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Cheng-Te

Cheng-Te Chen, Taipei Hsien TW

Patent application numberDescriptionPublished
20110093741METHOD FOR RECOVERING BIOS AND COMPUTER SYSTEM THEREOF - A method for recovering basic input/output system (BIOS) in a computer system is disclosed. The computer system includes a host unit, a control unit, and a first storage device. The control unit is utilized for controlling system power provided for the host unit. The host unit is utilized for accessing a BIOS code stored in the first storage device to perform a boot process. The method includes turning the system power off when the computer system has a recovery requirement, restoring a backup BIOS code into the first storage device, and turning the system power on to make the host unit access the restored BIOS code in the first storage device for performing the boot process.04-21-2011

Cheng-Te Chen, Taoyuan County TW

Patent application numberDescriptionPublished
20110063781MOVING MODULE AND ELECTRONIC DEVICE - A moving module and an electronic device are provided. The electronic device includes a first body, a second body, and the moving module disposed between the first and second bodies. The moving module includes a rail, a moving element, and an elastic element. The moving element is in contact with the rail. The elastic element is connected between the moving element and the first body. When the moving element moves from a first end of the rail to a curved portion of the rail, a force exerted on the elastic element by the moving element is gradually increased. When the moving element passes the curved portion, an elastic restoration force of the elastic element drives the moving element to move toward a second end of the rail. When the moving element reaches the first end or the second end, the first body and the second body interfere with each other.03-17-2011

Cheng-Te Chen, Taoyuan Shien TW

Patent application numberDescriptionPublished
20100008114DISCONTINUOUS PROTECTION METHOD FOR CLAMPING CURRENT IN INVERTER - A discontinuous protection method clamps phase currents in an inverter initially sets a current clamping flag and a current threshold. The phase currents are alternatively cut out by a criterion based on the current-clamp flag and based on whether the phase currents exceed the current threshold. By proving current in discontinuous way under certain situation judged by the criterion, over current protection and shut-down of inverter can be prevented. The method further sets a carrier frequency modulation flag. The carrier frequency is increased to 8 KHz when the phase current is to be cut out, thus speeding up protection for clamping current.01-14-2010

Cheng-Te Chou, Sijhih City TW

Patent application numberDescriptionPublished
20090289273LIGHT EMITTING DEVICE PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF - A light emitting device package structure is described. The light emitting device package structure includes a substrate serving as a carrier supporting a light emitting device chip. The substrate and the light emitting device chip have a chip side and a substrate side separately. A first electrode layer is disposed on a first surface of the light emitting device chip and a second electrode layer is disposed on a second surface of the light emitting device chip, in which the first surface and the second surface are not coplanar. A first conductive trace is electrically connected to the first electrode layer and a second conductive trace is electrically connected to the second electrode layer. At least the first conductive trace or the second conductive trace is formed along the chip side and the substrate side simultaneously.11-26-2009

Cheng-Te Chou, Taipei TW

Patent application numberDescriptionPublished
20110042796CHIP PACKAGE AND FABRICATION METHOD THEREOF - A chip package is disclosed. The package includes a carrier substrate and at least one semiconductor chip thereon. The semiconductor chip has a plurality of conductive pads, where a plurality of first redistribution layers (RDLs) is disposed thereon and is electrically connected thereto. A single-layer insulating structure covers the carrier substrate and the semiconductor chip, having a plurality of openings exposing the plurality of first RDLs. A plurality of second RDLs is disposed on the single-layer insulating structure and is electrically connected to the plurality of first RDLs. A passivation layer is disposed on the single-layer insulating structure and the plurality of second RDLs, having a plurality of openings exposing the plurality of second RDLs. A plurality of conductive bumps is correspondingly disposed in the plurality of openings to be electrically connected to the plurality of second RDLs. A fabrication method of the chip package is also disclosed.02-24-2011
20110042804CHIP PACKAGE AND FABRICATION METHOD THEREOF - The invention provides a chip package and fabrication method thereof. In one embodiment, the chip package includes: a semiconductor substrate having opposite first and second surfaces, at least one bond pad region and at least one device region; a plurality of conductive pad structures disposed on the bond pad region at the first surface of the semiconductor substrate; a plurality of heavily doped regions isolated from one another, underlying and electrically connected to the conductive pad structures; and a plurality of conductive bumps underlying the heavily doped regions and electrically connected to the conductive pad structures through the heavily-doped regions.02-24-2011
20110042807CHIP PACKAGE AND FABRICATION METHOD THEREOF - The invention provides a chip package and fabrication method thereof. In one embodiment, the chip package includes: a semiconductor substrate having opposite first and second surfaces, at least one bond pad region and at least one device region; a plurality of conductive pad structures disposed on the bond pad region at the first surface of the semiconductor substrate; a plurality of heavily doped regions isolated from one another, underlying and electrically connected to the conductive pad structures; and a plurality of conductive bumps underlying the heavily doped regions and electrically connected to the conductive pad structures through the heavily-doped regions.02-24-2011

