Inventors list |
Assignees list |
Classification tree browser |
Top 100 Inventors |
Top 100 Assignees |
Cheng, Kaohsiung City
Chen-San Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110247119 | WELDING MASK - A welding mask includes a mask body formed with a viewing window, and an eye shield assembly including a window frame, a lens and a resilient positioning frame. The window frame is connected to the mask body, surrounds the viewing window, and includes an inwardly projecting stop and an opposing pair of inwardly projecting retaining portions disposed rearwardly of the stop. The lens is disposed removably between the stop and the retaining portions. The positioning frame is disposed removably between the lens and the retaining portions. The positioning frame defines a convex surface facing a direction away from the lens, and abuts against the retaining portions to thereby result in resilient deformation of the positioning frame and enable the positioning frame to press the lens against the stop. | 10-13-2011 |
Chun-An Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110317450 | AC-TO-DC POWER CONVERTING DEVICE - An AC-to-DC power converting device includes: a filter for filtering an external AC input voltage; a rectifier for rectifying the AC input voltage filtered by the filter to output a rectified voltage; a power factor corrector for receiving the rectified voltage from the rectifier to generate a boosted voltage; and a step-down converter for receiving the boosted voltage from the power factor corrector to output a DC output voltage. The power factor corrector includes first and second capacitors connected in series across an output side of the rectifier, a series connection of a first diode, a first inductor, a third capacitor, a second inductor and a second diode coupled to the output side of the rectifier, and first and second switches connected in series across the third capacitor. A common node between the first and second capacitors is coupled to a common node between the first and second switches. | 12-29-2011 |
Chung-Han Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100170726 | ELECTRONIC STYLUS, CAPACITIVE TOUCHPAD MODULE, AND APPARATUS FOR TOUCH INPUT - An electronic stylus emits an excitation signal to apply to a trace of a capacitive touchpad module near a touch point when the electronic stylus touches the capacitive touchpad module, so as to change a waveform of a charging/discharging signal in the trace, and depending on the waveform variation, the capacitive touchpad module can identify the touch point. | 07-08-2010 |
Chun-Min Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100295147 | ISOLATION STRUCTURE AND FORMATION METHOD THEREOF - An isolation structure comprising a substrate is provided. A trench is in the substrate. A sidewall of the trench has a first inclined surface and a second inclined surface. The first inclined surface is located on the second inclined surface. The slope of the first inclined surface is different from the slope of the second inclined surface. A length of the first inclined surface is greater than 15 nanometers. | 11-25-2010 |
| 20110089480 | MEMORY AND MANUFACTURING METHOD THEREOF - A memory having isolated dual memory cells is provided. A first isolation wall and a second isolation wall are separately disposed between a source and a drain on a substrate. An isolation bottom layer and a polysilicon layer are orderly disposed on the substrate between the first and the second isolation walls. A first charge storage structure and a first gate are orderly disposed on the substrate between the first isolation wall and the source. A second charge storage structure and a second gate are orderly disposed on the substrate between the second isolation wall and the drain. A word line disposed on the polysilicon layer, the first gate, the second gate, the first isolation wall and the second isolation wall is electrically connected to the first gate, the second gate and the polysilicon layer. | 04-21-2011 |
| 20120115304 | ISOLATION STRUCTURE AND FORMATION METHOD THEREOF - An isolation structure comprising a substrate is provided. A trench is in the substrate. A sidewall of the trench has a first inclined surface and a second inclined surface. The first inclined surface is located on the second inclined surface. The slope of the first inclined surface is different from the slope of the second inclined surface. A length of the first inclined surface is greater than 15 nanometers. | 05-10-2012 |
Chun-Shen Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20080198531 | CAPACITIVE DEIONIZATION SYSTEM FOR WATER TREATMENT - A capacitive deionization (CDI) system for deionizing water is disclosed. The CDI system comprises at least a flow through capacitor (FTC) module, at least a first supercapacitor, at least a second supercapacitor, at least a third supercapacitor and a controller. The FTC module comprises a plurality electrodes for removing ions from water flowing between the electrodes under an electric field applied between the electrodes. The first supercapacitor is connected between the potential source and the FTC module for amplifying energy provided by the potential source. The second supercapacitor is connected to the FTC module for receiving energy from the FTC module for regenerating the electrodes of the FTC module. The third supercapacitor is adapted for exchanging energy with the FTC module for regenerating the electrodes of the FTC module. The controller is adapted for regulating deionization rate of the water and regeneration of the electrodes of the FTC module. | 08-21-2008 |
Feng Chen Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090046436 | MICRO-ELECTRO-MECHANICAL-SYSTEM PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A MEMS package includes a first board, a second board and a laminate material. The first board includes a lower metallic trace, a metallic diaphragm and a through opening. The lower metallic trace is located on the lower surface of the first board, and the metallic diaphragm is disposed on the lower metallic trace. The second board includes an upper metallic trace and a metallic electrode. The upper metallic trace is located on the upper surface of the second board, the metallic electrode is disposed on the upper metallic trace, and the metallic electrode is corresponding to the metallic diaphragm. The laminate material is disposed between the lower and upper metallic traces, and includes a hollow portion for accommodating the metallic electrode and metallic diaphragm, wherein a sensing unit is formed by the metallic electrode, the hollow portion and the metallic diaphragm, and is corresponding to the through opening. | 02-19-2009 |
