a Latch Type Sliding Cover for Positioning Arch Wire - A dental brace includes a plurality of pairs of bracket and sliding cover. The bracket includes an attaching base attached to a tooth, a support extending upward obliquely from the attaching base, a top jaw, a transverse groove in the support, two side inclined grooved rails on the support, and a projecting abutment member. On a recessed, inclined surface of the support there are provided a transverse ridge and a shoulder below the ridge. The sliding cover comprises a latch extending downward from an upper end. The groove is open when the latch is stopped by the shoulder so as to permit an arch wire to dispose in the grooves. The groove is concealed by the sliding cover when the latch is urged against an inclined surface of the ridge so as to position the arch wire in the grooves. | 11-25-2010 |
Cheng-Yi Liu, Jungli City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100044743 | Flip chip light emitting diode with epitaxial strengthening layer and manufacturing method thereof - A flip chip light emitting diode with an epitaxial strengthening layer and a manufacturing method thereof are revealed. The flip chip light emitting diode with an epitaxial strengthening layer includes an epitaxial structure connected with an epitaxial strengthening layer while the manufacturing method of the flip chip light emitting diode with an epitaxial strengthening layer is mainly to form an epitaxial strengthening layer on the epitaxial structure. Thus the epitaxial structure of the flip chip light emitting diode is strengthened so as to prevent breakage of the epitaxial structure while removing a substrate by laser assisted lift-off technique or other techniques. Moreover, the thermal expansion coefficient of the epitaxial strengthening layer matches well with thermal expansion coefficient of the epitaxial structure. Thus after being treated with cyclic heating, there is no stress caused by unmatched thermal expansion coefficient. Therefore, reliability of the flip chip light emitting diode with an epitaxial strengthening layer is improved. | 02-25-2010 |
| 20100216270 | METHOD FOR MANUFACTURING LIGHT EMITTING DIODE - A method for manufacturing light emitting diode (LED) is revealed. By means of wet etching, a plurality of pyramids is formed on epitaxial structure. The depth of the pyramids is beyond a n-type semiconductor layer, reaching a p-type semiconductor layer. Thus light emitting directions of the LED made by the method of the present invention are increased. Therefore, the light emitting efficiency of LED is improved. | 08-26-2010 |
Cheng-Yi Liu, Zhongli TW
| Patent application number | Description | Published |
|---|---|---|
| 20100183896 | TIN-SILVER BONDING AND METHOD THEREOF - A Sn—Ag bonding and a method thereof are revealed. By means of a bonding layer formed by tin and silver between wafers, the stress released by diffusion and bonding between tin (Sn) and silver (Ag) is larger than the stress released by diffusion and bonding of conventional gold-silver bonding. Moreover, a Sn—Ag bonding method of the present invention forms Sn—Ag bonding at low temperature and releases more stress so as to reduce thermal stress generated during wafer bonding effectively. And after wafer bonding, the high temperature processes can be performed. | 07-22-2010 |
Cheng-Yi Lo, Taoyuan Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20090289801 | INTELLIGENT POWER SUPPLY APPARATUS - An intelligent power supply apparatus includes a power converting circuit, one or more sensors, an audio processor, an operating status processor, a storage unit and a loudspeaker. The power converting circuit is used for converting an input voltage into a regulated DC output voltage. The sensors detect operating statuses of the intelligent power supply apparatus, thereby generating corresponding sensing signals. The audio data are processed by the audio processor. The operating status processor is electrically connected to the sensors and the audio processor for controlling the audio processor to generate corresponding output audio signals in response to the sensing signals. The storage unit is electrically connected to the audio processor and/or the operating status processor for storing therein audio data. The loudspeaker is electrically connected to the audio processor for generating audio prompts corresponding to the output audio signals. | 11-26-2009 |
| 20110025289 | TWO-STAGE SWITCHING POWER SUPPLY - A two-stage switching power supply includes a first-stage power circuit, a bus capacitor, a second-stage power circuit and a power control unit. The first-stage power circuit is connected to a power bus for receiving an input voltage, and includes a first switching circuit. The input voltage is converted into a bus voltage by alternately conducting and shutting off the first switching circuit. The second-stage power circuit is connected to the power bus for receiving the bus voltage, and includes a second switching circuit. The power control unit is used for controlling operations of the first switching circuit and the second switching circuit. The bus voltage is dynamically adjusted according to electricity consumption amount of the system circuit under control of the power control unit. An operating mode of the second switching circuit of the second-stage power circuit is changed according to the electricity consumption amount of the system circuit. | 02-03-2011 |
