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Cheng, New Taipei

Andrew Cheng, New Taipei TW

Patent application numberDescriptionPublished
20110280523OPTOELECTRONIC SOCKET CONNECTOR - An electrical connection system for an optoelectronic socket comprises an optoelectronic socket (11-17-2011
20120018747LED LEAD FRAME AND METHOD OF MAKING THE SAME - An LED lead frame assembly comprises a wiring board having a plurality set of positive and negative poles arranged on a top surface thereof A plurality of LED chips are disposed on the wiring board, and electrically bonded to the bus line. A transparent cover is arranged upon the wiring board and covering the LED chip and the conductive lead.01-26-2012
20120028502SOCKET CONNECTOR WITH CONTACT TERMINAL HAVING WAVEFORM ARRANGEMENT ADJACENT TO TAIL PORTION PERFECTING SOLDER JOINT - An electrical connector includes an insulative housing with a number of through holes extending therethrough, a number of contacts assembled to the insulative housing, and a number of solder balls disposed in the though holes and each is clasped by the tail and insulative housing. Each contact includes a vertical base portion secured to a first side of the through hole, a contact engaging arm extending from a top end of the base portion, and a solder portion extending from a bottom end of the base portion. The solder portion has a wave arrangement below the base portion and projecting from the base portion to a second side of the through hole which opposites to said first side, and a tail extending downwardly from the wave arrangement and capable of moving from the first side to the second side.02-02-2012
20120045911SOCKET CONNECTOR HAVING CARBON NANOTUBE CONTACTS FOR SIGNAL TRANSMISSION AND METALLIC CONTACTS FOR POWER TRANSIMISSION - A socket connector includes a housing having a base and a plurality of sidewalls extending upwardly from the base. The base and the sidewalls define a receiving cavity for receiving an electronic package. A plurality of carbon nanotube contacts for signal transmission and a plurality of metallic contacts for power transmission are mounted within the housing respectively.02-23-2012
20120142209SOCKET WITH PICK UP CAP - A socket comprises an insulating housing receiving a plurality of contacts, and a pick-up cap engaging with the insulating housing. The pick-up cap has a planar main body covering the insulating housing. The main body is formed with two pivots on a side thereof. The insulating housing is formed with a plurality of sidewalls, one of the sidewall is provided with a pair of mounting seats on an outside thereof, each mounting seat defines a mounting hole with a gap, and the pivots of the pick-up cap enter into the mounting holes via the gaps to pivotally assemble the pick-up cap to the mounting seats.06-07-2012
20120156919SOCKET ASSEMBLY WITH PICK UP CAP - A socket assembly comprises an insulating housing receiving a plurality of contacts, a pick up cap assembled on the insulating housing and a loading plate covering the insulating housing and the pick up cap. The pick up cap is pivotally assembled to one of the sidewalls of the insulative housing at an end thereof and has an operating portion at an opposite end thereof. The loading plate is provided with a latching piece to latch with the operating portion of the pick up cap, so that the loading plate can bring the pick up cap to open.06-21-2012
20130040499ELECTRICAL CONNECTOR WITH DIFFERENT CONTACTS SHARING A SAME SOLDERING LEG - An electrical connector includes an insulative housing defining a tongue plate, a first set of contacts disposed upon the tongue plate, a second set of contacts disposed upon the tongue plate, and an inner PCB retained in the housing. The inner PCB defines at least one input connecting portion, at least one output connecting portion electrically connected with the at least one input connecting portion, and a first soldering leg connecting with the at least one output connecting portion. At least one of the first set of contacts connect with the first soldering leg, and at least one of the second set of contacts connect with the at least one input connecting portion to share the first soldering leg for mounting onto the mother PCB.02-14-2013

Patent applications by Andrew Cheng, New Taipei TW

Chih-Hung Cheng, New Taipei TW

Patent application numberDescriptionPublished
20120276822APPARATUS FOR GRINDING HEATED PLANE OF COOLER - A method for making heated plane of a cooler to obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.11-01-2012