Hsiu-Yu Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20080214697 | Reactive organo-modified inorganic particles and biodegradable hybrid material containing the same - A reactive organo-modified inorganic particle. Inorganic particles are modified with functional groups through chemical bonding, ionic bonding, hydrogen bond or complex formation. The functional groups of organo-modified inorganic particle can react with monomer or oligomer of biodegradable materials to facilitate crosslinking and functionalization, thus improving physical properties of the inorganic particle-biodegradable hybrid materials. | 09-04-2008 |
| 20090149570 | Plasticizer, a biodegradable material comprising the plasticizer and application thereof - The present invention relates to a Plasticizer, which is fabricated by mixing monomers of biodegradable polymer with bio-molecules subsequently to deal the mixture with thermal treatment. The Biodegradable material comprising the Plasticizer has high melt index which is contributive for the processing of thermal processing, and the microwave-tolerance and water-resistance of the material makes the material suitable for food packaging. | 06-11-2009 |
| 20120088852 | PLASTICIZER, A BIODEGRADABLE MATERIAL COMPRISING THE PLASTICIZER AND APPLICATION THEREOF - The present invention relates to a Plasticizer, which is fabricated by mixing monomers of biodegradable polymer with bio-molecules subsequently to deal the mixture with thermal treatment. The Biodegradable material comprising the Plasticizer has high melt index which is contributive for the processing of thermal processing, and the microwave-tolerance and water-resistance of the material makes the material suitable for food packaging. | 04-12-2012 |
Hung-Hsiang Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090019692 | METHOD OF CUTTING SIGNAL WIRE PRESERVED ON CIRCUIT BOARD AND CIRCUIT LAYOUT THEREOF - A method of cutting signal wire preserved on circuit board applicable to a circuit layout is provided to reduce signal return loss induced by the preserved wires. The circuit layout has a plurality of preserved wires and a common contact electrically connected to the preserved wires. The cutting method is performed by cutting off one of the preserved wires and disconnecting a break part of the wire from the common contact. | 01-22-2009 |
I-Chi Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090121329 | LEAD FRAME STRUCTURE AND APPLICATIONS THEREOF - A lead frame structure comprises a side rail, a first paddle, a second paddle, a plurality of leads, and an downset anchor bar. The first paddle is connected to the side rail via at least one first tie bar, and the second paddle is connected to the side rail via at least one-second tie bar. The first paddle and the second paddle separated from each other are used to define an area to support a chip. These leads set on the side rail expends toward to the chip supporting area. One end of the downset anchor bar is connected to the side rail, and the other end of the downset anchor bar has a protrusion portion which is between the first paddle and the second paddle and is downset from the side rail. | 05-14-2009 |
I-Lin Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090139429 | CHROME-FREE CORROSION INHIBITOR COMPOSITION - A chrome-free corrosion inhibitor composition includes: titanium chloride; a stabilizer including a mixture of hydrogen peroxide and at least a compound selected from nitric acid, persulfate, nitrate, and chlorate; and a film-forming enhancer selected from monosaccharide, oligosaccharide, polysaccharide, derivatives of saccharide, and combinations thereof. | 06-04-2009 |
Jui-Hung Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110026863 | ROTARY SHAFT ASSEMBLY - A rotary shaft assembly includes: a rotary shaft having an insertion end portion that is disposed co-axially in a hollow base, and rotatable relative to the base; a bearing sleeved on the insertion end portion of the rotary shaft, and partitioning an inner receiving space in the base into a lower oil-storage portion and an upper oil-flow portion; and a stirring member mounted on one end of the insertion end portion and co-rotatable with the rotary shaft. When the rotary shaft rotates, the stirring member stirs lubricating oil in the lower oil-storage portion to urge flow of the lubricating oil from the lower oil-storage portion through a first oil passage unit in one of the base and the bearing, through the upper oil-flow portion and through a second oil passage unit between the bearing and the insertion end portion of the rotary shaft, and back into the lower oil-storage portion. | 02-03-2011 |
Jui-Teng Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110260931 | Antenna Module, and Electronic Apparatus Including the Antenna Module - An antenna module is adapted for disposing in an electronic apparatus that includes first and second housing members and that is operable in a tablet mode, in which the first and second housing members are disposed in a manner that the first housing member overlaps the second housing member. The antenna module includes: a first antenna element to be disposed in the first housing member; and a second antenna element to be disposed in the second housing member, and corresponding substantially in position and proximate to the first antenna element for electromagnetic coupling therewith when the electronic apparatus is operated in the tablet mode. | 10-27-2011 |
Kuen-Chiuan Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100038349 | LASER MARKING METHOD AND LASER MARKING SYSTEM - A laser marking method and a laser marking system are provided. The laser marking method includes the following steps. Firstly, a substrate having at least M pattern lines is provided, wherein M is an integer which is larger than or equal to 1. Next, a laser beam is provided. Then, the laser beam is divided into at least two laser sub-beams including a first laser sub-beam and a second laser sub-beam. Afterwards, the second laser sub-beam is aimed at an (N-M)-th pattern line, and an N-th pattern line is marked by the first laser sub-beam, wherein N is an integer which is larger than or equal to M. | 02-18-2010 |
