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Cheng-Hsu
Cheng-Hsu Hsiao, Nantou TW
| Patent application number | Description | Published |
|---|---|---|
| 20080258294 | Heat-dissipating semiconductor package structure and method for manufacturing the same - A heat-dissipating semiconductor package structure and a method for manufacturing the same is disclosed. The method includes: disposing on and electrically connecting to a chip carrier at least a semiconductor chip and a package unit; disposing on the top surface of the package unit a heat-dissipating element having a flat portion and a supporting portion via the flat portion; receiving the package unit and semiconductor chip in a receiving space formed by the flat portion and supporting portion of the heat-dissipating element; and forming on the chip carrier encapsulant for encapsulating the package unit, semiconductor chip, and heat-dissipating element. The heat-dissipating element dissipates heat generated by the package unit, provides EMI shielding, prevents delamination between the package unit and the encapsulant, decreases thermal resistance, and prevents cracking. | 10-23-2008 |
Cheng-Hsu Hsiao, Nanto City TW
| Patent application number | Description | Published |
|---|---|---|
| 20080213980 | Process Applied to Semiconductor - A process applied to grinding, dicing, and/or stacking semiconductors is disclosed. One of its features is that after transparent material is stuck on its active surface, a semiconductor is ground from another surface thereof to become thinner, then take advantage of transparency of the transparent material to cut the transparent material and the semiconductor, to obtain at least one smaller semiconductor unit such as die or chip. Another feature is that the transparent material remains sticking to the active surface of the die by an adhesion layer until the die is attached to a carrier or another die, and then the transparent material and the adhesion layer are removed by taking advantage of a function of the adhesion layer: receiving a ray to lose adhesion between it and the active surface. Preferably the ray reaches the adhesion layer via the transparent material stuck on the active surface of the die. | 09-04-2008 |
Cheng-Hsu Wu, Chu-Tung Town TW
| Patent application number | Description | Published |
|---|---|---|
| 20100165704 | Circuit and Method for a High Speed Memory Cell - A memory cell is disclosed, including a write access transistor coupled between a storage node and a write bit line, and active during a write cycle responsive to a voltage on a write word line; a read access transistor coupled between a read word line and a read bit line, and active during a read cycle responsive to a voltage at the storage node; and a storage capacitor coupled between the read word line and the storage node. Methods for operating the memory cell are also disclosed. | 07-01-2010 |
Cheng-Hsu Yang, Jung-He City TW
| Patent application number | Description | Published |
|---|---|---|
| 20120026044 | MODIFICATION ON MONOPOLE ANTENNA - A monopole antenna is disposed on a substrate including a first surface and a second surface. The monopole antenna includes a feeding point, a radiation unit, and a reflecting element. The radiation unit is disposed on the first surface of the substrate, and includes a feeding section, a first radiation section, a second radiation section, and a third radiation section. The feeding section, the first radiation section, and the second radiation section are connected sequentially. The feeding point is electrically connected to the feeding section. The second radiation section and the feeding section are respectively placed at two sides of a longitudinal axis of the first radiation section. The third radiation section is electrically connected to the first radiation section. The reflecting element is disposed on the second surface of the substrate, and corresponds to a position of the second radiation section. | 02-02-2012 |