| Patent application number | Description | Published |
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| 20080265736 | LED REFLECTIVE SPHERICAL LAMP - A LED reflective spherical lamp is disclosed. The spherical lamp comprises a transparent spherical lamp hood, a leading LED beam assembly, a linkage of the leading LED beam assembly, a heat dissipation block having good thermal conductivity and a securing base, characterized in that the leading LED beam assembly comprises a threaded connection tube, a converging lense and a conductive base board for mounting LED, and the threaded connection tube screws to a screw hole at the bottom of the transparent spherical lamp hood and the threaded connection tube extends into a tube opening of the lamp hood, overlappingly connecting the converging lense, the other end of the threaded tube is a peg tube wall for peggingly connection of a corresponding recess of the conductive base board such that the LED on the conductive base board face the converging lense, and the other end of the conductive base board mounting the LED is connected to the heat dissipation block, and then is secured with the securing base, thereby when LED is lighted, LED beams pass through the transparent lense into the lamp hood such that the entire lamp hood is lighted. | 10-30-2008 |
| 20080266847 | TUBULAR LAMP DEVICE USING LED - The tubular lamp device contains a passive and transparent lamp tube whose two ends are plugged into a pair of socket members, respectively. The lamp tube has an axial strip along the circumference coated with a reflective film. The socket member contains a tubular element which receives an end of the lamp tube. Inside the tubular element, a LED element is housed in a hole of a solid lens element which directs the light beams of the LED element towards the lamp tube. The light beams are then reflected by the reflective film to create a large area of illumination as the light beams propagate through the lamp tube. | 10-30-2008 |
| 20100214778 | TABLE LAMP - The table lamp contains a lamp base and an extension tube plugged vertically into the lamp base. A curved transparent light tube is attached along its entire length to a parallel and also curved back cover. The combination is joined to a top end of the extension tube. Two light generation assemblies are provided at the two ends of the light tube, respectively, each sequentially composed of a lens, a lens ring, a light emitting diode, a power circuit, a heat dissipation plate, and a heat dissipation element. The light from the light emitting diodes is projected into the light tube and, with a reflection layer along the inner wall of the light tube, the light is uniformly reflected towards the area beneath the table lamp. | 08-26-2010 |
| Patent application number | Description | Published |
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| 20090302448 | Chip Stacked Structure and the Forming Method - A chip package structure is provided, includes a chip that having a plurality of pads and an adhesive layer on the back side; an encapsulated structure is covered around the four sides of the chip to expose the pads, and the through holes is formed within the encapsulated structure; a patterned first protective layer is formed on the portion surface of encapsulated structure, the portion of active surface of the chips, and the pads of the chip and the through holes are to be exposed; a metal layer is formed on the portion surface of the patterned first protective layer and formed to electrically connect the pads and to fill with the through holes; the patterned second protective layer is formed on the patterned first protective layer and the portion of metal layer, and the portion surface of metal layer is to be exposed; a patterned UBM layer is formed on the exposed surface of the metal layer and the portion surface of the patterned second protective layer; and the conductive elements is formed on the patterned UBM layer and electrically connect to the metal layer. | 12-10-2009 |
| 20090302465 | DIE REARRANGEMENT PACKAGE STRUCTURE AND METHOD THEREOF - A die rearrangement package structure is provided and includes a die; an encapsulated structure is covered around the four sides of the die to expose the active surface and the reverse side of the die; a patterned protective layer is formed on the encapsulated structure and the active surface of the die, and the pads is to be exposed; one end of fan-out patterned metal layer is electrically connected the pads and other end is extended to cover the patterned protective layer; patterned second protective layer is provided to cover the patterned metal layer to expose the portions surface of the patterned metal layer; patterned UBM layer is formed on the exposed surface of the patterned metal layer; and a conductive component is formed on the patterned UBM layer, and electrically connected the patterned metal layer. | 12-10-2009 |
| 20110003431 | METHOD OF DIE REARRANGEMENT PACKAGE STRUCTURE HAVING PATTERNED UNDER BUMP METALLURGIC LAYER CONNECTING METAL LEAD - A die rearrangement package structure is provided and includes a die; an encapsulated structure is covered around the four sides of the die to expose the active surface and the reverse side of the die; a patterned protective layer is formed on the encapsulated structure and the active surface of the die, and the pads is to be exposed; one end of fan-out patterned metal layer is electrically connected the pads and other end is extended to cover the patterned protective layer; patterned second protective layer is provided to cover the patterned metal layer to expose the portions surface of the patterned metal layer; patterned UBM layer is formed on the exposed surface of the patterned metal layer; and a conductive component is formed on the patterned UBM layer, and electrically connected the patterned metal layer. | 01-06-2011 |