| 20100225586 | IMPACT FORCE FEEDBACK DEVICE AND INTERACTIVE SYSTEM USING THE SAME - An impact force feedback device and an interactive system using the same are provided, wherein a large impact force feedback is generated to provide a real force feedback sensation to the user. The impact force feedback device includes a housing, a magnet, and at least one actuator assembly. The housing carries the actuator assembly. The actuator assembly includes a guide rod device, a mass, and a coil. The guide rod device is disposed on the housing. The mass is disposed on the guide rod device in a sliding manner. The coil generates an electric field when a current is conducted through it. An electromagnetic force is generated by supplying the current in a direction orthogonal to a magnetic field. The electromagnetic force is supplied to the mass such that the mass moves on the guide rod device and impacts the housing to generate the unidirectional impact force feedback. | 09-09-2010 |
| 20110032188 | INPUT APPARATUS AND OPERATION METHOD THEREOF - An input apparatus including an optical mouse module and a mouse pad module is provided. The optical mouse module includes a light source and an optical sensor. The light source is adapted to emit a light beam. The optical sensor has a sensible distance. The mouse pad module is disposed on the optical mouse module. The mouse pad module includes a sliding sheet elastically coupled to the optical mouse module. The sliding sheet is adapted to move in a three-dimensional space. The optical sensor and the sliding sheet are arranged in an arrangement direction. An operation method of the input apparatus is also provided. | 02-10-2011 |
| 20110032212 | INPUT APPARATUS AND OPERATION METHOD THEREOF - An input apparatus including an optical mouse module and a mouse pad module is provided. The optical mouse module includes a light source and an optical sensor. The light source is adapted to emit a light beam. The optical sensor has a sensible distance. The mouse pad module is disposed on the optical mouse module. The mouse pad module includes a sliding sheet elastically coupled to the optical mouse module. The sliding sheet is adapted to move in a three-dimensional space. The optical sensor and the sliding sheet are arranged in an arrangement direction. An operation method of the input apparatus is also provided. | 02-10-2011 |
| 20110284720 | FLUORESCENCE MICROSCOPY IMAGING SYSTEM - A fluorescence microscopy imaging system is used for detecting a fluorescence signal of a sample, and includes a module for detecting fluorescence and a module for focusing control. The module for detecting fluorescence includes a fluorescence excitation light source generator (FELSG) and a fluorescence detector. The FELSG is capable of generating an excitation light beam having a first wavelength to excite the sample to emit fluorescence. The fluorescence detector is used to read the fluorescence signal of the sample. The module for focusing control generates a servo light beam having a second wavelength. A servo light beam reflecting film disposed on an observation plane is used to reflect the servo light beam. A return beam signal is analyzed using a focusing detection method. An actuator is used to move the objective for focusing, so as to enable the fluorescence excitation light beam to excite the sample to emit fluorescence. | 11-24-2011 |
| 20110304838 | EXPOSURE SYSTEM AND ADJUSTMENT METHOD THEREOF - An exposure system including a first laser light source, a second laser light source, a focusing module, an astigmatism generating element, and a photo detector, and an adjustment method thereof are provided. The first laser light source emits a first laser beam. The second laser light source emits a second laser beam. The focusing module includes a light converging unit disposed on transmission paths of the first laser beam and the second laser beam for projecting the first laser beam and the second laser beam onto a material. The material reflects at least a part of the first laser beam into a first reflective beam. The light converging unit and the astigmatism generating element are disposed on the transmission path of the first reflective beam. The photo detector is disposed on the transmission path of the first reflective beam from the astigmatism generating element. | 12-15-2011 |
Min-Feng Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120015037 | FUNCTIONALIZED NANOPARTICLE, METHOD FOR PREPARING THE SAME AND APPLICATION THEREOF - The present invention relates to a new type of functionalized nanoparticles for drug delivery, comprising a type of polymer nanoparticles, a polymer stabilizer coating, and a drug, wherein said polymer stabilizer coating is coated on the surface of said type of polymer nanoparticles, and said drug is conjugated to said polymer stabilizer coating. The present invention also relates to a method for preparing the nanoparticles; and provides a method for treating an ischemic or degenerative disease, comprising administrating an effective amount of the type of functionalized nanoparticles to a subject. | 01-19-2012 |
Ming-Hsiang Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110156243 | SEMICONDUCTOR PACKAGE - A semiconductor package is provided. The semiconductor package includes an organic substrate, a stiffness layer, and a chip subassembly. The stiffness layer is formed on the organic substrate. The chip subassembly is disposed on the stiffness layer. The chip subassembly includes at least a first chip, a second chip, and a third chip. The second chip is disposed between the first chip and the third chip in a stacked orientation. The first chip, the second chip, and the third chip have the function of proximity communication. | 06-30-2011 |
| 20110156739 | TEST KIT FOR TESTING A CHIP SUBASSEMBLY AND A TESTING METHOD BY USING THE SAME - A test kit for testing a chip subassembly and a testing method by using the same is provided. The chip subassembly includes at least two stacked chips each having a number of electric contacts is provided. The test kit includes a test socket and a test plate. The test socket is configured to electrically engage the electric contacts on a first side of the chip subassembly. The test plate has at least a number of first probes configured for electrically engaging the electric contacts on a second side of the chip subassembly. At least one of the test socket and the test plate has a number of second probes for electrically connecting the test socket and the test plate. | 06-30-2011 |