Cheng-Te Chuang, Hsin-Chu City TW

Patent application numberDescriptionPublished
20090037793METHOD FOR ERROR PROCESSING IN OPTICAL DISK MEMORIES - A method of correcting and detecting errors in a sector of data stored in a DVD format is provided. The method includes: calculating an initial error detection value for data within the sector, performing an error correction operation on the data within the sector and determining an updated, intermediate error detection value responsive to the error correction operation, using a target error detection value and one of the initial error detection value and the intermediate error detection value to determine that the sector doesn't include errors, processing an outer code to provide a set of error patterns and error locations, and determining if any of the error locations are for data within the sector and not correcting data corresponding to the error locations within the sector.02-05-2009

Cheng-Te Hu, Tainan Hsien TW

Patent application numberDescriptionPublished
20110079116RETRACTABLE SCREWDRIVER - A retractable screwdriver includes a handle, a positioning member, an operation ring, a shank, a sleeve and a drive socket. The positioning member includes a first opening and a second opening respectively defined through a wall thereof and communicating with the passage. The length of the first opening is shorter than that of the second opening. A first wall is formed at the first opening and a second wall is formed at the second opening. The first and second walls are located on different radial planes and have a distance defined therebetween in a radial direction. The opening ring is obliquely located in the passage and biased by the second spring to keep an inclination of the operation ring. The operation ring has its contact edge to contact the shank so as to achieve the purpose of adjustment of the shank.04-07-2011

Cheng-Te Lin, Hsinchu TW

Patent application numberDescriptionPublished
20100327598WIND TURBINE - A wind turbine has a housing, multiple cross-flow fan assemblies, a turbine generator assembly, an air guide and multiple wind-driven fans. The housing has a chamber having top and bottom openings. The cross-flow fan assemblies are mounted on the housing and each has a casing, a cross-flow fan blade and a transmission shaft. The cross-fan blade rotates to provide airflow to the chamber. The turbine generator assembly is mounted in the chamber and has a generator, a generator shaft mounted on the generator and a turbine blade mounted on the generator shaft and driven by the airflow to activate the generator. The air guide is mounted on the transmission shafts and guides airflow outwards. The wind-driven fans are mounted respectively on the transmission shafts and are driven by outward airflow. The wind turbine derives energy from the airflow exiting out of the wind turbine for improved energy extraction efficiency.12-30-2010

Cheng-Te Liu, Lingya Dist. TW

Patent application numberDescriptionPublished
20120134856Series-Connected Motor Unit and a Fan utilizing the same - A series-connected motor unit includes a first motor, a second motor and a separation member. The first motor has a first circuit board and the second motor has a second circuit board. The separation member has a first face and a second face opposite to the first face, wherein the first face abuts against the first circuit board and the second face abuts against the second circuit board.05-31-2012

Cheng-Te Tseng, Gueishan Hsiang TW

Patent application numberDescriptionPublished
20090096657REMOTE CONTROL UNIT FOR OPERATING AN ELECTRONIC DEVICE - A remote control unit includes a housing, at least one pushbutton, a signal transmitter and a detection circuit. The pushbutton is disposed on the housing. The signal transmitter is mounted rotatably on the housing and capable of being switched between first and second positions. The detection circuit is coupled electrically to the pushbutton and the signal transmitter for generating a control signal upon detecting activation of the pushbutton. The signal transmitter transmits a first function signal when the signal transmitter is disposed at the first position and a second function signal different from the first function signal when the signal transmitter is disposed at the second position.04-16-2009