| 20110107121 | POWER SUPPLY AND COMPUTER HAVING EXTERNAL POWER SOURCE - A power supply having an external power source, for receiving a power energy of an input voltage and converting to an external power source and an internal power source which is used in a computer, is disclosed. The power supply includes a body, a power converting module disposed inside the body for receiving the power energy of the input voltage and converting to the external power source and the internal power source, a power input device connected to a power input terminal of the power converting module for transferring the input voltage to the powering converting module, an internal power output device connected to an internal power output terminal of the power converting module and a motherboard of the computer, and an external power output device having one end connected to an external power output terminal of the power converting module and having the other end connected to a computer body of the computer or outside of the body, for transferring the external power source to a portable electronic apparatus. | 05-05-2011 |
| 20110122668 | CAPACITOR ENERGY RELEASE CIRCUIT WITH REDUCED POWER CONSUMPTION AND POWER SUPPLY HAVING THE SAME - A power source includes a power input terminal, a filtering unit, a main circuit and a capacitor energy release circuit. The power input terminal receives an AC voltage. The filtering unit is connected to the power input terminal for filtering off noise contained in the AC voltage. The main circuit is connected to the filtering unit and a load. The AC voltage is filtered by the filtering unit and converted into an output DC voltage by the main circuit, and the output DC voltage is transmitted to the load. The capacitor energy release circuit is connected to the power input terminal, the filtering unit and a common terminal for detecting whether the AC voltage is received by the power input terminal. When the AC voltage is not received by the power input terminal, electric energy stored in the filtering unit is discharged. | 05-26-2011 |
| 20110140519 | POWER SUPPLY WITH REDUCED POWER CONSUMPTION AND COMPUTER HAVING SUCH POWER SUPPLY - A power supply is used in a computer. The power supply includes a main power circuit, an auxiliary power circuit and a switching circuit. The main power circuit has a first main output terminal for outputting a first operating DC voltage. The auxiliary power circuit has an auxiliary output terminal connected to a standby circuit of the computer for outputting a standby DC voltage. The switching circuit is interconnected between the first main output terminal and the auxiliary output terminal. When the computer is in a power-off state, the switching circuit is shut off, and the standby circuit is powered by the standby DC voltage. When the computer is in a power-on state, the switching circuit is conducted, and the first operating DC voltage is transmitted to the standby circuit through the first main output terminal and the switching circuit so as to power the standby circuit. | 06-16-2011 |
Cheng-Yi Lu, West Hills, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20100078061 | Solid state heat pipe heat rejection system for space power systems - A heat rejection system includes a plurality of panel subassemblies and a solid state heat pipe flex joint. Each panel subassembly includes a fin, a solid state heat pipe manifold, a first solid state heat pipe tube operatively connected to the solid state heat pipe manifold and secured to the fin, a second solid state heat pipe tube operatively connected to the solid state heat pipe manifold adjacent to the first solid state heat pipe and secured to the fin. The solid state heat pipe flex joint operably connects the solid state heat pipe manifolds of two of the plurality of panel subassemblies in a hermetically sealed configuration, and is configured to permit repositioning of the two panel subassemblies relative to each other. | 04-01-2010 |
| 20110012435 | CENTER-TAPPED BATTERY AND POWER DISTRIBUTION SYSTEM FOR SAME - A battery for a power distribution system includes a cell assembly having a positive terminal and a negative terminal that together provide a relative battery DC voltage. A neutral tap is electrically connected to the cell assembly between the positive and negative terminals, splitting the voltage into positive and negative voltages. The positive terminal is at a positive DC voltage greater than the neutral tap. The negative voltage is at a negative DC voltage less than the neutral tap. The relative battery DC voltage is greater than each of the relative voltages between the neutral tap and each of the positive and negative DC voltages. | 01-20-2011 |
| 20110017875 | PHOTOVOLTAIC ARRAY - A reflective concentrated photovoltaic (CPV) array includes a plurality of Fresnel reflectors connected to and extending outward from a support structure, which direct light onto a CPV panel. The CPV panel is at least thermally connected to the center structure via a heat pipe radiator. | 01-27-2011 |
| 20110138811 | SOLAR RECEIVER AND SOLAR POWER SYSTEM HAVING COATED CONDUIT - A solar receiver device includes a metal conduit and a glass container disposed around the metal conduit such that there is a space between the glass container and the conduit. A coating is disposed on the metal conduit and has a composition that includes at least one element from silicon, titanium, aluminum, barium, and samarium. | 06-16-2011 |
Cheng-Yi Su, Taichung County TW
| Patent application number | Description | Published |
|---|---|---|
| 20100014222 | PIN DEFINITION LAYOUT OF ELECTRONIC PAPER DISPLAY SCREEN - A pin definition layout of electronic paper display screen is provided. The electronic paper has a first pin area, a data signal source driver area, and a second pin area sequentially disposed at any side thereof. The first pin area and the second pin area each have a first power supply pin set and a second power supply pin set disposed thereon, and a plurality of No connections is disposed by intervals in the first power supply pin set and the second power supply pin set, so as to separate potential pins. Therefore, no interference is generated between the pins, thus achieving good electrical properties and reducing the wire complexity. | 01-21-2010 |