| 20110227212 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME - A semiconductor device package and a method of fabricating the same are disclosed. The semiconductor device package includes a first substrate, a second substrate, two active chips, a bridge chip and a connection structure. The first substrate has a first surface facing a second surface of the second substrate. The active chips are disposed on and electrically connected to the first surface, and spaced apart from each other by an interval, wherein the active chips respectively have a first active surface. The bridge chip is mechanically and electrically connected to the second surface, and has a second active surface partially overlapped with the first active surfaces of the active chips, such that the bridge chip is used for providing a proximity communication between the active chips. The connection structure is disposed between the first surface and the second surface for combining the first substrate and the second substrate. | 09-22-2011 |
| 20110233749 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME - A semiconductor device package and a method of fabricating the same are disclosed. The semiconductor device package includes a substrate, a first chip, a jumper chip, a plurality of first bonding wires and a plurality of second bonding wires. The substrate has a plurality of contact pads. The first chip is disposed and electrically connected to the substrate via the first bonding wires. The jumper chip is disposed on the first chip and has a plurality of metal pads. Each of the metal pads is electrically connected to two contact pads of the substrate via two second bonding wires, respectively. | 09-29-2011 |
| 20110233764 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME - A semiconductor device package and a method of fabricating the same are disclosed. The semiconductor device package includes a substrate, a buffer structure, two active chips and a bridge chip. The substrate has a cavity, a first surface and a second surface opposite to the first surface. The cavity is extended from the first surface toward the second surface, and the buffer structure is disposed in the cavity. The active chips are mechanically disposed on and electrically connected to the first surface and around the cavity, wherein the active chips both have a first active surface. The bridge chip is disposed in the cavity and above the buffer structure, wherein the bridge chip has a second active surface, the second active surface faces the first active surfaces and is partially overlapped with the first active surfaces, the bridge chip is used for providing a proximity communication between the active chips. | 09-29-2011 |
Pei-Ching Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100035226 | COMPUTERIZED EDUCATION DEVICE, MULTIMEDIA PRODUCTION DEVICE AND ASSOCIATED METHODS TO SUPPORT DISTANCE LEARNING - A computerized education device, a multimedia production device and associated methods in accordance with the present invention provide students with an adaptive and proactive interaction learning environment. The computerized education device allows students to log in and take tests and comprises a computer-based learning platform, a content database, a student database and a processor. The multimedia production device has multiple-user and multiple-tasking capabilities to produce multimedia materials and comprises a managing server and multiple stations. A FLASH component conversion method generates a Flash component without expensive creation work and comprises acts of retrieving content, sampling, generating a small web format file, generating a data model and generating a FLASH quiz. The interacting method changes difficulty of content based on responses of students and comprises acts of qualifying, entertaining and compiling statistics. | 02-11-2010 |
| 20100062410 | COMPUTERIZED TESTING DEVICE WITH A NETWORK EDITING INTERFACE - The computerized testing device with a network editing interface in accordance with the present invention allows a teacher to generate customized quizzes or teaching materials for students logging into the computerized testing device to take tests through a network. The computerized testing device comprises an examination managing module, a content database, a testing module and a recording module. The network editing interface allows teachers to generate quizzes or teaching materials, and comprises a quiz database, a template database, a teacher database and a network editing interface. | 03-11-2010 |
Piin-Tsung Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090078464 | MICROTUNNELING METHOD - A microtunneling method includes: (a) forming a working well; (b) boring a tunnel from the working well through waterjet techniques which use at least one waterjet cutter including a jet seat and a jet nozzle mounted rotatably on the jet seat, the tunnel being bored by moving progressively the jet seat along a circular path and by rotating the jet nozzle relative to the jet seat; (c) removing excavated soil, rocks or gravel from the tunnel; and (d) advancing the waterjet cutter along an axis of the circular path. | 03-26-2009 |
Ping-Kuo Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110155341 | MOLD SET FOR MANUFACTURING CASE AND THE METHOD THEREOF - A mold set for manufacturing a case is provided. The mold set comprises an upper mold having a fluid channel; a lower mold facing the upper mold; and a drawing mold disposed between the upper mold and the lower mold, wherein the mold set has a case forming space formed among the upper mold, the lower mold and the drawing mold, and the mold set has a sharp-edge forming space communicating with the case forming space, and formed between the drawing mold and the lower mold. | 06-30-2011 |
Pin-Tsung Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100144973 | Particulate Rubber Composition - A particulate rubber composition includes a plurality of rubber particles. At least some of the rubber particles have tensile fractured surfaces. The particulate rubber composition is produced by a method that includes disintegrating a cross-linked rubber product to form the rubber particles using a high-speed jets fluid to impinge the cross-linked rubber product. The high-speed jets fluid has a Reynold's number that ranges from 100,000 to 4,000,000. A product including a polymeric matrix material and the particulate rubber composition is also disclosed. | 06-10-2010 |
