Patent application number | Description | Published |
20120240455 | SOLID HYDROGEN FUEL WITH INITIAL HEATING - An embodiment of the invention provides a solid hydrogen fuel with an initial heating mechanism, including: a solid hydrogen fuel; and a heating promoter disposed on at least one surface of the solid hydrogen fuel, wherein the heating promoter proceeds with an exothermal reaction when contacted with water. Another embodiment of the invention provides: a solid hydrogen fuel with an initial heating mechanism, including a solid hydrogen fuel; and an electrical heating element in contact with the solid hydrogen fuel. | 09-27-2012 |
20130146912 | ELECTRONIC DEVICE - An electronic device including an insulating substrate, a plurality of conductive vias and a chip is provided. The insulating substrate has an upper surface and a lower surface opposite to each other. The conductive vias pass through the insulating substrate. The chip is disposed on the upper surface of the insulating substrate and includes a chip substrate, a semiconductor layer and a plurality of contacts. The semiconductor layer is located between the chip substrate and the contacts. The contacts are electrically connected to the conductive vias. The material of the insulating substrate and the material of the chip substrate are the same. | 06-13-2013 |
20130146913 | ELECTRONIC DEVICE - An electronic device including an insulating substrate, a chip and a patterned conductive layer is provided. The insulating substrate has an upper surface and a lower surface opposite to each other. The chip is disposed above the upper surface of the insulating substrate. The patterned conductive layer is disposed between the upper surface of the insulating substrate and the chip. The chip is electrically connected to an external circuit via the patterned conductive layer. Heat generated by the chip is transferred to external surroundings via the patterned conductive layer and the insulating substrate. | 06-13-2013 |
20130148344 | LIGHT EMITTING DEVICE - A light emitting device including an insulating substrate, a plurality of light emitting diode (LED) chips and a patterned conductive layer is provided. The insulating substrate has an upper surface. The LED chips are disposed on the insulating substrate and located on the upper surface. The dominant wavelengths of the LED chips are in a wavelength range of a specific color light and the dominant wavelengths of at least two of the LED chips are different. The patterned conductive layer is disposed between the insulating substrate and LED chips, and electrically connected to the LEDs chip. | 06-13-2013 |
20140043845 | LIGHT-EMITTING APPARATUS - A light-emitting apparatus including a light guide unit, at least one light-emitting component, and a wavelength conversion unit is provided. The light guide unit has a first end and a second end opposite to the first end. The light-emitting component is disposed on the first end and emits a first light. The wavelength conversion unit is disposed on the second end. The light guide unit guides the first light emitted by the light-emitting component from the first end to the second end, and the wavelength conversion unit converts the first light into the second light, wherein the wavelength of the first light is different from the wavelength of the second light. | 02-13-2014 |
20140103367 | METHOD OF FORMING LIGHT EMITTING DIODE DIES, LIGHT EMITTING DIODE WAFER AND LIGHT EMITTING DIODE DIE - A method of forming light emitting diode dies includes: forming an epitaxial layered structure that defines light emitting units on a front surface of a substrate wafer; forming a photoresist layer over a back surface of the substrate wafer; aligning the substrate wafer and patterning the photoresist layer so as to form openings in the photoresist layer, each of the openings having an area less than a projected area of the respective light emitting unit; forming a solder layer on the photoresist layer such that the solder layer fills the openings in the photoresist layer; removing the photoresist layer and a portion of the solder layer that covers the photoresist layer from the substrate wafer; and dicing the substrate wafer. | 04-17-2014 |
20140131751 | WAVELENGTH CONVERTING SUBSTANCE, WAVELENGTH CONVERTING GEL AND LIGHT EMITTING DEVICE - A wavelength converting substance is made of semiconductor material. The wavelength converting substance is suitable for absorbing an exciting light with the wavelength range falling between 300 nanometers and 490 nanometers and converting the exciting light to an emitted light with wavelength range falling between 450 nanometers and 750 nanometers. | 05-15-2014 |
20140167077 | LIGHT SOURCE MODULE - A light source module includes a substrate, at least two light emitting diode (LED) chips and at least one dummy chip. The LED chips are disposed on the substrate. The dummy chip is disposed on the substrate and located between the LED chips. The LED chips, the dummy chip and the substrate are electrically connected to one another. The dummy chip is used to redirect a lateral light emitted from the LED chips. | 06-19-2014 |