Cheng-Yi Su US
| Patent application number | Description | Published |
|---|---|---|
| 20090284904 | Curved Display Panel and Method for Manufacturing the same - A curved display panel includes a display module, a first fixing substrate and an adhering material. The display module has a first glass plate. The first glass plate has a first curved surface. The first fixing substrate has a second curved surface facing the first curved surface. The adhering material is connected between the first curved surface and the second curved surface. | 11-19-2009 |
Cheng-Yi Wang, Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20080286034 | Brushing device of a container of liquid cosmetics - A liquid cosmetics container has a brushing device, which includes an applying component joined to a container body, and a clipping component around the applying component; the applying component is positioned over an opening of the container body, and has a passage therein for liquid cosmetics to flow through; the applying component has an applying portion at a tail, which is around a tail end of the passage; the clipping element has an opening end, and two gaps extending through the opening end, therefore the opening end is compressible; the clipping component has two opposing clipping portions on an inner side of the opening end; a cap is used to cover the opening of the container body; the cap has a squeezing portion on an inner side to compress the opening end of the clipping component so as to block the passage of the applying component. | 11-20-2008 |
| 20080314405 | Structure of a make-up container - A make-up container includes a containing body, a soft application device, a rigid reinforcement element for the soft application device, and a cap; the containing body has an opening, and the reinforcement element is positioned on the opening of the containing body; the application device surrounds and covers an annular portion of the reinforcement element at a base portion thereof therefore the base portion of the application device can't change shape easily even if it is subjected to pressure; the application device and the containing body are joined together so as to be inseparable; the application device has a through hole on one end thereof, which communicates with an inside of the containing body; the cap serves to cover the application device. | 12-25-2008 |
| 20090051377 | Probe card and method for assembling the same - A probe card and a method for assembling the same, the probe card comprises a base plate, a plurality of probes, a fixing ring, and a fixing member. The fixing ring is provided with a hole and the outer wall of its bottom is used for connecting the probes. The fixing ring is spaced from the probes in a distance so that when the fixing ring is inserted through a hole of the base plate, the terminal ends of main bodies of the probes are located under the hole while the anterior ends are electronically connected with the base plate or outer circuit. The fixing member is inserted through the hole of the fixing ring, the terminal end of which protrudes out of the hole so that a micro strip line is formed between the terminal end of the fixing member and the terminal ends of the probes. | 02-26-2009 |
| 20120013358 | PROBING APPARATUS FOR INTEGRATED CIRCUIT TESTING - A probing apparatus for integrated circuit testing at least includes a substrate, a probe body and a bypass capacitor. The substrate is fixed in an external conductor after an internal conductor is filled with an insulating material. One end of the substrate has a section, so that both the internal conductor and the insulating material are exposed on the section. One end of the probe body is electrically connected to the internal conductor exposed on the section. A tip end of the probe body is used for contacting a pad of an element to be tested. The bypass capacitor has a first electrode terminal and a second electrode terminal. The first electrode terminal is electrically connected to the probe body, and the second electrode terminal is connected to the external conductor at the end of the substrate. | 01-19-2012 |
Cheng-Yi Wang, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20110148638 | SECURITY MONITOR METHOD UTILIZING A RFID TAG AND THE MONITOR APPARATUS FOR THE SAME - A security monitor method and monitor apparatus utilizing a RFID tag. A wearer wears a RFID tag having an acceleration sensor and a magnetic field sensor. The status of the wearer is determined by an acceleration variation and an angle variation of an included angle with the terrestrial magnetism on X axis, Y axis and Z axis detected and calculated by the acceleration sensor and the magnetic field sensor. If the status determined is abnormal, the monitor apparatus transmits wireless warning signals to monitor ends such as a hospital or a home for the aged. | 06-23-2011 |
Cheng-Yi Yang, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20110129653 | Protection structure to printed layer of plastic film - A plastic film includes a first plastic layer, a printed layer connected to an inside of the first plastic layer, and a second plastic layer is then connected to the inside of the first plastic layer to sandwich the printed layer between the first and second plastic layers, wherein a glue layer is applied between the first and second plastic layers and the first and second plastic layers are connected to each other by way of high frequency heating or ultrasonic heating. The printed layer is protected by the first and second layers and avoided from scrubbed. The plastic film can be used as stationery bag or cosmetic bag. | 06-02-2011 |