Cheng-Pin

Cheng-Pin Chen, Nanjhou Township TW

Patent application number	Description	Published
20110100442	Structure of a Solar Cell - A structure of a solar cell. The structure of the solar cell includes a substrate, a graded layer and a semiconductor layer. The graded layer is disposed on the substrate. The graded layer is made from materials including the first material and the second material, and includes at least one thin film. One of the at least one thin film includes a mixture of at least the first material and the second material at a mixture ratio. The mixture forms a bandgap of the at least one thin film. The semiconductor layer is disposed on the graded layer.	05-05-2011

Patent application number	Description	Published
20110048528	STRUCTURE OF A SOLAR CELL - A structure of a solar cell is provided. The structure of the solar cell includes a substrate, a base and a plurality of nanostructures. The base is disposed on the substrate. The nanostructures are disposed on a surface of the base, or a surface of the base includes the nanostructures, so as to increase light absorption of the structure.	03-03-2011

Patent application number	Description	Published
20090127679	POP (Package-On-Package) device encapsulating soldered joints between externals leads - A POP (Package-On-Package) semiconductor device with encapsulating protection of soldered joints between the external leads, primarily comprises a plurality of stacked semiconductor packages and dielectric coating. Each semiconductor package includes at least a chip, a plurality of external leads of leadframe, and an encapsulant where the external leads are exposed and extended from a plurality of sides of the encapsulant. Terminals of a plurality external leads of a top semiconductor package are soldered to the soldered regions of the corresponding external leads of a bottom semiconductor package. The dielectric coating is disposed along the sides of the encapsulant of the bottom semiconductor package to connect the soldered points between the external leads and to partially or completely encapsulate the soldering materials so that the stresses between the soldered joints can be dispersed and no electrical shorts happen.	05-21-2009