20140185270 | LIGHTING STRUCTURE AND ILLUMINATING DEVICE - A lighting structure includes a substrate, a light emitting diode, a cover unit, and a hollow column. The substrate has a top surface and a rear surface opposite to the top surface. The light emitting diode is disposed on the top surface and is electrically connected to the substrate. The cover unit is disposed on and cooperates with the substrate to define a receiving space in which the light emitting diode is disposed. The hollow column is connected to the rear surface of the substrate and extends in a vertical direction away from the rear surface. The cover unit and the hollow column respectively have a height in the vertical direction, and the height of the hollow column is 2 times to 10 times the height of the cover unit. | 07-03-2014 |
20140198506 | LIGHTING DEVICE - A lighting device includes a light base, a light shade, a padding element, at least one light emitting element and a wavelength converting shell. The light shade is disposed on the light base and cooperating with the light base to define an accommodating space. The padding element is disposed on the light base and located in the accommodating space. The light emitting element is disposed on the padding element and emits a light beam. The wavelength converting shell is disposed on the padding element and covers the light emitting element. The light beam is emitted out from the wavelength converting shall by a first refraction, formed a luminous virtual image between a first top end of the light shade and a second top end of the wavelength converting shell by reflecting, and emitted out the light shade by a second refraction. | 07-17-2014 |
20140252400 | LIGHT EMITTING DEVICE - A light emitting device including a carrier, a substrate, at least one electrode pair, at least one light emitting diode (LED) and at least one positioning element is provided. The substrate is disposed on the carrier and has a body portion and at least one bending portion. The bending portion connects to the body portion. The bending portion is not coplanar with the body portion. The electrode pair is located on the body portion of the substrate. The LED is disposed on the body portion of the substrate and electrically connected to the electrode pair. The positioning element is disposed on the bending portion of the substrate for fixing the substrate on the carrier. | 09-11-2014 |
20140278330 | ILLUMINATION SYSTEM - An illumination system is provided, including a light emitting device and a control device, wherein the control device is coupled to the light emitting device so as to capture a situation data in a remote end and generate a situation signal correspondingly. The light emitting device receives the situation signal and generates a simulating situation. | 09-18-2014 |
20140306246 | LIGHT SOURCE MODULE - A light source module including a substrate, a plurality of first light emitting diode (LED) chips, and at least one second LED chip is provided. The substrate has an upper surface. The plurality of first LED chips are disposed on the upper surface and electrically connected to the substrate. The second LED chip is disposed on the upper surface and electrically connected to the substrate. A first distance is between a top surface of each of the first LED chips away from the upper surface of the substrate and the upper surface, a second distance is between a top surface of the second LED chip away from the upper surface of the substrate and the upper surface, and the second distance is greater than each of the first distances. | 10-16-2014 |
20140313407 | PROTECTIVE COVER - A protective cover is detachably assembled to and electrically connected to an electronic device having an image capturing unit and a lens. The protective cover includes a base portion, at least one bending portion, and a plurality of light-emitting units. The electronic device is disposed on the base portion. The bending portion is foldably connected to at least one side of the base portion. There is at least one included angle between a side of the electronic device and the bending portion. The light-emitting units are disposed on the bending portion, and the light-emitting units are not coplanar with the lens. | 10-23-2014 |
20140313745 | ILLUMINATION DEVICE - An illumination device including at least one light emitting element and a transparent lampshade is provided. The transparent lampshade is disposed on one side of the light emitting element and located on a light emitting path of the light emitting element. The transparent lampshade has a sealed space, a first fluid and a second fluid. The first fluid is a colloidal solution, and the first fluid is immiscible with the second fluid, and the first fluid and the second fluid flow in the sealed space to change a light shape of the emitted light from the light emitting element. | 10-23-2014 |
20140339576 | FLIP-CHIP LIGHT-EMITTING DIODE UNIT - A flip-chip light-emitting diode (LED) unit includes a substrate, an electrode pad set disposed on the substrate, and three flip-chip LEDs disposed on the electrode pad set in a flip-chip manner and including one first LED and two second LEDs that are spaced apart from the first LED and that are electrically coupled to the first LED in a series configuration. | 11-20-2014 |
20140346543 | LIGHT-EMITTING DEVICE - A light-emitting device of the invention includes a base, at least one light-emitting element, a wavelength transferring cover and a heat-conducting structure. The light-emitting element is disposed on the base and electrically connected to the base. The wavelength transferring cover is disposed on the base and covers the light-emitting element. The heat-conducting structure is disposed on the base and directly contacts the wavelength transferring cover. | 11-27-2014 |