Chih-Pi Cheng, New Taipei TW

Patent application numberDescriptionPublished
20110230100SOCKET CONNECTOR WITH CONTACT TERMINALS ARRANGED RADIALLY CREATING DIFFERENT PITCHES IN DIFFERENT AREA - An electrical connector includes an insulative housing defining a plurality of passageways and a plurality of contacts disposed in the passageways by two arrangement manners. Each contact includes a mating portion located at an upper end and a soldering portion located at a bottom end. Wherein a first arrangement manner is that neighboring mating portions defined a distance in a same row is smaller than a distance defined by corresponding neighboring soldering portions, and neighboring mating portions defined a distance in a same column is equal to a distance defined by corresponding neighboring soldering portions. A second arrangement manner is that neighboring mating portions defined a distance in both a same row and a same column is smaller than a distance defined by corresponding neighboring soldering portions.09-22-2011
20120015559SOCKET WITH LOWER CONTACTS WITH CONFIGURATION - A socket for receiving an IC (integrate circuit) package comprises an insulative housing and a plurality of contacts. The insulative housing defines a plurality of contact passageways for receiving the contacts. Each contact has a retaining portion, an elastic arm and a soldering portion, and the retaining portion is formed with a first part, a second part and a bending part between the first and the second parts. Each of the first and the second parts is formed with a protrusion on an outside lateral edge thereof away from the bending part for interfering with the contact passageway of the insulative housing to retain the contact to the insulative housing.01-19-2012
20120018747LED LEAD FRAME AND METHOD OF MAKING THE SAME - An LED lead frame assembly comprises a wiring board having a plurality set of positive and negative poles arranged on a top surface thereof A plurality of LED chips are disposed on the wiring board, and electrically bonded to the bus line. A transparent cover is arranged upon the wiring board and covering the LED chip and the conductive lead.01-26-2012
20120028502SOCKET CONNECTOR WITH CONTACT TERMINAL HAVING WAVEFORM ARRANGEMENT ADJACENT TO TAIL PORTION PERFECTING SOLDER JOINT - An electrical connector includes an insulative housing with a number of through holes extending therethrough, a number of contacts assembled to the insulative housing, and a number of solder balls disposed in the though holes and each is clasped by the tail and insulative housing. Each contact includes a vertical base portion secured to a first side of the through hole, a contact engaging arm extending from a top end of the base portion, and a solder portion extending from a bottom end of the base portion. The solder portion has a wave arrangement below the base portion and projecting from the base portion to a second side of the through hole which opposites to said first side, and a tail extending downwardly from the wave arrangement and capable of moving from the first side to the second side.02-02-2012
20120064742ELECTRICAL ASSMEBLY AND SOCEKG CONNETOR THEREIN - The present invention relates to an electrical assembly for connecting an IC package. The assembly includes at least an upper and a lower layer stacked with each other, wherein the upper layer is formed with an opening for receiving a socket connector. The socket connector has contacts electrically connected to conductive traces respectively provided on the upper and the lower layer.03-15-2012
20120100758SOCKET CONNECTOR WITH CONTACT TERMINAL HAVING OXIDATION-RETARDING PREPARATION ADJACENT TO SOLDER PORTION PERFECTING SOLDER JOINT - Provided herewith a socket connector adapted to be mounted on a substrate having a conductive element is provided, and comprises an insulative housing, the housing having an exterior side adapted to face the substrate. A stamped contact is formed from a sheet of conductive material and is adapted to mate with a conductive component and extending substantially to the exterior side of the housing. The contact has a connection portion and wherein a substantially dried preparation of oxidation retarding and solder affinity deployed on the terminal portion before the contact assembled into the connector. The connector further includes a body of reflowable, electrically conductive material associated adjacent to the connection portion adjacent the exterior side of the housing.04-26-2012
20120103682LEAD FRAME HAVING METAL CUP WITH ENLARGED HEAT-DISSPIATION AREA - A lead frame includes an insulative housing defining a cavity, a plurality of leads mounted with the housing and a metal cup mounted within the housing. Each lead includes contacting section exposed in the cavity. The metal cup includes a bottom plate and an inclined cup wall. The bottom plate is formed with a flange extending outwardly therefrom such that a slot is defined between the flange and the cup wall to receive the resin material of the housing.05-03-2012
20120115367METHOD FOR INTEGRATING AND ERECTING CARBON NANOTUBE COLUMN - A method for integrating and erecting CNT column, comprises following steps of: 1) providing a conductive layer; 2) applying a non-conductive layer over the conductive layer; 3) forming a via on the non-conductive substrate; 4) placing an electrode above the via; 5) deploying dispersive liquid containing CNT powder into the via; 6) applying a predetermined AC electric field between the conductive substrate and the electrode for integrating and erecting the CNT powder into CNT column under electric field force.05-10-2012
20120202384SOCKET CONNECTOR WITH CONTACT TERMINAL HAVING OXIDATION-RETARDING PREPARATION ADJACENT TO SOLDER PORTION PERFECTING SOLDER JOINT - An electrical connector having a fusible element for mounting on a substrate includes an insulative housing and a contact terminal retained in the insulative housing. The contact terminal includes a resilient contacting arm extending beyond a mating face of the insulative housing and a soldering portion for mating with the fusible element. A gelatinous flux is deployed on the fusible element, and/or on the soldering portion, and/or between the fusible element and the soldering portion, and then flux is dried to immovably fix the fusible element with respect to the soldering portion. The dried flux will be re-juvenile to clean and remove an oxidized layer originally existed on the soldering portion so as to achieve robust welding quality. Besides, a method for trimming an electrical connector to have robust welding properties is also disclosed.08-09-2012