Po-Feng Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20080240500 | IMAGE PROCESSING METHODS - A method of image processing, the method comprising receiving an image frame including a plurality of pixels, each of the plurality of pixels including an image information, conducting a first extraction based on the image information to identify foreground pixels related to a foreground object in the image frame and background pixels related to a background of the image frame, scanning the image frame in regions, identifying whether each of the regions includes a sufficient number of foreground pixels, identifying whether each of regions including a sufficient number of foreground pixels includes a foreground object, clustering regions including a foreground object into at least one group, each of the at least one group corresponding to a different foreground object in the image frame, and conducting a second extraction for each of at least one group to identify whether a foreground pixel in the each of the at least one group is to be converted to a background pixel. | 10-02-2008 |
Po-Lun Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120094460 | METHOD FOR FABRICATING MOS TRANSISTORS - A method for fabricating a MOS transistor is disclosed. First, a semiconductor substrate having a gate thereon is provided. A spacer is then formed on the sidewall of the gate, and two recesses are formed adjacent to the spacer and within the semiconductor substrate. Next, the spacer is thinned, and epitaxial layer is grown in each of the two recesses. By thinning the spacer before the epitaxial layer is formed, the present invention could stop the epitaxial layer to grow against the sidewall of the spacer, thereby preventing problem such as Ion degradation. | 04-19-2012 |
Po-Sung Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090014313 | Low-energy extractive distillation process for dehydration of aqueous ethanol - An energy-efficient extractive distillation process for producing anhydrous ethanol from aqueous/ethanol feeds containing any range of ethanol employs an extractive distillation column (EDC) that operates under no or greatly reduced liquid reflux conditions. The EDC can be incorporated into an integrated process for producing anhydrous ethanol used for gasoline blending from fermentation broth. By using a high-boiling extractive distillation solvent, no solvent is entrained by the vapor phase to the EDC overhead stream, even under no liquid reflux conditions. The energy requirement and severity of the EDC can be further improved by limiting ethanol recovery in the EDC. In this partial ethanol recovery design, ethanol which remains in the aqueous stream from the EDC is recovered in a post-distillation column or the aqueous stream is recycled to a front-end pre-distillation column where the ethanol is readily recovered since the VLE curve for ethanol/water is extremely favorable for distillation. | 01-15-2009 |
| 20110266134 | Low-Energy Extractive Distillation Process for Dehydration of Aqueous Ethanol - An energy-efficient extractive distillation process for producing anhydrous ethanol from aqueous/ethanol feeds containing any range of ethanol employs an extractive distillation column (EDC) that operates under no or greatly reduced liquid reflux conditions. The EDC can be incorporated into an integrated process for producing anhydrous ethanol used for gasoline blending from fermentation broth. By using a high-boiling extractive distillation solvent, no solvent, is entrained by the vapor phase to the EDC overhead stream, even under no liquid reflux conditions. The energy requirement and severity of the EDC can be further improved by limiting ethanol recovery in the EDC. In this partial ethanol recovery design, ethanol which remains in the aqueous stream from the EDC is recovered in a post-distillation column or the aqueous stream is recycled to a front-end pre-distillation column where the ethanol is readily recovered since the VLE curve for ethanol/water is extremely favorable for distillation. | 11-03-2011 |
Shian-Luen Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120030765 | OPERATION METHOD OF AN ANTI-VIRUS STORAGE DEVICE HAVING A STORAGE DISK AND A READ-ONLY MEMORY - An operation method of an anti-virus storage device having a storage disk and a read-only memory includes connecting the storage device to a host and displaying a single disk name on an interface of an operating system of the host, executing an anti-virus application program corresponding to the operating system, wherein the anti-virus application program is stored in the read-only memory, generating a hidden partition in the storage disk, wherein the hidden partition comprises an anti-virus engine and a virus pattern, and starting up the anti-virus engine, enabling a main storage partition and only displaying a disk name of the main storage partition on the interface of the operating system. If the anti-virus application program has no an execution file corresponding to the operating system, a user using the anti-virus storage device decides whether enables and displays the main storage partition without executing the anti-virus application program. | 02-02-2012 |
Shih-Chieh Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110193756 | WIRELESS NETWORK RECEIVER - A wireless network receiver includes a circuit board and a connector structure. The connector structure is fixed on the circuit board, and the connector structure includes a connector and an antenna. The antenna, crossing the circuit board, and the connector are integrally formed with as a whole. The antenna includes a feeding connecting member, a horizontal radiator, a vertical radiator and a grounding connecting member. The horizontal radiator generates a horizontally polarized wave and is connected to the feeding connecting member. The vertical radiator generates a vertically polarized wave and is connected to the horizontal radiator. The grounding connecting member connects the horizontal radiator to the connector. | 08-11-2011 |
Shih-Hsien Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120086433 | MEMS-BASED CURRENT SENSING APPARATUS - The invention discloses an MEMS-based current sensing apparatus including: a flexible substrate joined onto an conducting wire; a sensing unit formed of an MEMS structure and disposed on the flexible substrate, the sensing unit outputting a response to a electromagnetic field induced by a current flowing in the conducting wire; and a readout circuit disposed on the flexible substrate and coupled to the sensing unit, the readout circuit monitoring the response to the electromagnetic field and calculating the amount of the current flow. | 04-12-2012 |
