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Cheng-Te Tseng, Taipei City TW

Cheng-Te Tseng, Taipei City TW

Patent application numberDescriptionPublished
20080240684Data Transmission Method and Audio/Video System Capable of Splitting and Synchronizing Audio/Video Data - Data transmission first initializes a transmitter system and a receiver system. The transmitter system processes audio/video data, and transmits the processed audio/video data based on information received from the receiver system. The receiver system receives and processes the audio/video data sent by the transmitter system for generating corresponding audio output data and video output data. The receiver system sends the audio output data and the video output data to an audio output apparatus and a video output apparatus, respectively.10-02-2008
20080273092Micro-optical image stabilizer - A micro-optical image stabilizer is disclosed. The optical image stabilizer includes a substrate, a carrier movably disposed on the substrate for carrying an image sensor, an anchor fixed on the substrate, a conducting pad fixed on the anchor for coupling an image processing circuit, a flexible suspension disposed between the conducting pad and the carrier, a conducting line disposed on the flexible suspension coupled to the conducting pad and protruding over the carrier for coupling the image sensor, and a micro actuator disposed between the substrate and the carrier for adjusting the position of the carrier according to control signals from an actuator control circuit.11-06-2008
20090213236Micro-optical image stabilizer - The optical image stabilizer includes a substrate, a carrier movably disposed on the substrate for carrying an image sensor, an anchor fixed on the substrate, a conducting pad fixed on the anchor for coupling an image processing circuit, a flexible suspension disposed between the conducting pad and the carrier, a conducting line disposed on the flexible suspension coupled to the conducting pad and protruding over the carrier for coupling the image sensor, and a micro actuator disposed between the substrate and the carrier for adjusting the position of the carrier according to control signals from an actuator control circuit.08-27-2009
20090322703Touch panel with touch pads - A touch panel with touch pads includes a transparent substrate, a transparent electrode and a plurality of conductive lines. The transparent substrate has a display region. The transparent electrode is disposed on the transparent substrate and has a plurality of first touch blocks and a second touch block. The first touch blocks are disposed along the edges of the display region. The second touch block is disposed within the region surrounded by the first touch blocks and has an extending block passing through a gap between the first touch blocks and extending to the edge of the display region. The conductive lines are disposed outside the display region and electrically connected to the first touch blocks and the extending block adjoining the edges of the display region.12-31-2009
20100046607IMAGE PROCESSING APPARATUS AND IMAGE PROCESSING METHOD - The invention discloses an image processing apparatus and an image processing method. A server can transmit a first image and a second image. In an embodiment, the apparatus includes a receiving/transmitting unit, a processing unit and a display unit. The receiving/transmitting unit can communicate with the server to receive the first image and the second image. The processing unit is coupled to the receiving/transmitting unit and the display unit. The processing unit is for selectively recompressing the first image at a first compression ratio and then controlling the display unit to display the first image. In addition, the processing unit transmits the selected first compression ratio to the server such that the server compresses the second image at the first compression ratio and transmits it to the receiving/transmitting unit.02-25-2010
20100073781Manufacturing method for a wafer lens module and the structure thereof - The present invention provides a manufacturing method for a wafer lens module including the steps of providing a plastic material with high thermal resistance, wherein the high temperature plastic material can be used at a reflow temperature above 250° C.; and forming the high temperature plastic material into a wafer lens module integrally. The method can form an integrated wafer lens module and simplify the manufacturing procedures. Furthermore, a wafer lens unit formed by stacking another wafer lens module on the wafer lens module manufactured by the method can have improved optical image quality.03-25-2010
20100262284CONTROLLING MACHINE ACTIONS BASED ON LUMINANCE OF ENVIRONMENTAL LIGHT AND DISTANCE FROM USER - A control system for controlling actions performed by a machine includes a sensor module for sensing environmental condition around the machine, an estimation unit for estimating the environmental condition detected by the sensor, a motor for controlling movement of the machine, a control unit for calculating a magnitude of motion according to the estimated environmental condition, the magnitude of motion used for controlling the movement of the machine, and a motor drive circuit for driving the motor to move the machine using the calculated magnitude of motion.10-14-2010
20100265671PACKAGE STRUCTURE OF PRINTED CIRCUIT BOARD AND PACKAGE METHOD THEREOF - The package structure of the PCB comprises a substrate and a frame. The frame is located at the top of the substrate, and the substrate and the frame define a receiving space. The electronic components are mounted on the substrate and distributed in the receiving space. Because of the protection of the frame, the electronic components are effectively protected from the collision of installation in the process or use in the process. The substrate can be a flexible circuit board or a rigid-flex PCB and the electronic components are directly embedded in the substrate. Therefore the thickness of the package structure is reduced.10-21-2010

Patent applications by Cheng-Te Tseng, Taipei City TW