Chiu-Hao Cheng, New Taipei TW

Patent application numberDescriptionPublished
20130059661INTERACTIVE VIDEO GAME CONSOLE - An interactive video game console includes a machine base, a control unit, a controller, and an image sensor. A display is provided on the machine base. The controller has a case, two light emitting devices on the case to emit predetermined light, and a motion sensor. The motion sensor is electrically connected to the control unit to sense a motion of the case and transmit it to the control unit. The image sensor senses images of the light emitting devices. The control unit controls the display to show a game image thereon, and a location of the game image on the display is determined by signals from the image sensor, a movement of the game image is determined by signals from the motion sensor.03-07-2013

Jia-Shyong Cheng, New Taipei TW

Patent application numberDescriptionPublished
20120193203CARBON NANOTUBE BASED KEYBOARD - A keyboard includes a first substrate, a second substrate, a first electrode layer and a second electrode layer. The first substrate includes a first upper surface and a first lower surface. The second substrate is located apart from the first substrate and includes a second upper surface and a second lower surface. The second upper surface faces the first lower surface. The first electrode layer is located on the first lower surface and includes a first conductive layer including a carbon nanotube layer structure. The second electrode layer is located on the second upper surface and includes a second conductive layer. A number of keys is located on the first upper surface or the second lower surface.08-02-2012
20120193204CARBON NANOTUBE BASED KEYBOARD - A keyboard includes a first substrate, a second substrate, a first electrode layer, and a second electrode layer. The first substrate includes a first upper surface and a first lower surface opposite the first upper surface. The second substrate is positioned apart from the first substrate and includes a second upper surface and a second lower surface. The second upper surface faces the first lower surface. The first electrode layer is positioned on the first lower surface and includes a number of first conductive layers disposed apart from each other and including a carbon nanotube layer structure. The second electrode layer is positioned on the second upper surface and includes a second conductive layer. A number of keys is positioned on the first upper surface or the second lower surface.08-02-2012
20120193205CARBON NANOTUBE BASED KEYBOARD - A keyboard includes a first substrate, a second substrate, a first electrode layer and a second electrode layer. The first substrate includes a first upper surface and a first lower surface opposite the first upper surface. The second substrate is positioned apart from the first substrate and includes a second upper surface and a second lower surface. The second upper surface faces the first lower surface. The first electrode layer is positioned on the first lower surface and comprises a plurality of first conductive layers disposed apart from each other and including at least one lead wire. The second electrode layer is positioned on the second upper surface and includes a second conductive layer including a carbon nanotube layer structure. A plurality of keys is positioned on the first upper surface or the second lower surface.08-02-2012

Kun-Te Cheng, New Taipei TW

Patent application numberDescriptionPublished
20120002930CABLE ASSEMBLY WITH STRAIN RELIEF MEANS - An cable assembly (01-05-2012
20120147050METHOD OF ENTERING A COMMAND FOR ZOOMING IMAGE SHOWN ON TOUCH SCREEN AND TOUCH SCREEN DEVICE READING SUCH COMMAND - A method for zooming image shown in a touch screen includes reading information of a continuous writing locus formed on the touch screen; selecting a first group of points and a second group of points in the writing locus formed in time sequence; dealing with the first group and second group of points and obtaining a first radius and a second radius; comparing the first radius and the second radius to define a zooming command; executing the zooming command. A touch screen reading such writing locus into zooming command is also provided.06-14-2012

Nien-Tien Cheng, New Taipei TW

Patent application numberDescriptionPublished
20120234901MANUFACTURING METHOD OF A HEAT DISSIPATION DEVICE WITH GUIDING LINES AND SOLDERED HEAT PIPES - An exemplary method of manufacturing a heat dissipation device includes, firstly, providing a heat pipe including a condenser section having a planar outer surface, and providing a heat sink including a supporting surface defining a guiding line. The guiding line has a width smaller than a width of the outer surface of the condenser section. Next, an amount solder is spread on the supporting surface along the guiding line to form a solder layer on the supporting surface. The solder layer has a size not larger than a size of the outer surface of the condenser section. Then the outer surface of condenser section of the heat pipe is attached to the solder layer on the supporting surface of the heat sink.09-20-2012
20120241134HEAT DISSIPATION DEVICE WITH GUIDING LINE AND SOLDERED HEAT PIPE - A heat dissipation device with guiding line and soldered heat pipe includes a heat pipe and a heat sink. The heat pipe includes a condenser section and an evaporator section. The condenser section has a planar outer surface. The heat sink includes a supporting surface contacting the outer surface of the condenser section. A guiding line is defined in the supporting surface for spreading solder therealong. The guiding line has a width smaller than a width of the outer surface of the condenser section. The condenser section of the heat pipe is mounted on the supporting surface of the heat sink along the guiding line and firmly connected to the heat sink by the solder.09-27-2012