Shih-Hsun Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120130053 | SOLID PHASE GOLD NANOPARTICLE SYNTHESIS - A method of synthesizing ligand-conjugated gold nanoparticles (AuNPs) is disclosed. The method comprises: a) providing an amine-modified silica particle; b) providing a solution comprising Au | 05-24-2012 |
Tian-Lu Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120015380 | ANTI-POLYETHYLENE GLYCOL ANTIBODY EXPRESSING CELL QUANTIFY ANY FREE POLYETHYLENE GLYCOL AND POLYETHYLENE GLYCOL-DERIVATIZED MOLECULES - In this invention, anti-PEG antibodies or anti-methoxyl-PEG (anti-CH | 01-19-2012 |
Tsung-Hsin Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100098561 | Small Sized Heat Dissipating Fan - A small sized heat dissipating fan comprises a housing, a stator and a rotor. The housing includes a carrying base to hold the stator and rotor. The stator includes a magnetizing member having a plurality of coils, and a circuit board electrically connecting to the coils and having a driving circuit and a speed adjuster. The driving circuit, the speed adjuster and the coils electrically connect to each other. The rotor includes a shaft, an impeller fixed to one end of the shaft, and an annular magnet. The other end of the shaft extends through the magnetizing member. The shaft is rotatably coupled to the stator. The annular magnet is mounted to an inner periphery of the impeller and faces the magnetizing member of the stator. Consequently, by adjustment of resistance of the speed adjuster, the rated rotational speed of the heat dissipating fan can be changed. | 04-22-2010 |
Tung-Chen Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100139070 | Device and A Method Thereof for Producing A Patterned Plate - A device for producing a patterned plate from a tubular work piece is disclosed wherein walls of the tubular work piece comprise at least one forming surface. The device comprises a die and an electromagnetic actuator, wherein the die comprises a patterned surface with a pattern formed thereon and a fracturing part. The tubular work piece is disposed between the die and the electromagnetic actuator such that the walls of the tubular work piece correspond to walls of the die, and the forming surface corresponds to the patterned surface. When the electromagnetic actuator is supplied with a current pulse, an eddy current is induced in the tubular work piece, generating a repulsive force between the electromagnetic actuator and the tubular work piece. Therefore, the tubular work piece impacts the die, and the forming surface is deformed against the patterned surface and the fracturing part, thus replicating the pattern of the patterned surface onto the forming surface. At the same time, the tubular work piece is fractured at the position corresponding to the fracturing part. A method for producing a patterned plate from a tubular work piece is also disclosed. | 06-10-2010 |
| 20100147043 | Device for Producing Patterns - A device for producing a pattern onto a work piece is disclosed. The device comprises a die, an electromagnetic actuator and a base; wherein the die comprises a patterned surface and the patterned surface comprises a pattern. The electromagnetic actuator comprises an plate body, a convex part and a strip unit connected to the plate body; the electromagnetic actuator is disposed in the base. When the electromagnetic actuator is activated while a work piece is being positioned between the patterned surface and the electromagnetic actuator, an inductive current is generated on the work piece by the electromagnetic actuator, and then a repulsive force is generated between the electromagnetic actuator and the work piece. The repulsive force then causes the work piece to adhere to the patterned surface, forcing the work piece to deform against the patterned surface and to take on the shape of the pattern. | 06-17-2010 |
Wei-Lun Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100044843 | ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - The advanced quad flat non-leaded package structure includes a carrier, a chip, a plurality of wires, and a molding compound. The carrier includes a die pad and a plurality of leads. The leads include first leads disposed around the die pad, second leads disposed around the first leads and at least an embedded lead portion between the first leads and the second leads. The wires are disposed between the chip, the first leads and the embedded lead portion. The advanced quad flat non-leaded package structures designed with the embedded lead portion can provide better electrical connection. | 02-25-2010 |
| 20100044850 | ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - An advanced quad flat non-leaded package structure includes a carrier, a chip and a molding compound. The carrier includes a die pad and a plurality of leads. The die pad has a central portion, a peripheral portion disposed around the central portion and a plurality of connecting portions connecting the central portion and the peripheral portion. The central portion, the peripheral portion, and the connecting portions define at least two hollow regions. The leads are disposed around the die pad. The chip is located within the central portion of the die pad and electrically connected to the leads via a plurality of wires. The molding compound encapsulates the chip, the wires, inner leads and a portion of the carrier. | 02-25-2010 |
| 20100258920 | MANUFACTURING METHOD OF ADVANCED QUAD FLAT NON-LEADED PACKAGE - The manufacturing method of advanced quad flat non-leaded packages includes performing a pre-cutting process prior to the backside etching process for defining the contact terminals. The pre-cutting process ensures the isolation of individual contact terminals and improves the package reliability. | 10-14-2010 |
| 20100258921 | ADVANCED QUAD FLAT-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - The advanced quad flat non-leaded package structure includes a carrier, a chip, a plurality of wires, and a molding compound. The carrier includes a die pad and a plurality of leads. The inner leads of the leads electively have a plurality of locking grooves for enhancing the adhesion between the inner leads and the surrounding molding compound. | 10-14-2010 |
