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Cheng-Ju
Cheng-Ju Chuang, Hsin-Chu City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110096268 | BACKLIGHT MODULE WITH AN IMPROVEMENT SOCKET TO FIX A LAMP TUBE AND LCD USING THE SAME - A backlight module includes a bezel, a lamp tube for generating light in response to a driving signal, and a lamp socket disposed on the bezel for holding the lamp tube. The lamp tube includes a lamp body and a connecting terminal. The lamp socket includes a lamp holder and a conductive element. The lamp holder includes an accommodating space for accommodating part of the lamp body and the connecting terminal of the lamp tube. The conductive element includes a first connector having a pair of attaching members on the top of the conductive element, and a second connector for electrically connected to the inverter. The attaching members contact the connecting terminal so as to form a path to deliver driving signal from the inverter to the connecting terminal of the lamp tube through the conductive element. Part of the conductive element is enclosed and is secured by the lamp holder. | 04-28-2011 |
Cheng-Ju Tsai, Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090020790 | METHOD FOR FABRICATING POLYSILICON FILM, A GAS PHASE DEPOSITION APPARATUS AND AN ELECTRONIC DEVICE FORMED THEREBY - A method of directly depositing a polysilicon film at a low temperature is disclosed. The method comprises providing a substrate and performing a sequential deposition process. The sequential deposition process comprises first and second deposition steps. In the first deposition step, a first bias voltage is applied to the substrate, and plasma chemical vapor deposition is utilized to form a first polysilicon sub-layer on the substrate. In the second deposition step, a second bias voltage is applied to the substrate, and plasma chemical vapor deposition is utilized to form a second polysilicon sub-layer on the first sub-layer. The first and second sub-layers constitute the polysilicon film, and the first bias voltage differs from the second bias voltage. | 01-22-2009 |
| 20090184321 | MICROCRYSTALLINE SILICON THIN FILM TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME - This invention provides a top-gate microcrystalline thin film transistor and a method for manufacturing the same. An inversion layer channel is formed in a top interface of a microcrystalline active layer, and being separated from an incubation layer in a bottom interface of the microcrystalline active layer. The inversion layer channel is formed in the crystallized layer of the top interface of the microcrystalline active layer. As such, the present microcrystalline thin film transistor has better electrical performance and reliability. | 07-23-2009 |
Cheng-Ju Tsai, Hsin Chu Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20090029532 | Method for forming a microcrystalline silicon film - This invention provides a method for forming a microcrystalline silicon film, which employs a three-stage deposition process to form a microcrystalline film. A microcrystalline silicon seed layer is formed on a substrate. Gaseous ions are used to bombard a surface of the microcrystalline silicon seed layer. Microcrystalline silicon is formed on the microcrystalline silicon seed layer after the bombardment to a predetermined thickness. | 01-29-2009 |
Cheng-Ju Wu, Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100264911 | SYSTEM FOR TESTING ELECTROMAGNETIC CHARACTERISTICS OF AN ELECTROMAGNETIC STEEL SHEET IN RESPONSE TO A NON-SINUSODIAL WAVE CONTROL SIGNAL - A system for testing electromagnetic characteristics of an electromagnetic steel sheet includes: a driving unit operable based on a non-sinusoidal wave control signal from a control unit and a floating voltage to output a control output; a power output unit operable based on the control output from the driving unit to output a voltage output at an output side coupled across a first winding wound around the electromagnetic steel sheet such that an exciting current flowing through the first winding is generated in response to the voltage output, thereby resulting in an induced voltage across a second winding wound around the electromagnetic steel sheet; and a measuring unit outputting to the control unit an output corresponding to the exciting current and the induced voltage measured thereby such that the control unit obtains the electromagnetic characteristics of the electromagnetic steel sheet based on the output. | 10-21-2010 |
| 20100283569 | ELECTROMAGNETIC WINDING ASSEMBLY - An electromagnetic winding assembly includes first and second housing halves and first and second conductive units provided on the first and second housing halves, respectively. The first and second housing halves are detachably connected to each other so as to define cooperatively a core-receiving space therebetween and to connect electrically the first conductive unit with the second conductive unit such that the first conductive unit cooperates with the second conductive unit to form at least one coil-like electrical conductor configured to be wound around a core received in the core-receiving space. | 11-11-2010 |
Cheng-Ju Yang, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20080289378 | Wafer-type tumbler cylinder and key - A wafer-type tumbler cylinder comprises a sleeve, a cylinder, some wafers, and some springs. A shaft of the cylinder includes a first and a second semicircular columnar body. The first semicircular columnar body includes a front flanges, a rear drive section and a U-shaped indentation at the inner lateral surface that provides for insertion into the second semicircular columnar body. On the first and second semicircular columnar bodies, one or more slots are disposed to fasten with the wafers. A relatively wider rectangular notch is disposed between the inner sides of every two slots, which are respectively installed with a wafer; only one spring is positioned in the wider rectangular notch, thereby serving as a shared spring for every two wafers. The material cost of a spring is saved; besides, it's able to prevent from prying effectively because a burglar cannot pry two wafers supported by a shared spring. | 11-27-2008 |
| 20100300164 | Wafer-type Tumbler Cylinder - A wafer-type tumbler cylinder comprises a sleeve, a cylinder, some wafers, some springs, some riveting plates and some U-shaped fixtures. The wafer-type tumbler cylinder is an integral cylindrical shaft having U-shaped indentations and riveting plates made in a consistent operation. After the placement of every two wafers and one shared spring into the cylindrical shaft, the riveting plates are pressed into a horizontal position to secure the wafers spring; furthermore, all the riveting plates are installed on the left or right side, or on both sides. The improved structure of riveting plates and shared spring for every two wafers enables the key to move forward and backward smoothly, and also enables the users to lock and unlock easily and successfully. | 12-02-2010 |