Patent application number | Description | Published |
20100254209 | Ultra-Low Leakage Memory Architecture - An integrated circuit structure includes an active power supply line and a data-retention power supply line. A memory macro is connected to the active power supply line and the data-retention power supply line. The memory macro includes a memory cell array and a switch. The switch is configured to switch a connection between connecting the memory cell array to the active power supply line and connecting the memory cell array to the data-retention power supply line. The data-retention power supply line is outside of the memory macro. | 10-07-2010 |
20100315859 | Eight-Transistor SRAM Memory with Shared Bit-Lines - An integrated circuit structure includes a first static random access memory (SRAM) cell including a first read-port and a first write-port; and a second SRAM cell including a second read-port and a second write-port. The first SRAM cell and the second SRAM cell are in a same row and arranged along a row direction. A first word-line is coupled to the first SRAM cell. A second word-line is coupled to the second SRAM cell. A read bit-line is coupled to the first SRAM cell and the second SRAM cell, wherein the read bit-line extends in a column direction perpendicular to the row direction. A write bit-line is coupled to the first SRAM cell and the second SRAM cell. | 12-16-2010 |
20110007596 | Low-Leakage Power Supply Architecture for an SRAM Array - A method of forming an integrated circuit structure includes providing a chip; forming a static random access memory (SRAM) cell including a transistor on the chip; and forming a bias transistor configured to gate a power supply voltage provided to the SRAM cell on the chip. The bias transistor and the transistor of the SRAM cell are formed simultaneously. | 01-13-2011 |
20110085399 | Method for Extending Word-Line Pulses - An integrated circuit includes a positive power supply node, a current tracking circuit, and a current mirroring circuit including a plurality of current paths coupled in parallel. The currents of the plurality of current paths mirror a current of the current tracking circuit. The current mirroring circuit is configured to turn off the plurality of current paths one-by-one in response to a reduction in a positive power supply voltage on the positive power supply node. The integrated circuit further includes a charging node receiving a summation current of the plurality of current paths, wherein a voltage on the charging node is configured to increase through a charging of the summation current. | 04-14-2011 |
20120153433 | Tuning the Efficiency in the Transmission of Radio-Frequency Signals Using Micro-Bumps - A device includes a die including a main circuit and a first pad coupled to the main circuit. A work piece including a second pad is bonded to the die. A first plurality of micro-bumps is electrically coupled in series between the first and the second pads. Each of the plurality of micro-bumps includes a first end joining the die and a second end joining the work piece. A micro-bump is bonded to the die and the work piece. The second pad is electrically coupled to the micro-bump. | 06-21-2012 |
20120213010 | Asymmetric Sense Amplifier Design - A circuit includes a first inverter including a first PMOS transistor and a first NMOS transistor, and a second inverter including a second PMOS transistor and a second NMOS transistor. A first node is connected to gates of the first PMOS transistor and the first NMOS transistor and drains of the second PMOS transistor and the second NMOS transistor. A second node is connected to gates of the second PMOS transistor and the second NMOS transistor and drains of the first PMOS transistor and the first NMOS transistor. The circuit further includes a first capacitor having a first capacitance connected to the first node; and a second capacitor having a second capacitance connected to the second node. The second capacitance is greater than the first capacitance. | 08-23-2012 |
20120230127 | Providing Row Redundancy to Solve Vertical Twin Bit Failures - A circuit includes a failure address register configured to store a first row address, a row address modifier coupled to the failure address register, wherein the row address modifier is configured to modify the first row address received from the failure address register to generate a second row address. A first comparator is configured to receive and compare the first row address and a third row address. A second comparator is configured to receive and compare the second row address and the third row address. The first and the second row addresses are failed row addresses in a memory. | 09-13-2012 |
20130003446 | Method for Extending Word-Line Pulses - An integrated circuit includes a positive power supply node, a current tracking circuit, and a current mirroring circuit including a plurality of current paths coupled in parallel. The currents of the plurality of current paths mirror a current of the current tracking circuit. The current mirroring circuit is configured to turn off the plurality of current paths one-by-one in response to a reduction in a positive power supply voltage on the positive power supply node. The integrated circuit further includes a charging node receiving a summation current of the plurality of current paths, wherein a voltage on the charging node is configured to increase through a charging of the summation current. | 01-03-2013 |
20130161707 | Resistive Memory and Methods for Forming the Same - A device includes an active region formed of a semiconductor material, a gate dielectric at a surface of the active region, and a gate electrode over the gate dielectric. A first source/drain region and a second source/drain region are on opposite sides of the gate electrode. A Contact Etch Stop Layer (CESL) is over the first and the second source/drain regions. An Inter-Layer Dielectric (ILD) includes a top surface substantially level with a top surface of the gate electrode. A first contact plug is over and electrically connected to the first source/drain region. A second contact plug is over and aligned to the second source/drain region. The second contact plug and the second source/drain region are spaced apart from each other by a portion of the first CESL to form a capacitor. | 06-27-2013 |
20130235687 | Asymmetric Sense Amplifier Design - A circuit includes a first inverter including a first PMOS transistor and a first NMOS transistor, and a second inverter including a second PMOS transistor and a second NMOS transistor. A first node is connected to gates of the first PMOS transistor and the first NMOS transistor and drains of the second PMOS transistor and the second NMOS transistor. A second node is connected to gates of the second PMOS transistor and the second NMOS transistor and drains of the first PMOS transistor and the first NMOS transistor. The circuit further includes a first capacitor having a first capacitance connected to the first node; and a second capacitor having a second capacitance connected to the second node. The second capacitance is greater than the first capacitance. | 09-12-2013 |
20130277794 | Tuning the Efficiency in the Transmission of Radio-Frequency Signals Using Micro-Bumps - A device includes a die including a main circuit and a first pad coupled to the main circuit. A work piece including a second pad is bonded to the die. A first plurality of micro-bumps is electrically coupled in series between the first and the second pads. Each of the plurality of micro-bumps includes a first end joining the die and a second end joining the work piece. A micro-bump is bonded to the die and the work piece. The second pad is electrically coupled to the micro-bump. | 10-24-2013 |
20140185394 | Memory with Bit Cell Header Transistor - A memory includes a plurality of bit cells. Each bit cell includes a bit line and a storage cell coupled to the bit line. A header PMOS transistor is coupled to the storage cell in each bit cell. The header PMOS transistor is at least partially turned off during a write operation by a header control signal. | 07-03-2014 |