| 20100258934 | ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - The advanced quad flat non-leaded package structure includes a carrier having a die pad and a plurality of leads, at least a chip, a plurality of wires, and a molding compound. The rough surface of the carrier enhances the adhesion between the carrier and the surrounding molding compound. | 10-14-2010 |
| 20120119342 | ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - The advanced quad flat non-leaded package structure includes a carrier, a chip, a plurality of wires, and a molding compound. The carrier includes a die pad and a plurality of leads. The inner leads of the leads are designed to possess incurved sidewalls for enhancing the adhesion between the inner leads and the surrounding molding compound. | 05-17-2012 |
Wei-Ming Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100031502 | METHOD FOR FABRICATING BLIND VIA STRUCTURE OF SUBSTRATE - A method for fabricating a blind via structure of a substrate is provided. First, a substrate is provided, which includes a conductive layer, a metal layer, and a dielectric layer disposed between the conductive layer and the metal layer. Next, a cover layer is formed on the conductive layer. Finally, the substrate formed with the cover layer is irradiated by a laser beam to form at least one blind via structure extending from the cover layer to the metal layer. The blind via structure includes a first opening, a second opening, and a third opening linking to one another. The first opening passes through the cover layer. The second opening passes through the conductive layer. The third opening passes through the dielectric layer. For example, a size of the first opening is greater than a size of the second opening and a size of the third opening. | 02-11-2010 |
| 20100038124 | EMBEDDED STRUCTURE AND METHOD FOR MAKING THE SAME - An embedded structure of circuit board is provided. The embedded structure includes a substrate, a first patterned conductive layer disposed on the substrate and selectively exposing the substrate, a first dielectric layer covering the first patterned conductive layer and the substrate, a pad opening disposed in the first dielectric layer, and a via disposed in the pad opening and exposing the first patterned conductive layer, wherein the outer surface of the first dielectric layer has a substantially even surface. | 02-18-2010 |
| 20100065324 | EMBEDDED STRUCTURE AND METHOD FOR MAKING THE SAME - An embedded structure of circuit board is provided. The embedded structure of the present invention includes a dielectric layer, a pad opening disposed in the dielectric layer, and a via disposed in the pad opening and in the dielectric layer, wherein the outer surface of the dielectric layer has a substantially even surface. | 03-18-2010 |
| 20110094778 | CIRCUIT BOARD AND FABRICATION METHOD THEREOF - A method for fabricating a circuit board is provided. A non-conductive material layer is provided on a core substrate, wherein the non-conductive material layer comprises a dielectric material and catalytic particles. A recessed circuit structure is then formed in the non-conductive material layer with a laser beam. Simultaneously, the catalytic particles in the recessed circuit structure are activated with aid of the laser. A buried conductive structure is then formed in the recessed circuit structure by chemical copper deposition methods. | 04-28-2011 |
| 20110147339 | METHOD FOR MANUFACTURING WIRING STRUCTURE OF WIRING BOARD - A method for manufacturing a wiring structure of a wiring board is provided. In the method, a substrate including an insulation layer and a film disposed on the insulation layer is provided. Next, a barrier layer completely covering the film is formed. Next, an intaglio pattern partially exposing the insulation layer is formed on an outer surface of the barrier layer. Next, an activated layer is formed on the outer surface and in the intaglio pattern. Then, the activated layer on the outer surface is removed, and the activated layer in the intaglio pattern is remained. After the activated layer on the outer surface is removed, a conductive material is formed in the intaglio pattern by using a chemical deposition method. After forming the conductive material, the barrier layer and the film are removed. | 06-23-2011 |
| 20110147342 | METHOD FOR FABRICATING WIRING STRUCTURE OF WIRING BOARD - A method for fabricating a wiring structure of a wiring board is provided. First, a substrate including an insulation layer and a film disposed on the insulation layer is provided. Next, an intaglio pattern exposing the insulation layer is formed on an outer surface of the film. The intaglio pattern is formed by removing a portion of the insulation layer and a portion of the film. Next, an activated layer is formed on the outer surface and in the intaglio pattern. The activated layer completely covers the outer surface and all surfaces of the intaglio pattern. Then, the film and the activated layer on the outer surface are removed, and the activated layer in the intaglio pattern is remained. After the film and the activated layer on the outer surface are removed, a conductive material is formed in the intaglio pattern by chemical deposition method. | 06-23-2011 |
| 20120085569 | EMBEDDED STRUCTURE - An embedded structure of circuit board is provided. The embedded structure includes a substrate, a first patterned conductive layer disposed on the substrate and selectively exposing the substrate, a first dielectric layer covering the first patterned conductive layer and the substrate, a pad opening disposed in the first dielectric layer, and a via disposed in the pad opening and exposing the first patterned conductive layer, wherein the outer surface of the first dielectric layer has a substantially even surface. | 04-12-2012 |
Wood-Hi Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090129622 | MEMS MICROPHONE MODULE AND MANUFACTURING PROCESS THEREOF - A micro-electro-mechanical system (MEMS) microphone module and a manufacturing process thereof are described. A thickness of a transparent temporary cover plate temporarily disposed in a conventional plastic package structure is adjusted. After a mold for a plastic protector is formed, an UV ray is utilized to irradiate the mold to reduce adherence on the temporary cover plate and a back surface of the MEMS acoustic wave sensing chip. Then, the temporary cover plate is removed, and the left space left is the main source for the back-volume of the MEMS microphone. Finally, a tag is covered on the plastic protector, so as to define the whole back-volume and form a closed back-volume. In the above-mentioned process, the size of the back-volume is the same as an area of the whole MEMS microphone chip. In addition, the back-volume can be defined. | 05-21-2009 |
Yao-Yu Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110144496 | IMAGING METHOD FOR MICROCALCIFICATION IN TISSUE AND IMAGING METHOD FOR DIAGNOSING BREAST CANCER - An imaging method for microcalcification displays microcalcification distribution by acquiring and overlapping a photoacoustic image of microcalcification and an ultrasonic image of tissue. The image acquired by the present invention, in comparison to images acquired by ultrasonic and X-ray mammography, has advantages in no speckle noises, higher optical contrast, higher ultrasonic resolution, and so on. The present invention also has advantage in safety by adopting a light source having no ionizing radiation. An imaging method for diagnosing breast cancer is also herein disclosed. | 06-16-2011 |
Ying Sui Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120113350 | BACK FRAME AND DISPLAY DEVICE HAVING THE SAME - The present invention is related to a back frame of a display device. The back frame includes a frame piece and a fixing member having a first portion, a second portion, and a third portion. The first portion extends toward the inside of the back frame. The second portion extends from the first portion and connects with the third portion, fixing a printed circuit board to prevent other internal connecting interfaces from loosening due to the printed circuit board shifting. | 05-10-2012 |
Yi-Ting Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090197011 | METHOD FOR MANUFACTURING A SUBSTRATE WITH SURFACE STRUCTURE BY EMPLOYING PHOTOTHERMAL EFFECT - A method for manufacturing a substrate with surface substrates by employing photothermal effect is described. Nanoparticles on the surface of the substrate excited by a beam convert light energy to thermal energy. The surface structure on the substrate is formed through the thermal energy generated by the excited nanoparticles. The substrate with plural pores is thus formed. | 08-06-2009 |
| 20090269505 | METHOD FOR MANUFACTURING A SUBSTRATE WITH SURFACE STRUCTURE BY EMPLOYING PHOTOTHERMAL EFFECT - A method for manufacturing a substrate with a surface substrate by employing photothermal effect is described. Nanoparticles on the surface of the substrate excited by a beam convert light energy to thermal energy. The surface structure on the substrate is formed through the thermal energy generated by the excited nanoparticles. The substrate with a layer of the predetermined pattern is thus formed. | 10-29-2009 |
| 20120009353 | METHOD FOR MANUFACTURING A SUBSTRATE WITH SURFACE STRUCTURE BY EMPLOYING PHOTOTHERMAL EFFECT - A manufacturing method for manufacturing a substrate with a surface substrate by employing photothermal effect is described. Nanoparticles on the surface of the substrate excited by a beam convert light energy to thermal energy. The surface structure on the substrate is formed through the thermal energy generated by the excited nanoparticles. The substrate with a layer of the predetermined pattern is thus formed. | 01-12-2012 |
Y Lin Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110047779 | METHOD FOR MAKING MOLDS WITH 3-DIMENSIONAL COOLING PATHS - A method for making molds with curved cooling paths includes a step of obtaining a drawing of a mold by using computers and the drawing including the positions of concavities, cooling paths and reference points; a step of manufacturing the mold by way of pour casting according to the drawing so as to obtain a mold having the concavities, the cooling paths and the reference points, and a step of trimming the concavities of the mold according to the reference points and opening two ends of each of the cooling paths to obtain a final mold. | 03-03-2011 |
Yong-Hua Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090172181 | MULTIMEDIA DATA SHARING SYSTEM AND METHOD FOR MOST NETWORK - A multimedia data sharing system and method for a MOST network is disclosed. The system provides a service management module, a data link control module, and a protocol conversion module. The service management module provides state analysis and management for all services of the multimedia data sharing system and records analyzed service states and configuration results in a service management list. The data link control module performs a control and management process for system data streams based on information stored in the service management list. The protocol conversion module retrieves data from a channel register, based on the information stored in the service management list, to perform a MOST link management operation and implements a packaged or an unpackaged operation to data packets for access of the MOST network. | 07-02-2009 |
Yu-Hsiang Cheng, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110234539 | Device and Method of Identifying Position of Determinant via Combining Optical Image with Single Axis of Touch Panel - A device and method of identifying the position of a determinant via combining optical image with a single axis of touch panel includes sensing identification of any single axis via only one image sensor module provided at a side or outside the work area for retrieving images and combining with the identification device of the touch panel in the work area, then, calculating the relative position of the determinant through the triangulating relationship and the formula x×tan θ=y in response to retrieved images and identified information from the touch panel. | 09-29-2011 |
| 20110273385 | Sensing Structure and Method of Touch Spot of Resistive Touch Panel - A sensing structure and method for a touch spot of a resistive touch panel, includes a first conducting layer, with a frame of the first conducting layer defined as an X-axis, a plurality of parallel first resistance detecting lines designed towards Y-axis; and a second conducting layer coincident with the first conductive layer, and a plurality of second resistance detecting lines with certain slope angles on the second conducting layer. The plural second resistance detecting lines intersect plural first resistance detecting lines to form interlacing and fixed blocks. In response to a screen touch, the position of the Y-axis of the second resistance detecting line is used in a triangulation calculation. | 11-10-2011 |